公开(公告)号：US20050079823A1

公开(公告)日：2005-04-14

申请号：US10683627

申请日：2003-10-10

Applicant: Wojciech Kurek ,  Joseph Cramer ,  Bin Hu

Inventor： Wojciech Kurek ,  Joseph Cramer ,  Bin Hu

IPC: H04L20060101 ,  H04L12/28 ,  H04L12/56 ,  H04W36/00 ,  H04W48/16 ,  H04Q7/20

CPC classification number: H04W36/0055 ,  H04W36/18 ,  H04W48/16

Abstract: A communication circuit (10) and method updates an active link set list (50) in an asynchronous wireless communication system. In one embodiment, the communication circuit (10) may be a wireless device (600) or any other suitable communication device. The communication circuit (10) includes candidate reference link determination circuitry (30) to receive an active link set update message (60) and in response, to create the candidate list of reference links (20) from the active link set list (50). The candidate reference link determination circuitry (30) creates the candidate list of reference links based on, for example, an indication in the received active link set update message (60) to retain links from the active link set list (50).

Abstract translation: 通信电路（10）和方法更新异步无线通信系统中的主动链路集列表（50）。 在一个实施例中，通信电路（10）可以是无线设备（600）或任何其它合适的通信设备。 通信电路（10）包括用于接收活动链路组更新消息（60）的候选参考链路确定电路（30），并且响应于从主动链路集列表（50）创建参考链路（20）的候选列表， 。 候选参考链路确定电路（30）基于例如接收到的活动链路集更新消息（60）中的指示来保留来自活动链路集列表（50）的链路来创建参考链路的候选列表。

公开(公告)号：US20050079803A1

公开(公告)日：2005-04-14

申请号：US10683231

申请日：2003-10-10

Applicant: Junaid Siddiqui ,  Bin Hu

Inventor： Junaid Siddiqui ,  Bin Hu

IPC: B24B37/00 ,  B24B1/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  H01L21/321

CPC classification number: H01L21/3212 ,  C09G1/02 ,  C09K3/1463

Abstract: A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an abrasive and a polyvinylpyridine-N-oxide polymer. The composition possesses high selectivities for metal and barrier material removal in metal CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP).

Abstract translation: 描述了用于化学机械平面化（或其它抛光）的组合物和相关方法。 组合物包含研磨剂和聚乙烯基吡啶-N-氧化物聚合物。 该组合物在金属CMP中具有很高的金属选择性和阻隔材料去除性。 组合物还可以包含氧化剂，在这种情况下，组合物特别适用于金属CMP应用的相关方法（例如，铜CMP）。

公开(公告)号：US20050079718A1

公开(公告)日：2005-04-14

申请号：US10683258

申请日：2003-10-10

Applicant: Junaid Siddiqui ,  Bin Hu

Inventor： Junaid Siddiqui ,  Bin Hu

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/321 ,  H01L21/302 ,  H01L21/461

CPC classification number: H01L21/3212 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463

Abstract: A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an organometallic-modified colloidal abrasive and a nitrogen-containing polymer compound (e.g., a polyalkyleneimine, such as polyamidopolyethyleneimine). The composition possesses both high stability towards gelling and/or solids formation and high selectivity for metal removal in metal CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP).

Abstract translation: 描述了用于化学机械平面化（或其它抛光）的组合物和相关方法。 该组合物包含有机金属改性的胶体磨料和含氮高分子化合物（例如，聚亚烷基亚胺，如聚酰胺聚乙烯亚胺）。 该组合物具有对胶凝和/或固体形成的高稳定性以及金属CMP中金属去除的高选择性。 组合物还可以包含氧化剂，在这种情况下，组合物特别适用于金属CMP应用的相关方法（例如，铜CMP）。

公开(公告)号：US20050076578A1

公开(公告)日：2005-04-14

申请号：US10683232

申请日：2003-10-10

Applicant: Junaid Siddiqui ,  Timothy Compton ,  Bin Hu ,  Robin Richards

Inventor： Junaid Siddiqui ,  Timothy Compton ,  Bin Hu ,  Robin Richards

IPC: B24B37/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  B24D3/02

CPC classification number: C09G1/02

Abstract: A composition and associated method for chemical mechanical planarization (or other polishing) are described which afford high tantalum to copper selectivity in copper CMP and which are tunable (in relation to polishing performance). The composition comprises an abrasive and an N-acyl-N-hydrocarbonoxyalkyl aspartic acid compound and/or a tolyltriazole derivative.

