Manufacturing method of semiconductor laser with non-absorbing mirror
structure
    1.
    发明授权
    Manufacturing method of semiconductor laser with non-absorbing mirror structure 失效
    具有非吸收镜结构的半导体激光器的制造方法

    公开(公告)号:US5181218A

    公开(公告)日:1993-01-19

    申请号:US619606

    申请日:1990-11-29

    摘要: An InGaAlP NAM structure laser is formed with a double-heterostructure section disposed on an n-type GaAs substrate. The double-heterostructure section includes a first cladding layer of n-type InGaAlP, a non-doped InGaP active layer, and a second cladding layer of p-type InGaAlP. An n-type GaAs current-blocking layer having a stripe opening and a p-type GaAs contact layer are sequentially formed on the second cladding layer by MOCVD crystal growth. A low-energy band gap region is defined in a central region of the active layer located immediately below the stripe opening. A high-energy band gap region is defined in a peripheral region of the active layer corresponding to a light output end portion of the laser and located immediately below the current-blocking layer. Therefore, self absorption of an oscillated laser beam at the output end portion can be reduced or prevented.

    摘要翻译: InGaAlP NAM结构激光器形成有设置在n型GaAs衬底上的双异质结构部分。 双异质结构部分包括n型InGaAlP的第一包层,未掺杂的InGaP有源层和p型InGaAlP的第二包层。 通过MOCVD晶体生长,在第二覆层上依次形成具有条形开口和p型GaAs接触层的n型GaAs电流阻挡层。 在位于条形开口正下方的活性层的中心区域中限定低能带隙区域。 在活性层的与激光的光输出端部对应的周边区域中限定高能带隙区域,位于电流阻挡层的正下方。 因此,可以减少或防止在输出端部处的振荡的激光束的自吸收。

    Semiconductor device for passing current between a GaAs layer and an
InGaAlP layer
    9.
    发明授权
    Semiconductor device for passing current between a GaAs layer and an InGaAlP layer 失效
    用于在GaAs层和InGaAlP层之间传导电流的半导体器件

    公开(公告)号:US5138404A

    公开(公告)日:1992-08-11

    申请号:US708806

    申请日:1991-05-31

    摘要: A semiconductor device for passing electric current between a GaAs semiconductor layer (103) and an InGaAlP semiconductor layer (101) both having the same conductivity type. The device includes a higher carrier density region (102) with the carrier density equal to or more than 5.times.10.sup.17 cm.sup.-3 and thickness in a rannge from 400 .ANG. to 800 .ANG. in at least a part of the InGaAlP layer (101) adjoining the GaAs layer (103). As a result, good ohmic contact is achieved and the semiconductor device has a lower operating voltage and a satisfactory thermal characteristic.

    摘要翻译: 一种用于在GaAs半导体层(103)和具有相同导电类型的InGaAlP半导体层(101)之间传导电流的半导体器件。 该器件包括载流子密度等于或大于5×10 17 cm -3的较高载流子密度区域(102),并且在邻接GaAs的至少一部分InGaAlP层(101)中,从400到800的范围内的厚度 层(103)。 结果,实现良好的欧姆接触,并且半导体器件具有较低的工作电压和令人满意的热特性。