公开(公告)号：US20240167908A1

公开(公告)日：2024-05-23

申请号：US18515924

申请日：2023-11-21

Applicant: Blue Origin, LLC

Inventor： Eric David Wetzel

IPC: G01M3/26 ,  G01M3/04 ,  H05K5/06

CPC classification number: G01M3/26 ,  G01M3/04 ,  H05K5/065 ,  H05K5/069

Abstract: Systems and methods for customizable vacuum testing chambers. Outer shell segments are assembled to conform to and form a sealed enclosure about a test article having air therein. An interstitial region is defined between the test article and the shell segments. A porous support layer is located within the interstitial region. A vacuum pump evacuates air from within the interstitial region to vacuum test the article. Sensors detect leaks within the interstitial region. Zonal barriers may fluidly isolate zones of the interstitial region for locating leaks. The shell segments may be disassembled and the test article removed. The shell segments may be reused for testing other test articles having different shapes and sizes.

公开(公告)号：US20240008207A1

公开(公告)日：2024-01-04

申请号：US18038319

申请日：2021-09-24

Applicant: Hitachi Astemo, Ltd.

Inventor： Yusuke TAKAHASHI ,  Yoshio KAWAI

IPC: H05K5/06 ,  H05K5/00 ,  H05K5/04

CPC classification number: H05K5/065 ,  H05K5/0069 ,  H05K5/006 ,  H05K5/04

Abstract: An electronic control device includes a non-conductive resin housing; a circuit board; a metal housing; a waterproof seal material; and a conductive adhesive. The circuit board has a circuit ground (GND pattern), and is held by the resin housing. The metal housing covers the circuit board and is attached to the resin housing. The waterproof seal material seals and waterproofs the resin housing and the metal housing. The conductive adhesive is in contact with the metal housing and the circuit ground, and electrically connects the metal housing to the circuit ground at a plurality of points.

公开(公告)号：US20230413454A1

公开(公告)日：2023-12-21

申请号：US18239723

申请日：2023-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Yung I YEH ,  Chang-Lin YEH ,  Sheng-Yu CHEN

IPC: H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K9/00 ,  H05K3/28 ,  H05K1/14

CPC classification number: H05K5/0017 ,  H05K5/065 ,  H05K1/181 ,  H05K9/0022 ,  H05K3/284 ,  H05K1/142 ,  H05K1/144 ,  H05K2203/1316 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/041 ,  H05K2203/1327

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US11733016B2

公开(公告)日：2023-08-22

申请号：US17075781

申请日：2020-10-21

Applicant: DynaEnergetics Europe GmbH

Inventor： Christian Eitschberger ,  Thilo Scharf

IPC: E21B43/11 ,  F42D1/05 ,  E21B43/1185 ,  H05K5/06 ,  H05K5/00 ,  H05K5/02 ,  F42D1/045 ,  E21B43/117

CPC classification number: F42D1/05 ,  E21B43/1185 ,  F42D1/045 ,  H05K5/0034 ,  H05K5/0056 ,  H05K5/0065 ,  H05K5/0069 ,  H05K5/0247 ,  H05K5/069 ,  E21B43/117 ,  H05K5/064 ,  H05K5/065

Abstract: Pressure-isolating bulkhead structures with integrated selective electronic switches circuitry are provided. The pressure-isolating bulkhead structure may be a single unit having the integrated electronic switch circuitry, as well as an electrical connector that includes at least one of a wire and a pin contact. Such integrated selective electronic switch circuitry may be fashioned within a self-contained, inner pressure-isolating enclosure body. Such inner pressure-isolating enclosure body may be produced about the selective electronic switch circuitry such that the inner pressure-isolating enclosure body and switch circuitry are produced as a unit, which can be easily placed within a variety of bulkhead structures, and subsequently within a perforating gun.

公开(公告)号：US20190191562A1

公开(公告)日：2019-06-20

申请号：US16281269

申请日：2019-02-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota ASAI ,  Yosuke MATSUSHITA

IPC: H05K1/11 ,  H05K1/03 ,  H01L23/498 ,  H05K5/06 ,  H05K1/18 ,  H01L23/31 ,  H01L23/15 ,  H05K3/40 ,  H05K3/38 ,  H05K3/00 ,  H01L21/48

CPC classification number: H05K1/111 ,  C04B41/90 ,  H01L21/4853 ,  H01L23/13 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49894 ,  H01L25/00 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/38 ,  H05K3/381 ,  H05K3/4007 ,  H05K3/46 ,  H05K5/065

Abstract: A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

公开(公告)号：US10039199B2

公开(公告)日：2018-07-31

申请号：US15296813

申请日：2016-10-18

Applicant: Amphenol Corporation

Inventor： Donald A. Girard, Jr. ,  Robert Auger ,  Mark W. Gailus

IPC: H05K5/02 ,  H05K5/06 ,  H05K5/00 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K5/0247 ,  H01R13/6466 ,  H01R13/6473 ,  H01R13/6625 ,  H05K1/0231 ,  H05K1/181 ,  H05K3/301 ,  H05K5/0021 ,  H05K5/0217 ,  H05K5/065 ,  H05K13/00 ,  H05K2201/10015 ,  H05K2201/10515

Abstract: An adapter has two conductors each with a U-shaped bend forming upper longer legs and lower shorter legs. The conductors face each other with the longer legs linearly aligned with each other and the shorter legs aligned with each other, thereby forming a first gap between the longer legs and a second gap between the shorter legs. The first gap is substantially smaller than the second gap, so that an electrical package can be placed across the first gap to contact the two upper longer legs, while the two shorter legs are spaced further apart to span a larger gap between conductors of a connector. Thus, the adapter enables the electrical package to be connected to conductors having a gap that is larger than the electrical package.

