公开(公告)号：US20080136009A1

公开(公告)日：2008-06-12

申请号：US11645150

申请日：2006-12-22

Applicant: Horst Theuss ,  Gottfried Beer

Inventor： Horst Theuss ,  Gottfried Beer

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L21/568 ,  B81B7/007 ,  B81C2203/0109 ,  B81C2203/0154 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

Abstract: A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.

Abstract translation: 公开了一种包括芯片的装置，该芯片保持在铸造化合物中并且布置有中空结构。

公开(公告)号：US20070210883A1

公开(公告)日：2007-09-13

申请号：US11625393

申请日：2007-01-22

Applicant: Gottfried Beer ,  Jochen Dangelmaier ,  Alfred Haimerl ,  Manfred Mengel ,  Klaus Mueller ,  Klaus Pressel

Inventor： Gottfried Beer ,  Jochen Dangelmaier ,  Alfred Haimerl ,  Manfred Mengel ,  Klaus Mueller ,  Klaus Pressel

IPC: H01P3/08

CPC classification number: H05K3/146 ,  B82Y10/00 ,  B82Y30/00 ,  H01L21/4846 ,  H01L23/49838 ,  H01L23/49877 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K3/12 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10S977/712 ,  Y10S977/72 ,  Y10S977/742

Abstract: A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically conductive carbon nanotubes.

Abstract translation: 一种基板，包括具有将接触区域彼此连接的布线图案的带状导体。 带状导体具有小的带状导体宽度。 接触区域和/或带状导体形成窄的连接间距并且包括导电碳纳米管。

公开(公告)号：US20070094982A1

公开(公告)日：2007-05-03

申请号：US11581060

申请日：2006-10-16

Applicant: Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

Inventor： Gottfried Beer ,  Markus Brunnbauer ,  Edward Fuergut

IPC: E04C3/00

CPC classification number: H01L21/561 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82

Abstract: A heat treatment method is provided for a panel. The panel includes a plastic housing composition, in which semiconductor chips are embedded by their rear sides and edge sides, and the top sides of the semiconductor chips form a coplanar area with the plastic housing composition. The panel is fixed by its underside on a holder, and a temperature gradient (ΔT) is then generated between top side and the underside of the panel. The temperature gradient (ΔT) is then maintained for at least one delimited or selected time period. The panel is then cooled to room temperature (TR).

Abstract translation: 为面板提供热处理方法。 面板包括塑料外壳组合物，其中半导体芯片由其后侧和边缘侧嵌入，并且半导体芯片的顶侧与塑料外壳组合物形成共面区域。 面板通过其下侧固定在支架上，然后在面板的顶侧和底面之间产生温度梯度（DeltaT）。 然后将温度梯度（DeltaT）保持至少一个定界或选定的时间段。 然后将面板冷却至室温（T R R）。

公开(公告)号：US20070026567A1

公开(公告)日：2007-02-01

申请号：US11421684

申请日：2006-06-01

Applicant: Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

Inventor： Gottfried Beer ,  Christoph Kienmayer ,  Klaus Pressel ,  Werner Simbuerger

IPC: H01L21/00

CPC classification number: H01L23/66 ,  G01S7/032 ,  G01S19/36 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/44 ,  H01Q9/0407 ,  H01Q9/0457 ,  H01Q19/00 ,  H01Q21/0087 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor module (1) has components (6) for microwave engineering in a plastic casing (7). The semiconductor module (1) has a principal surface (8) with an upper side (9) of a plastic package molding compound (10) and at least one active upper side (11) of a semiconductor chip (12). Disposed on the principal surface (8) is a multilayered conductor track structure (13) which alternately comprises structured metal layers (14, 15) and structured insulation layers (16, 17), where at least one of the insulation layers (16, 17) and/or the plastic package molding compound (10) has at least one microwave insulation region.

