公开(公告)号：US20150023073A1

公开(公告)日：2015-01-22

申请号：US14314213

申请日：2014-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Ha KIM

IPC: H02M1/32 ,  H02M1/36

CPC classification number: H02M1/32 ,  H02H7/127 ,  H02M1/12 ,  H02M1/36 ,  H02M7/12 ,  H02M2001/322

Abstract: A power control device and an image forming apparatus including the same are disclosed. A power control device meets the need for low power consumption by minimizing standby power consumption in a plug-on state of an electronic apparatus, and meets the safety requirements by increasing a discharging rate of an X-cap or an E-cap in a plug-off state. The power control device includes a first capacitor charged by AC power during input of the AC power, a rectifier converting the AC power to DC power, a second capacitor disposed at an output of the rectifier, and a discharge circuit including at least one discharge resistor, and a first switch and a second switch configured to be alternately turned on/off in response to supply and interruption of the AC power, and discharging at least one of the first and second capacitors via the at least one discharge resistor, in response to turn-off of the first switch and turn-on of the second switch.

Abstract translation: 公开了一种功率控制装置和包括该功率控制装置的图像形成装置。 功率控制装置通过使电子设备的插入状态下的待机功耗最小化来满足低功耗的需要，并且通过增加插头中的X形盖或E形盖的放电率来满足安全要求 -off状态。 电力控制装置包括在AC电力输入期间由AC电力充电的第一电容器，将AC电力转换为DC电力的整流器，设置在整流器的输出端的第二电容器，以及放电电路，其包括至少一个放电电阻器 以及第一开关和第二开关，其被配置为响应于AC电力的供应和中断而交替地导通/关断，并且响应于所述至少一个放电电阻而对所述第一和第二电容器中的至少一个进行放电， 关闭第一开关并打开第二开关。

公开(公告)号：US20140117391A1

公开(公告)日：2014-05-01

申请号：US13937865

申请日：2013-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Woo HA ,  Chin Woo KIM ,  Jin Ha KIM

IPC: F21V13/04 ,  H01L33/60

CPC classification number: H01L33/60 ,  G02B19/0061 ,  H01L33/58

Abstract: An LED lens includes a recess disposed in a quadrangular bottom surface of the LED lens and configured to have a light source disposed therein, wherein an internal surface of the recess, including lateral surfaces and top surfaces, is a light incident surface. The LED lens further includes a top surface forming a light exit surface, having a size greater than that of the bottom surface, and having a quadrangular shape; and lateral surfaces of the LED lens, disposed between the top and bottom surfaces of the LED lens, forming a reflective surface, and guiding light incident to the LED lens through the light incident surface to the light exit surface. The top surfaces of the light incident surface form an inverted quadrangular pyramid.

Abstract translation: LED透镜包括设置在LED透镜的四边形底表面中并且被配置为具有设置在其中的光源的凹部，其中包括侧表面和顶表面的凹部的内表面是光入射表面。 LED透镜还包括形成光出射表面的顶表面，其尺寸大于底表面的尺寸，并且具有四边形形状; 以及设置在LED透镜的顶表面和底表面之间的LED透镜的侧表面，形成反射表面，并且将通过光入射表面入射到LED透镜的光引导到光出射表面。 光入射表面的顶面形成倒四角锥。

公开(公告)号：US20240219282A1

公开(公告)日：2024-07-04

申请号：US18202794

申请日：2023-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeong Seok JANG ,  Won Jong JUNG ,  Jin Ha KIM ,  Kak NAMKOONG ,  Hyung Jun YOUN ,  Jae Hong LEE

IPC: G01N15/02

CPC classification number: G01N15/0205

Abstract: Provided is an apparatus configured to detect fine particles, including a fine particle trap including a plurality of through holes that are configured to trap the fine particles, a measurer including a light source configured to emit light to the plurality of through holes, and a detector configured to detect light scattered, reflected, or transmitted through the plurality of through holes and measure a spectrum, and a processor configured to estimate a number of the fine particles trapped in the plurality of through holes based on of the measured spectrum, wherein the plurality of through holes have a diameter equal to or less than 10 μm.

公开(公告)号：US20170309793A1

公开(公告)日：2017-10-26

申请号：US15364739

申请日：2016-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： JONG WAN SEO ,  Jin Ha KIM ,  Kwang Bok WOO ,  Dong Hoon LEE ,  Won Joon LEE ,  Sun Hwan HWANG

IPC: H01L33/50 ,  H01L33/38 ,  H01L33/46 ,  H01L33/62

CPC classification number: H01L33/504 ,  H01L33/38 ,  H01L33/46 ,  H01L33/50 ,  H01L33/502 ,  H01L33/62

Abstract: A semiconductor light emitting device may include a semiconductor light emitting diode (LED) chip, a light-transmitting film on the LED chip, and a light-transmitting bonding layer between the light-transmitting film and the semiconductor LED chip. At least one of the light-transmitting film and the light-transmitting bonding layer may include a wavelength conversion material configured to convert light emitted by the semiconductor LED chip into light having a wavelength different from a wavelength of the emitted light. The light-transmitting bonding layer may have a lateral inclined region extending to the lateral surface to form an inclined surface. The semiconductor light emitting device may further include a reflective packaging portion surrounding the light-transmitting bonding layer, covering the first surface such that an electrode of the LED chip is at least partially exposed. The reflective packaging portion may include a reflective material.