Abstract translation: 描述了用于化学机械平面化（或其他抛光）的组合物和相关方法，其在铜CMP中提供高的钽到铜选择性，并且其可调谐（相对于抛光性能）。 该组合物包含磨料和N-酰基-N-烃氧烷基天冬氨酸化合物和/或甲苯基三唑衍生物。

公开(公告)号：US09828365B2

公开(公告)日：2017-11-28

申请号：US15104584

申请日：2014-12-15

Applicant: MERCK SHARP & DOHME CORP. ,  Joseph Kozlowski ,  Craig Coburn ,  Wensheng Yu ,  Ling Tong ,  Bin Hu ,  Bin Zhong ,  Jinglai Hao ,  Dahai Wang ,  Tao Ji

Inventor： Joseph Kozlowski ,  Craig Coburn ,  Wensheng Yu ,  Ling Tong ,  Bin Hu ,  Bin Zhong ,  Jinglai Hao ,  Dahai Wang ,  Tao Ji

IPC: C07D493/04 ,  C07D405/14 ,  A61K45/06 ,  A61K31/4985 ,  A61K31/7072 ,  A61K31/4178

CPC classification number: C07D405/14 ,  A61K31/4155 ,  A61K31/4178 ,  A61K31/4985 ,  A61K31/7072 ,  A61K45/06 ,  C07D493/04 ,  A61K2300/00

Abstract: The present invention relates to novel Fused Tetracyclic Heterocyclic Compounds of Formula I: (I), wherein A, A′, R2A, R2B, R7, R8, R9, and R10 are defined herein. The compounds and their pharmaceutically acceptable salts are useful for the prophylaxis or treatment of infection by HCV and the prophylaxis, treatment, or delay in the onset of disease caused by HCV. The present invention also relates to pharmaceutical compositions comprising at least one Fused Tetracyclic Heterocyclic Compound, optionally in combination with other antivirals, immunomodulators, antibiotics or vaccines, and methods of using the Fused Tetracyclic Heterocyclic Compounds for treating or preventing HCV infection in a patient.

公开(公告)号：US08779011B2

公开(公告)日：2014-07-15

申请号：US13405027

申请日：2012-02-24

Applicant: Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R. M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

Inventor： Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R. M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

IPC: C01B33/141 ,  C01B33/143 ,  C09C1/68 ,  C09K13/06

CPC classification number: C23F3/04 ,  C01B33/1435 ,  C01B33/1485 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/80 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/31053 ,  H01L21/3212

Abstract: A method for producing and using an ultrapure colloidal silica dispersion is disclosed. The ultrapure colloidal silica dispersion has less than 200 ppb of each trace metal impurity disposed therein, excluding potassium and sodium, and less than 2 ppm residual alcohol. The method comprises dissolving a fumed silica in an aqueous solvent comprising an alkali metal hydroxide to produce an alkaline silicate solution, removing the alkali metal via ion exchange to generate a silicic acid solution, adjusting temperature, concentration and pH of said silicic acid solution to values sufficient to initiate nucleation and particle growth, and cooling the silicic acid solution at a rate sufficient to produce the colloidal silica dispersion.

Abstract translation: 公开了一种制备和使用超纯胶体二氧化硅分散体的方法。 超纯胶体二氧化硅分散体中含有少于200ppb的痕量金属杂质，不包括钾和钠，少于2ppm的残余醇。 该方法包括将热解法二氧化硅溶解在包含碱金属氢氧化物的水性溶剂中以产生碱性硅酸盐溶液，通过离子交换除去碱金属以产生硅酸溶液，将所述硅酸溶液的温度，浓度和pH值调节至数值 足以引发成核和颗粒生长，并以足以产生胶体二氧化硅分散体的速率冷却硅酸溶液。

公开(公告)号：US08778605B2

公开(公告)日：2014-07-15

申请号：US13762083

申请日：2013-02-07

Applicant: Shem Ogadhoh ,  Raguraman Venkatesan ,  Kevin J. Hooker ,  Sungwon Kim ,  Bin Hu ,  Vivek Singh ,  Bikram Baidya ,  Prasad Narendra Atkar ,  Seongtae Jeong

Inventor： Shem Ogadhoh ,  Raguraman Venkatesan ,  Kevin J. Hooker ,  Sungwon Kim ,  Bin Hu ,  Vivek Singh ,  Bikram Baidya ,  Prasad Narendra Atkar ,  Seongtae Jeong

IPC: G03F1/68 ,  G03F1/36

CPC classification number: G03F1/36 ,  G03F1/68 ,  G06F17/50

Abstract: Described herein is mask design and modeling for a set of masks to be successively imaged to print a composite pattern on a substrate, such as a semiconductor wafer. Further described herein is a method of double patterning a substrate with the set of masks. Also described herein is a method of correcting a drawn pattern of one of the mask levels based on a predicted pattern contour of the other of the mask levels. Also described herein is a method of modeling a resist profile contour for a mask level in which photoresist is applied onto a inhomogeneous substrate, as well as method of predicting a resist profile of a Boolean operation of two masks.