公开(公告)号：US20180177058A1

公开(公告)日：2018-06-21

申请号：US15736749

申请日：2016-06-06

Applicant: Robert Bosch GmbH

Inventor： Uwe Liskow

IPC: H05K3/28 ,  H05K1/18 ,  H05K5/06 ,  H05K1/11 ,  H05K3/32 ,  H05K5/00

CPC classification number: H05K3/284 ,  H05K1/111 ,  H05K1/181 ,  H05K3/301 ,  H05K3/328 ,  H05K5/0082 ,  H05K5/065 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/105 ,  H05K2201/10522 ,  H05K2201/10606 ,  H05K2201/2072 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An electronic module includes a circuit board, a first component, and a socket element with a first surface and a second surface opposite the first surface. The first surface lies on a surface of the circuit board and is fixed to the circuit board. A second component is secured to the socket element and is electrically connected to the circuit board via the socket element. A protective compound is arranged on the surface of the circuit board and encapsulates the first component. The socket element is partly embedded into the protective compound such that lateral flanks of the socket element are covered by the protective compound, and the second surface of the socket element protrudes out of the protective compound. Connection elements of the socket element and connections of the second component are connected via a welding connection. Second components are attachable to the circuit board in a reliable manner.

公开(公告)号：US20170280575A1

公开(公告)日：2017-09-28

申请号：US15512275

申请日：2015-08-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyu Sik KIM ,  Gi Eun LEE

IPC: H05K5/06 ,  H05K1/02 ,  H05K7/06 ,  D06F37/20

CPC classification number: H05K5/065 ,  D06F37/20 ,  D06F39/005 ,  H05K1/02 ,  H05K3/28 ,  H05K5/069 ,  H05K7/06 ,  H05K10/00 ,  H05K2201/0195 ,  H05K2201/09909 ,  H05K2203/0588 ,  H05K2203/1147

Abstract: A printed circuit board (PCB) having an improved waterproof structure for preventing corrosion of a substrate is disclosed. A plurality of screen-printed protrusions is provided at the PCB surface. the plurality of protrusions allow water to be formed in waterdrops so that the waterdrops can flow to the outside of the PCB. The PCB is arranged to have a tilted structure for facilitating discharge of the water. The tilted structure discharges waterdrops to a lower side of the PCB. The PCB and a PCB assembly having the same are applicable to electronic appliances such as a washing machine.

公开(公告)号：US09740250B2

公开(公告)日：2017-08-22

申请号：US14340229

申请日：2014-07-24

Applicant: FUJITSU LIMITED

Inventor： Masao Honda ,  Yoshito Fukata ,  Takeshi Karuishi

IPC: H05K7/20 ,  G06F1/20 ,  H05K5/06 ,  H05K9/00

CPC classification number: G06F1/20 ,  G06F1/203 ,  H05K5/064 ,  H05K5/065 ,  H05K7/20 ,  H05K9/0015

Abstract: An electronic device includes a housing body, a dividing member that divides the housing body into a first compartment and a second compartment, a sealing member that divides the first compartment into a liquid-stopper region and an exterior communication region, one or more heat emitting components disposed in the liquid-stopper region, a fan disposed in the exterior communication region, and a ventilation pathway through which an airflow passes through the dividing member to the second compartment due to driving the fan.

公开(公告)号：US20170118856A1

公开(公告)日：2017-04-27

申请号：US15398317

申请日：2017-01-04

Applicant: MB-Microtec AG

Inventor： Heinz BLUNIER ,  Hannes KIND ,  Sandro M.O.L. SCHNEIDER

IPC: H05K5/06 ,  H01L27/146 ,  H02J50/00 ,  A61B1/04 ,  A61B5/00 ,  A61B5/07 ,  A61B1/06 ,  A61B5/145 ,  A61B10/04 ,  H05K5/03 ,  A61B1/00

CPC classification number: H05K5/065 ,  A61B1/0002 ,  A61B1/04 ,  A61B1/041 ,  A61B1/0661 ,  A61B5/076 ,  A61B5/14503 ,  A61B5/6861 ,  A61B10/04 ,  A61B2562/12 ,  A61B2562/162 ,  B23K5/006 ,  B23K5/06 ,  B23K5/14 ,  B23K26/0624 ,  B23K26/0846 ,  B23K26/206 ,  B23K26/324 ,  B23K2101/04 ,  B23K2101/42 ,  B23K2103/54 ,  C03B23/207 ,  C03B23/217 ,  C03B23/245 ,  C03B33/082 ,  C03B33/0855 ,  G03B17/08 ,  H01L21/52 ,  H01L23/08 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/1469 ,  H02J50/00 ,  H05K5/0095 ,  H05K5/03 ,  H05K5/066

Abstract: A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.