公开(公告)号：US20140203315A1

公开(公告)日：2014-07-24

申请号：US14056339

申请日：2013-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chin Woo KIM ,  Jin Ha KIM ,  Sang Woo HA

IPC: F21K99/00 ,  H01L33/58

CPC classification number: H01L33/58 ,  F21V5/04 ,  F21V7/0091 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light emitting diode (LED) lens comprises a light incident surface on a bottom surface of the LED lens facing a light source. A light exit surface, having a size greater than the bottom surface, is defined by a top surface of the LED lens. A planar portion, emitting light incident through the light incident surface, is in a central region of the light exit surface. At least one protrusion portion, protruding to be stepped with respect to the planar portion, is in a region of the light exit surface except for the central region. A reflective surface, defined by lateral surfaces of the LED lens between the top surface of the LED lens and the bottom surface thereof, guides the light incident through the light incident surface, and contacts a lower portion of the light exit surface corresponding to a boundary between the protrusion and the planar portions.

Abstract translation: 发光二极管（LED）透镜包括在面向光源的LED透镜的底表面上的光入射表面。 具有大于底表面的尺寸的光出射表面由LED透镜的顶表面限定。 发射通过光入射表面入射的光的平面部分在光出射表面的中心区域中。 相对于平面部分突出成阶梯状的至少一个突出部分位于除了中心区域之外的光出射表面的区域中。 在LED透镜的顶表面和其底表面之间由LED透镜的侧表面限定的反射表面引导入射穿过光入射表面的光，并且接触与边界对应的光出射表面的下部 在突起和平面部分之间。

公开(公告)号：US20240091767A1

公开(公告)日：2024-03-21

申请号：US18082087

申请日：2022-12-15

Applicant: SAMSUNG ELECTRONICS CO, LTD.

Inventor： Jae Hong LEE ,  Won Jong JUNG ,  Kak NAMKOONG ,  Hyeong Seok JANG ,  Jin Ha KIM ,  Hyung Jun YOUN

IPC: B01L3/00 ,  B01L7/00

CPC classification number: B01L3/502715 ,  B01L7/52 ,  B01L2300/0636 ,  B01L2300/0819 ,  B01L2300/12 ,  B01L2300/1861

Abstract: A gene amplification chip includes a chamber layer, a cover layer, a bottom layer, an inlet, and an outlet. The chamber layer has a first passage and through holes which are formed on one side of the first passage. The cover layer is disposed on one side of the chamber layer and has a cover channel formed to communicate with the first passage and the through holes, wherein the cover channel, the first passage and the through holes allow passage of liquids in a divided manner. The bottom layer is disposed on another side of the chamber layer and has a bottom channel formed to communicate with the first passage and the through holes. The inlet is formed in the cover layer and communicates with the cover channel. The outlet communicates with any one of the cover channel and the bottom channel.

公开(公告)号：US20150171298A1

公开(公告)日：2015-06-18

申请号：US14543481

申请日：2014-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myong Soo CHO ,  Yong-Il KIM ,  Jin Ha KIM ,  Kwang Min SONG ,  Sang Seok LEE

IPC: H01L33/62 ,  H01L33/40 ,  H01L33/44 ,  H01L33/20

CPC classification number: H01L33/62 ,  H01L33/20 ,  H01L33/38 ,  H01L33/40 ,  H01L33/405 ,  H01L33/44 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2933/0091

Abstract: In example embodiments, a semiconductor light emitting device includes a light emitting structure, first and second insulating layers, a barrier metal layer, and an electrode. The light emitting structure includes an active layer between a first and second conductivity-type semiconductor layer. The first insulating layer is on the light emitting structure and defines a first one and a second one of first openings that respectively expose the first and second conductivity-type semiconductor layers. The barrier metal layer is on the first insulating layer and electrically connected to the first and second conductivity-type semiconductor layers through the first and second one of the first openings. The second insulating layer is on the barrier metal layer and defines a second opening that partially exposes the barrier metal layer. The electrode is on the barrier metal layer and electrically connected to the first and second conductivity-type semiconductor layers through the barrier metal layer.