Abstract translation: 这里描述的是要连续成像以在诸如半导体晶片的衬底上打印复合图案的一组掩模的掩模设计和建模。 本文进一步描述的是使用该组掩模对衬底进行双重图案化的方法。 这里还描述了一种基于掩模级别中的另一个的预测图案轮廓来校正掩模级中的一个的绘制图案的方法。 本文还描述了一种对光致抗蚀剂施加到非均匀衬底上的掩模级的抗蚀剂轮廓轮廓建模方法，以及预测两个掩模的布尔运算的抗蚀剂轮廓的方法。

公开(公告)号：US20130149638A1

公开(公告)日：2013-06-13

申请号：US13762083

申请日：2013-02-07

Applicant: Shem OGADHOH ,  Raguraman VENKATESAN ,  Kevin J. HOOKER ,  Sungwon KIM ,  Bin HU ,  Vivek SINGH ,  Bikram BAIDYA ,  Prasad NARENDRA ATKAR ,  Seongtae JEONG

Inventor： Shem OGADHOH ,  Raguraman VENKATESAN ,  Kevin J. HOOKER ,  Sungwon KIM ,  Bin HU ,  Vivek SINGH ,  Bikram BAIDYA ,  Prasad NARENDRA ATKAR ,  Seongtae JEONG

IPC: G03F1/36 ,  G06F17/50 ,  G03F1/68

CPC classification number: G03F1/36 ,  G03F1/68 ,  G06F17/50

Abstract: Described herein is mask design and modeling for a set of masks to be successively imaged to print a composite pattern on a substrate, such as a semiconductor wafer. Further described herein is a method of double patterning a substrate with the set of masks. Also described herein is a method of correcting a drawn pattern of one of the mask levels based on a predicted pattern contour of the other of the mask levels. Also described herein is a method of modeling a resist profile contour for a mask level in which photoresist is applied onto a inhomogeneous substrate, as well as method of predicting a resist profile of a Boolean operation of two masks.

Abstract translation: 这里描述的是要连续成像以在诸如半导体晶片的衬底上打印复合图案的一组掩模的掩模设计和建模。 本文进一步描述的是使用该组掩模对衬底进行双重图案化的方法。 这里还描述了一种基于掩模级别中的另一个的预测图案轮廓来校正掩模级中的一个的绘制图案的方法。 本文还描述了一种对光致抗蚀剂施加到非均匀衬底上的掩模级的抗蚀剂轮廓轮廓建模方法，以及预测两个掩模的布尔运算的抗蚀剂轮廓的方法。

公开(公告)号：US08404143B2

公开(公告)日：2013-03-26

申请号：US13402365

申请日：2012-02-22

Applicant: Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

Inventor： Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

IPC: C09K13/00

CPC classification number: H01L21/30625 ,  C09G1/02 ,  H01L21/3212 ,  H01L21/7684

Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.

Abstract translation: 本公开提供了用于化学机械抛光浆料的浓缩物，以及将该浓缩物稀释到使用点浆料的方法。 浓缩物包括研磨剂，络合剂和缓蚀剂，浓缩物用水和氧化剂稀释。 这些组分的存在量使得浓缩物可以以非常高的稀释比稀释，而不影响抛光性能。

公开(公告)号：US20130016465A1

公开(公告)日：2013-01-17

申请号：US13182906

申请日：2011-07-14

Applicant: Bruce John Chamberlin ,  Chang-Min Chu ,  Gao-Bin Hu ,  Joseph Kuczynski ,  Kaspar Ka Chung Tsang

Inventor： Bruce John Chamberlin ,  Chang-Min Chu ,  Gao-Bin Hu ,  Joseph Kuczynski ,  Kaspar Ka Chung Tsang

IPC: G06F1/16 ,  G01R31/28 ,  H05K1/00

CPC classification number: G01N21/80 ,  H05K1/0269 ,  H05K3/22 ,  H05K3/225 ,  H05K3/42 ,  H05K2203/16 ,  H05K2203/161 ,  Y10T29/49004

Abstract: An approach is provided in which a pH-indicating compound is incorporated in a printed circuit board. The printed circuit board includes a number of layers with the pH-sensitive indicator being incorporated in one of the layers. Conductive pathways are formed from a conductive sheet laminated onto an outer surface of the printed circuit board. The printed circuit board is exposed to a pH-activating solution. Plated-through hole defects in the printed circuit board are identified by detecting a color formation at a surface location of the printed circuit board that corresponds to the plated-through hole defect. Another approach is also provided where a pH-activating compound is incorporated in one of the layers of the printed circuit board which is then exposed to a pH-indicating solution to produce the color formation that identifies the location of the plated-through hole defect.

Abstract translation: 提供了其中将pH指示化合物并入印刷电路板中的方法。 印刷电路板包括多个层，其中pH敏感指示器被结合在一个层中。 导电路径由层叠在印刷电路板的外表面上的导电片形成。 将印刷电路板暴露于pH活化溶液。 通过检测印刷电路板的与镀通孔缺陷相对应的表面位置处的颜色形成来识别印刷电路板中的通孔缺陷。 还提供另一种方法，其中将pH活化化合物并入印刷电路板的一个层中，然后暴露于pH指示溶液以产生识别电镀通孔缺陷位置的着色层。