公开(公告)号：US20150102374A1

公开(公告)日：2015-04-16

申请号：US14403159

申请日：2013-05-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kathy Schmidtke ,  Michael Kruppa ,  Bert Braune

IPC: H01L33/56 ,  H01L31/18 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/60 ,  H01L31/0232

CPC classification number: H01L33/56 ,  C07F7/0838 ,  C07F7/0878 ,  C07F7/21 ,  C08G77/50 ,  C08L83/14 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/18 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: An optoelectronic component is specified. According to at least one embodiment of the invention, the optoelectronic component comprises a housing (20) and a radiation-emitting or radiation-receiving semiconductor chip (10) arranged in the housing (20). Furthermore, the component comprises an optical element (50), which contains a polymer material comprising a silicone. The silicone contains at least 40% by weight of cyclic siloxanes, and at least 40% of the silicon atoms of the cyclic siloxanes are crosslinked with a further silicon atom of the silicon via alkylene and/or alkylarylene groups.

Abstract translation: 指定了光电子元件。 根据本发明的至少一个实施例，光电子部件包括壳体（20）和布置在壳体（20）中的辐射发射或辐射接收半导体芯片（10）。 此外，该组件包括含有聚硅氧烷的聚合物材料的光学元件（50）。 硅氧烷含有至少40重量％的环硅氧烷，环状硅氧烷的至少40％的硅原子通过亚烷基和/或烷基亚芳基与硅的另外的硅原子交联。

公开(公告)号：US20150243859A1

公开(公告)日：2015-08-27

申请号：US14428345

申请日：2013-09-06

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Kathy Schmidtke ,  Michael Kruppa ,  Bert Braune

IPC: H01L33/58 ,  H01L31/18 ,  C09K5/14 ,  H01L33/64 ,  H01L31/024 ,  H01L33/00 ,  H01L31/0232

CPC classification number: H01L33/58 ,  B82Y40/00 ,  B82Y99/00 ,  C09K5/14 ,  H01L31/02327 ,  H01L31/024 ,  H01L31/18 ,  H01L33/005 ,  H01L33/56 ,  H01L33/641 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2933/0058 ,  H01L2933/0075 ,  H01L2933/0091 ,  Y10S977/773 ,  Y10S977/896 ,  H01L2924/00014

Abstract: A method for producing an optoelectronic device and an optoelectronic device is disclosed. According to at least one embodiment, an optoelectronic device is provided, which comprises a housing, a radiation-emitting or radiation-receiving semiconductor chip which is arranged in the housing, and an optical element which is arranged in a beam path of the device. The optical element comprises an amphiphilic block copolymer which contains polysiloxane as a hydrophobic polymer and a hydrophilic polymer cross-linked therewith. The optical element further comprises thermally conductive nanoparticles which are distributed in the amphiphilic block copolymer and comprise a material which is selected from the group comprising a metal, a metal oxide, a metal hydroxide and a combination thereof.

Abstract translation: 公开了一种用于制造光电器件和光电器件的方法。 根据至少一个实施例，提供了一种光电器件，其包括壳体，布置在壳体中的辐射发射或辐射接收半导体芯片，以及布置在该器件的光束路径中的光学元件。 光学元件包括含有作为疏水性聚合物的聚硅氧烷和与其交联的亲水性聚合物的两亲性嵌段共聚物。 光学元件还包括分散在两亲性嵌段共聚物中的导热纳米颗粒，并且包含选自金属，金属氧化物，金属氢氧化物及其组合的材料。

公开(公告)号：US20150076544A1

公开(公告)日：2015-03-19

申请号：US14391769

申请日：2013-04-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kathy Schmidtke ,  Michael Kruppa ,  Bert Braune

IPC: H01L33/56 ,  C08K5/56 ,  H01L33/64 ,  H01L33/50 ,  H01L33/58 ,  C08G77/395 ,  C08K5/54

CPC classification number: H01L33/56 ,  C08G77/395 ,  C08G79/04 ,  C08K3/36 ,  C08K5/52 ,  C08K5/5317 ,  C08K5/5333 ,  C08K5/5406 ,  C08K5/56 ,  C08K2003/2227 ,  C08K2003/2241 ,  C09C1/3607 ,  C09C1/3653 ,  C09C1/3669 ,  C09C1/3676 ,  C09C1/407 ,  H01L33/507 ,  H01L33/58 ,  H01L33/641 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0075 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A radiation-emitting component includes a radiation source; a transparent material disposed in the beam path of the component and including a polymer material and filler particles, wherein the filler particles include an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof and through which the filler particles are crosslinked with the polymer material.

