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    Method of molding semiconductor package
    1.
    发明授权
    Method of molding semiconductor package 有权
    半导体封装的成型方法

    公开(公告)号：US09184065B2

    公开(公告)日：2015-11-10

    申请号：US14590383

    申请日：2015-01-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

    IPC: H01L21/00 ,  H01L21/52 ,  H01L21/56 ,  H01L25/065

    CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L21/565 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/06562

    Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

    Abstract translation: 模制半导体封装的方法包括在设置在基板上的半导体芯片的顶表面上涂布液体模制树脂或将固体模塑树脂设置。 固体成型树脂可以包括粉末成型树脂或片状模塑树脂。 在半导体芯片的上表面上涂布有液态成型树脂的情况下，将基板安装在下模和上模之间，然后将熔融模制树脂填充在下模和上模之间的空间中。 在固体成形树脂设置在半导体芯片的顶面的情况下，将基板安装在下模上，然后将固体成型树脂加热熔融成具有流动性的液态成型树脂。 上模具安装在下模具上，熔融模塑树脂填充在下模和上模之间的空间中。

    PRINTED CIRCUIT BOARD AND MEMORY MODULE COMPRISING THE SAME
    4.
    发明申请
    PRINTED CIRCUIT BOARD AND MEMORY MODULE COMPRISING THE SAME 审中-公开
    印刷电路板和包含该印刷电路板的存储器模块

    公开(公告)号：US20130223001A1

    公开(公告)日：2013-08-29

    申请号：US13685076

    申请日：2012-11-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hwang-bok Ryu ,  Jun-young Ko ,  Young-ja Kim ,  Dae-young Jeong

    IPC: H05K7/06 ,  G06F1/16

    CPC classification number: H05K7/06 ,  G06F1/16 ,  G06F1/185 ,  H05K1/114 ,  H05K3/366 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0338 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10159 ,  H05K2201/10189

    Abstract: A printed circuit board (PCB) comprises an internal wiring layer, an insulating layer on the internal wiring layer, a via hole extending through the insulating layer, and an external wiring layer on the insulating layer. The internal wiring layer comprises at least one metal wiring layer. The via hole exposes the internal wiring layer. The external wiring layer is electrically connected to the internal wiring layer. The external wiring layer includes a mounting area on which a semiconductor chip is disposed and a non-mounting area on which a semiconductor chip is not disposed. A thickness of the mounting area is less than a thickness of the non-mounting area.

    Abstract translation: 印刷电路板（PCB）包括内部布线层，内部布线层上的绝缘层，延伸穿过绝缘层的通孔以及绝缘层上的外部布线层。 内部布线层包括至少一个金属布线层。 通孔露出内部布线层。 外部布线层电连接到内部布线层。 外部布线层包括其上设置有半导体芯片的安装区域和不设置半导体芯片的非安装区域。 安装面积的厚度小于非安装区域的厚度。

    MAGAZINE AND PROCESS EQUIPMENT INCLUDING THE SAME
    6.
    发明申请
    MAGAZINE AND PROCESS EQUIPMENT INCLUDING THE SAME 审中-公开
    杂项和工艺设备，包括它们

    公开(公告)号：US20160086828A1

    公开(公告)日：2016-03-24

    申请号：US14691917

    申请日：2015-04-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yi-sung Hwang ,  Jun-young Ko ,  Dong-woo Kang ,  Se-yeoul Park

    IPC: H01L21/673

    CPC classification number: H01L21/6732

    Abstract: A magazine includes a main body unit having a front side and a rear side, at least one of which is open, a plurality of slots formed inside two sidewalls of the main body unit, and at least one support member extending to the two sidewalls of the main body unit in a first direction.

    Abstract translation: 弹匣包括具有前侧和后侧的主体单元，其中至少一个是敞开的，形成在主体单元的两个侧壁内的多个槽，以及至少一个支撑构件，其延伸到主体单元的两个侧壁 主体单元在第一方向上。

    METHOD OF MOLDING SEMICONDUCTOR PACKAGE
    7.
    发明申请
    METHOD OF MOLDING SEMICONDUCTOR PACKAGE 有权
    模制半导体封装的方法

    公开(公告)号：US20150118798A1

    公开(公告)日：2015-04-30

    申请号：US14590383

    申请日：2015-01-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

    IPC: H01L21/52 ,  H01L21/56

    CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L21/565 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/06562

    Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

    Abstract translation: 模制半导体封装的方法包括在设置在基板上的半导体芯片的顶表面上涂布液体模制树脂或将固体模塑树脂设置。 固体成型树脂可以包括粉末成型树脂或片状模塑树脂。 在半导体芯片的上表面上涂布有液态成型树脂的情况下，将基板安装在下模和上模之间，然后将熔融模制树脂填充在下模和上模之间的空间中。 在固体成形树脂设置在半导体芯片的顶面的情况下，将基板安装在下模上，然后将固体成型树脂加热熔融成具有流动性的液态成型树脂。 上模具安装在下模具上，熔融模塑树脂填充在下模和上模之间的空间中。

    Method of molding semiconductor package
    8.
    发明授权
    Method of molding semiconductor package 有权

    公开(公告)号：US08956921B2

    公开(公告)日：2015-02-17

    申请号：US13836553

    申请日：2013-03-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

    IPC: H01L21/16 ,  H01L21/56 ,  H01L25/065

    CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L21/565 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/06562

    Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

    METHOD OF MOLDING SEMICONDUCTOR PACKAGE
    9.
    发明申请
    METHOD OF MOLDING SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20130203220A1

    公开(公告)日：2013-08-08

    申请号：US13836553

    申请日：2013-03-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jun-young Ko ,  Jae-yong Park ,  Heui-seog Kim ,  Ho-geon Song

    IPC: H01L21/56

    CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L21/565 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/06562

    Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

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