Abstract translation: 在示例性实施例中，半导体发光器件包括发光结构，第一和第二绝缘层，阻挡金属层和电极。 发光结构包括在第一和第二导电类型半导体层之间的有源层。 第一绝缘层位于发光结构上并且限定分别暴露第一和第二导电类型半导体层的第一开口和第二开口中的第一绝缘层。 阻挡金属层位于第一绝缘层上，并通过第一和第二开口与第一和第二导电型半导体层电连接。 第二绝缘层位于阻挡金属层上并且限定了部分地暴露阻挡金属层的第二开口。 电极在阻挡金属层上，并通过阻挡金属层与第一和第二导电型半导体层电连接。

公开(公告)号：US20130175554A1

公开(公告)日：2013-07-11

申请号：US13737280

申请日：2013-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ho HAN ,  Jin Ha KIM ,  Chin Woo KIM ,  Sung Ho JEON ,  Seok Man CHO

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/13 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0041 ,  H01L2933/005 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00

Abstract: There is provided a light emitting diode (LED) package substrate including: a substrate including a chip mounting region on which a plurality of LED chips is mountable; a conductive layer including a plurality of electrode patterns disposed on the chip mounting region; and a groove part, forming a dam, wherein the groove part surrounds the chip mounting region and is spaced apart from the chip mounting region by a predetermined interval.

Abstract translation: 提供了一种发光二极管（LED）封装基板，包括：基板，包括可安装多个LED芯片的芯片安装区域; 导电层，包括设置在芯片安装区域上的多个电极图案; 以及形成坝的槽部，其中，所述槽部围绕所述芯片安装区域，并且与所述芯片安装区域间隔开预定间隔。

公开(公告)号：US20240280513A1

公开(公告)日：2024-08-22

申请号：US18224325

申请日：2023-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Jae Hong LEE ,  Jungwon PARK ,  Min-Ho KANG ,  Minyoung LEE ,  Hyeong Seok JANG ,  Won Jong JUNG ,  Jin Ha KIM ,  Kak NAMKOONG ,  Hyung Jun YOUN

IPC: G01N23/06 ,  B81B1/00 ,  B81C1/00 ,  G01N33/483

CPC classification number: G01N23/06 ,  B81B1/002 ,  B81C1/00071 ,  G01N33/483 ,  B81B2201/05 ,  B81B2203/033 ,  B81B2203/0338 ,  B81C2201/0132 ,  B81C2201/0181 ,  B81C2201/0198

Abstract: The present disclosure provides methods and apparatuses for biomaterial detection sensors. In some embodiments, a biomaterial detection sensor includes a membrane including a plurality of wells. Each of the plurality of wells is configured to encapsulate a biomaterial contained in a sample solution. A surface of the membrane is selectively modified into at least one of a hydrophilic surface and a hydrophobic surface. In some embodiments, a method of manufacturing a biomaterial detection sensor includes depositing a first membrane and a second membrane on respective surfaces of a wafer, forming a window by etching the first membrane and the first surface of the wafer, forming a plurality of wells on the second membrane, modifying a surface of the second membrane into at least one of a hydrophilic surface and a hydrophobic surface; and transferring a two-dimensional graphene oxide material onto a bottom of each of the plurality of wells.

公开(公告)号：US20150022162A1

公开(公告)日：2015-01-22

申请号：US14282261

申请日：2014-05-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Ha KIM

IPC: H02J7/00 ,  H02J7/34

CPC classification number: G03G15/5004 ,  G03G15/80 ,  H02M2001/0032 ,  H02M2001/322

Abstract: A discharge circuit unit for minimizing standby power occurring in a standby mode and an image forming apparatus having the same are provided. The discharge circuit unit is connected to an input line of alternating current (AC) power and discharges a capacitive element for reducing noises. The discharge circuit unit includes a discharge circuit including first and second resistance units connected in series to discharge the capacitive element in response to a discharge control signal generated when an input of the AC power is interrupted, and a detection circuit that detects whether the input of the AC power is interrupted, and includes third and fourth resistance units connected in series so as to generate the discharge control signal when it is detected that the input of the AC power is interrupted. Each of the first to fourth resistance units includes at least one of a resistor and a switch.

Abstract translation: 提供一种放电电路单元，用于使在备用模式下发生的待机功率最小化，以及具有该放电电路单元的图像形成装置。 放电电路单元连接到交流（AC）电源的输入线，并且放电用于降低噪声的电容元件。 放电电路单元包括放电电路，该放电电路包括串联连接的第一和第二电阻单元，以响应于在交流电源的输入被中断时产生的放电控制信号而放电电容元件;以及检测电路， AC电源被中断，并且包括串联连接的第三和第四电阻单元，以便当检测到AC电源的输入被中断时产生放电控制信号。 第一至第四电阻单元中的每一个包括电阻器和开关中的至少一个。