Abstract translation: 辐射发射部件包括辐射源; 透明材料设置在部件的光束路径中并且包括聚合物材料和填料颗粒，其中填料颗粒包括附着在其表面上的无机填料和膦酸衍生物或磷酸衍生物，填料颗粒 与聚合物材料交联。

公开(公告)号：US09496467B2

公开(公告)日：2016-11-15

申请号：US14403159

申请日：2013-05-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kathy Schmidtke ,  Michael Kruppa ,  Bert Braune

IPC: H01L33/56 ,  H01L33/60 ,  H01L31/0232 ,  C07F7/21 ,  C08L83/14 ,  H01L31/0203 ,  C07F7/08 ,  C08G77/50 ,  H01L31/18 ,  H01L33/48

CPC classification number: H01L33/56 ,  C07F7/0838 ,  C07F7/0878 ,  C07F7/21 ,  C08G77/50 ,  C08L83/14 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/18 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: An optoelectronic component is specified. According to at least one embodiment of the invention, the optoelectronic component comprises a housing (20) and a radiation-emitting or radiation-receiving semiconductor chip (10) arranged in the housing (20). Furthermore, the component comprises an optical element (50), which contains a polymer material comprising a silicone. The silicone contains at least 40% by weight of cyclic siloxanes, and at least 40% of the silicon atoms of the cyclic siloxanes are crosslinked with a further silicon atom of the silicon via alkylene and/or alkylarylene groups.

Abstract translation: 指定了光电子元件。 根据本发明的至少一个实施例，光电子部件包括壳体（20）和布置在壳体（20）中的辐射发射或辐射接收半导体芯片（10）。 此外，该组件包括含有聚硅氧烷的聚合物材料的光学元件（50）。 硅氧烷含有至少40重量％的环硅氧烷，环状硅氧烷的至少40％的硅原子通过亚烷基和/或烷基亚芳基与硅的另外的硅原子交联。

公开(公告)号：US20150008471A1

公开(公告)日：2015-01-08

申请号：US14493257

申请日：2014-09-22

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Hans-Christoph GALLMEIER ,  Michael Kruppa ,  Raimund Schwarz ,  Guenter Spath

IPC: H01L33/50 ,  H01L33/62

CPC classification number: H01L33/507 ,  H01L33/38 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.

Abstract translation: 一种制造光电子半导体部件的方法，包括：在复合晶片中提供半导体芯片，其包括用于发射初级辐射的有源侧和布置在所述有源侧的接触端子; 在活动侧上沉积耦合元件; 附接用于将一次辐射的一部分转换成二次辐射的发光转换元件连接到耦合元件。

公开(公告)号：US09362466B2

公开(公告)日：2016-06-07

申请号：US14493257

申请日：2014-09-22

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Hans-Christoph Gallmeier ,  Michael Kruppa ,  Raimund Schwarz ,  Guenter Spath

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L33/507 ,  H01L33/38 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.

Abstract translation: 一种制造光电子半导体部件的方法，包括：在复合晶片中提供半导体芯片，其包括用于发射初级辐射的有源侧和布置在所述有源侧的接触端子; 在活动侧上沉积耦合元件; 附接用于将一次辐射的一部分转换成二次辐射的发光转换元件连接到耦合元件。

公开(公告)号：US09748451B2

公开(公告)日：2017-08-29

申请号：US14391769

申请日：2013-04-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kathy Schmidtke ,  Michael Kruppa ,  Bert Braune

IPC: C08K5/5317 ,  H01L33/56 ,  H01L33/64 ,  C08G77/395 ,  C08K5/54 ,  C08K5/56 ,  H01L33/50 ,  H01L33/58 ,  C09C1/40 ,  C09C1/36 ,  C08K3/36 ,  C08K5/52 ,  C08K3/22 ,  C08K5/5333 ,  C08G79/04