Abstract translation: 半导体模块（1）在塑料外壳（7）中具有用于微波工程的部件（6）。 半导体模块（1）具有主表面（8），其具有塑料封装模制化合物（10）的上侧（9）和半导体芯片（12）的至少一个有源上侧面（11）。 设置在主表面（8）上的是多层导体轨道结构（13），其交替地包括结构化金属层（14,15）和结构化绝缘层（16,17），其中至少一个绝缘层（16,17） ）和/或塑料包装模塑料（10）具有至少一个微波绝缘区域。

公开(公告)号：US07101092B2

公开(公告)日：2006-09-05

申请号：US10797365

申请日：2004-03-10

Applicant: Gottfried Beer ,  Thomas Killer

Inventor： Gottfried Beer ,  Thomas Killer

IPC: G02B6/12 ,  G02B6/36

CPC classification number: G02B6/4201 ,  G02B6/4292

Abstract: The invention relates to a module having a circuit carrier and having an electro-optical transducer mounted thereon for coupling in or out optical beams which are fed or conducted away via an optical fiber. The electro-optical transducer has an optical waveguide holder mounted onto a circuit carrier, the end side of which optical waveguide holder has an optoelectronic component having an optically active region, the optically active region being oriented to an optical waveguide receptacle of an optical waveguide holder.

Abstract translation: 本发明涉及一种具有电路载体并具有安装在其上的电光换能器的模块，用于耦合入或输出通过光纤馈送或传导的光束。 电光换能器具有安装在电路载体上的光波导保持器，光波导保持器的端侧具有具有光学活性区域的光电子部件，光学有源区域被定向到光波导保持器的光波导插座 。

公开(公告)号：US07048450B2

公开(公告)日：2006-05-23

申请号：US10890258

申请日：2004-07-14

Applicant: Gottfried Beer ,  Nikolaus Schunk

Inventor： Gottfried Beer ,  Nikolaus Schunk

IPC: G02B6/36

CPC classification number: G02B6/4292 ,  G02B6/4246 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.

Abstract translation: 相对于光纤并相对于电路板的光电模块和用于模块的连接件可以具有光发射器芯片形式的半导体芯片，该发射器芯片具有发光的顶侧，并且具有 后侧接触件作为其后侧的阴极。 另外的半导体芯片以这样的方式嵌入到具有光发射机芯片的塑料组合物中，使得由塑料组合物和有源顶侧形成共面整体顶侧。

公开(公告)号：US6058020A

公开(公告)日：2000-05-02

申请号：US221787

申请日：1998-12-28

Applicant: Jurgen Winterer ,  Gottfried Beer ,  Bernd Stadler

Inventor： Jurgen Winterer ,  Gottfried Beer ,  Bernd Stadler

IPC: H01L23/28 ,  H01L23/047 ,  H01L23/13 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H01L41/053

CPC classification number: H01L23/047 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49861 ,  H05K3/303 ,  H01L2224/05554 ,  H01L2224/056 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10931 ,  Y02P70/613

Abstract: A component housing for surface mounting of a semiconductor component on a component-mounting surface of a printed circuit board. The component housing including a chip carrier made of an electrically insulating material and having an approximately planar chip carrier area, a semiconductor chip, preferably having an integrated electronic circuit, secured on the chip carrier area, and electrode terminals having a surface-mountable configuration. The electrode terminals penetrating through the chip carrier and electrically connected to the semiconductor chip. A distance between the component-mounting surface of the printed circuit board and outer delimiting areas of the chip carrier which face the component-mounting surface of the printed circuit board increases continuously from an edge region to a central region of the chip carrier.

Abstract translation: 一种用于将半导体部件表面安装在印刷电路板的部件安装表面上的部件壳体。 所述部件壳体包括由电绝缘材料制成并且具有大致平坦的芯片载体区域的芯片载体，固定在芯片载体区域上的优选具有集成电子电路的半导体芯片，以及具有可表面安装的构造的电极端子。 电极端子穿过芯片载体并电连接到半导体芯片。 印刷电路板的部件安装面与面向印刷电路板的部件安装面的芯片载体的外部限定区域之间的距离从芯片载体的边缘区域到中心区域连续地增加。