MULTI-RANK TOPOLOGY OF MEMORY MODULE AND ASSOCIATED CONTROL METHOD

    公开(公告)号:US20180322914A1

    公开(公告)日:2018-11-08

    申请号:US15959303

    申请日:2018-04-23

    Applicant: MEDIATEK INC.

    Abstract: The present invention provides a memory module wherein the memory module includes a plurality of memory devices having at least a first memory device and a second memory device, and the first memory device comprises a first termination resistor, and the second memory device comprises a second termination resistor. In the operations of the memory module, when the first memory device is accessed by a memory controller and the second memory device is not accessed by the memory controller, the first termination resistor is controlled to not provide impedance matching for the first memory device, and the second termination resistor is controlled to provide impedance matching for the second memory device.

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