CPC classification number: H01L33/56 ,  C08G77/395 ,  C08G79/04 ,  C08K3/36 ,  C08K5/52 ,  C08K5/5317 ,  C08K5/5333 ,  C08K5/5406 ,  C08K5/56 ,  C08K2003/2227 ,  C08K2003/2241 ,  C09C1/3607 ,  C09C1/3653 ,  C09C1/3669 ,  C09C1/3676 ,  C09C1/407 ,  H01L33/507 ,  H01L33/58 ,  H01L33/641 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0075 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A radiation-emitting component includes a radiation source; a transparent material disposed in the beam path of the component and including a polymer material and filler particles, wherein the filler particles include an inorganic filler material and a phosphonic acid derivative or phosphoric acid derivative attached to a surface thereof and through which the filler particles are crosslinked with the polymer material.

公开(公告)号：US09634207B2

公开(公告)日：2017-04-25

申请号：US15146984

申请日：2016-05-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Kruppa ,  Simon Jerebic

IPC: H01L33/00 ,  H01L33/58 ,  H01L33/50 ,  H01L33/48 ,  H01L33/52 ,  B29D11/00 ,  G02B1/04 ,  H01L33/54 ,  H01L33/56 ,  G02B27/09 ,  H01L33/62

CPC classification number: H01L33/58 ,  B29D11/00442 ,  G02B1/04 ,  G02B27/095 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/501 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/005 ,  H01L2933/0058 ,  C08L75/00 ,  C08L63/00 ,  C08L83/04 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.

公开(公告)号：US20160247986A1

公开(公告)日：2016-08-25

申请号：US15146984

申请日：2016-05-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Kruppa ,  Simon Jerebic

IPC: H01L33/58 ,  H01L33/54 ,  G02B27/09 ,  H01L33/56

CPC classification number: H01L33/58 ,  B29D11/00442 ,  G02B1/04 ,  G02B27/095 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/501 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/005 ,  H01L2933/0058 ,  C08L75/00 ,  C08L63/00 ,  C08L83/04 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.

Abstract translation: 一种制造半导体部件的方法包括提供光电子半导体芯片; 应用光学元件的模塑料，其中模塑料基于高折射聚合物材料; 使模塑料在至多50℃的温度下进行预固化。 并固化模塑料。

公开(公告)号：US09362470B2

公开(公告)日：2016-06-07

申请号：US14428345

申请日：2013-09-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Kathy Schmidtke ,  Michael Kruppa ,  Bert Braune

IPC: H01L33/00 ,  H01L33/58 ,  H01L33/56 ,  H01L33/64 ,  C09K5/14 ,  H01L31/0232 ,  H01L31/024 ,  H01L31/18 ,  B82Y40/00 ,  B82Y99/00

CPC classification number: H01L33/58 ,  B82Y40/00 ,  B82Y99/00 ,  C09K5/14 ,  H01L31/02327 ,  H01L31/024 ,  H01L31/18 ,  H01L33/005 ,  H01L33/56 ,  H01L33/641 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2933/0058 ,  H01L2933/0075 ,  H01L2933/0091 ,  Y10S977/773 ,  Y10S977/896 ,  H01L2924/00014

Abstract: A method for producing an optoelectronic device and an optoelectronic device is disclosed. According to at least one embodiment, an optoelectronic device is provided, which comprises a housing, a radiation-emitting or radiation-receiving semiconductor chip which is arranged in the housing, and an optical element which is arranged in a beam path of the device. The optical element comprises an amphiphilic block copolymer which contains polysiloxane as a hydrophobic polymer and a hydrophilic polymer cross-linked therewith. The optical element further comprises thermally conductive nanoparticles which are distributed in the amphiphilic block copolymer and comprise a material which is selected from the group comprising a metal, a metal oxide, a metal hydroxide and a combination thereof.

Abstract translation: 公开了一种用于制造光电器件和光电器件的方法。 根据至少一个实施例，提供了一种光电器件，其包括壳体，布置在壳体中的辐射发射或辐射接收半导体芯片，以及布置在该器件的光束路径中的光学元件。 光学元件包括含有作为疏水性聚合物的聚硅氧烷和与其交联的亲水性聚合物的两亲性嵌段共聚物。 光学元件还包括分散在两亲性嵌段共聚物中的导热纳米颗粒，并且包含选自金属，金属氧化物，金属氢氧化物及其组合的材料。