公开(公告)号：US08575739B2

公开(公告)日：2013-11-05

申请号：US13102291

申请日：2011-05-06

申请人： Suresh Upadhyayula ,  Ming Hsun Lee ,  Hem Takiar

发明人： Suresh Upadhyayula ,  Ming Hsun Lee ,  Hem Takiar

IPC分类号： H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.

摘要翻译： 公开了一种半导体封装，其包括引线框架，存储器管芯和控制器管芯，其中一个或多个被定制以促进存储器和控制器管芯接合焊盘经由引线框架将电连接到主机设备的接触焊盘。 通过定制引线框，存储管芯和控制器管芯中的一个或多个，可以省略通常需要将半导体封装中的管芯与主机器件连接的插入层。

公开(公告)号：US08110439B2

公开(公告)日：2012-02-07

申请号：US12614998

申请日：2009-11-09

申请人： Cheeman Yu ,  Chi-Chin Liao ,  Hem Takiar

发明人： Cheeman Yu ,  Chi-Chin Liao ,  Hem Takiar

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/30

CPC分类号： H01L24/49 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S438/977 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.

摘要翻译： 公开了一种包括多个堆叠的半导体封装的电子部件。 第一个这样的实施例包括用于电耦合堆叠的半导体封装的内部连接器。 第二个这样的实施例包括用于电耦合堆叠的半导体封装的外部连接器。

公开(公告)号：US08058099B2

公开(公告)日：2011-11-15

申请号：US11770052

申请日：2007-06-28

申请人： Cheemen Yu ,  Vani Verma ,  Hem Takiar

发明人： Cheemen Yu ,  Vani Verma ,  Hem Takiar

IPC分类号： H01L21/00

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. In embodiments, a semiconductor die having die bond pads along two adjacent edges may be electrically coupled to four sides of a four-sided leadframe. Embodiments relate to lead and no-lead type leadframe.

摘要翻译： 公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 在实施例中，具有沿两个相邻边缘的管芯接合焊盘的半导体管芯可以电耦合到四面引线框架的四个侧面。 实施例涉及引线和无引线型引线框架。

公开(公告)号：US08022417B2

公开(公告)日：2011-09-20

申请号：US12901787

申请日：2010-10-11

申请人： Hem Takiar ,  Suresh Upadhyayula

发明人： Hem Takiar ,  Suresh Upadhyayula

IPC分类号： H01L27/15 ,  H01L29/161 ,  H01L31/12 ,  H01L31/153 ,  H01L33/00

CPC分类号： H01L24/97 ,  H01L25/167 ,  H01L2224/48227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  Y10T29/49002 ,  H01L2924/00

摘要： Methods of forming integrated circuit packages having an LED molded into the package, and the integrated circuit package formed thereby. An integrated circuit including one or more semiconductor die, passive components and an LED may be assembled on a panel. The one or more semiconductor die, passive components and LED may all then be encapsulated in a molding compound, and the integrated circuits then singularized to form individual integrated circuit packages. The integrated circuits are cut from the panel so that a portion of the lens of the LED is severed during the singularization process, and an end of the lens remaining within the package lies flush with an edge of the package to emit light outside of the package.

摘要翻译： 形成具有模制到封装中的LED的集成电路封装的方法和由此形成的集成电路封装。 包括一个或多个半导体管芯，无源部件和LED的集成电路可以组装在面板上。 一个或多个半导体管芯，无源部件和LED可以随后被封装在模制化合物中，然后将集成电路单数化以形成单独的集成电路封装。 集成电路从面板切割，使得在奇异化处理期间LED的透镜的一部分被切断，并且保留在封装内的透镜的端部与封装的边缘齐平以在封装外部发光 。

公开(公告)号：US07772107B2

公开(公告)日：2010-08-10

申请号：US11538220

申请日：2006-10-03

申请人： Cheemen Yu ,  Hem Takiar ,  Chih-Chin Liao

发明人： Cheemen Yu ,  Hem Takiar ,  Chih-Chin Liao

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/4846 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/48091 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014

摘要： Methods of forming a semiconductor package including a single-sided substrate are disclosed. In a first embodiment of the present invention, a substrate may include a conductive layer on a top surface of the substrate, i.e., on the same side of the substrate as where the die are mounted. In a second embodiment of the present invention, a substrate may include a conductive layer on a bottom of the substrate, i.e., on the opposite side of the substrate as where the die are mounted.

摘要翻译： 公开了形成包括单面基板的半导体封装的方法。 在本发明的第一实施例中，衬底可以在衬底的顶表面上，即在衬底的与安装裸片相同的一侧上包括导电层。 在本发明的第二实施例中，衬底可以包括在衬底的底部上的导电层，即衬底的安装模具的相反侧。

公开(公告)号：US07745234B2

公开(公告)日：2010-06-29

申请号：US12165383

申请日：2008-06-30

申请人： King Hoo Ong ,  Robertito Piaduche ,  Ning Ye ,  Hem Takiar

发明人： King Hoo Ong ,  Robertito Piaduche ,  Ning Ye ,  Hem Takiar

IPC分类号： H01L21/70

CPC分类号： H01L23/5382 ,  H01L24/98 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2224/48 ,  H01L2924/00

摘要： A method of forming a semiconductor card. A semiconductor package having a damaged controller die is reclaimed. The reclaim process includes severing the electrical connections between the controller die and the semiconductor package substrate without exposing the passive component. In one embodiment, the cutting tool comprises a saw blade. An electrically insulating material is deposited over the exposed bond wires to complete the reclaim process. The reclaimed package and a new controller die are affixed to a second substrate to electrically couple the memory die of the reclaimed package with the new controller die—forming a new package. The new package is encapsulated to form a new memory card.

摘要翻译： 一种形成半导体卡的方法。 回收具有损坏的控制器管芯的半导体封装。 回收过程包括切断控制器管芯和半导体封装衬底之间的电连接，而不暴露被动元件。 在一个实施例中，切割工具包括锯片。 电绝缘材料沉积在暴露的接合线上以完成回收过程。 将回收的包装和新的控制器管芯固定到第二基板上以将再生包装的存储管芯与新的控制器电连接，从而形成新的封装。 新封装封装形成新的存储卡。

公开(公告)号：US07728411B2

公开(公告)日：2010-06-01

申请号：US11354441

申请日：2006-02-15

申请人： Ming Hsun Lee ,  Cheemen Yu ,  Hem Takiar

发明人： Ming Hsun Lee ,  Cheemen Yu ,  Hem Takiar

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/4951 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of fabricating a semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package may include one or more semiconductor die having die attach pads along a single side. The leadframe may include a plurality of elongated electrical leads, extending from a first side of the leadframe, beneath the die, and terminating at a second side of the leadframe adjacent to the bond pads along the single edge of the die. The leadframe may further include a dielectric spacer layer on the elongated leads. Spacing the semiconductor die from the elongated leads using the spacer layer reduces the parasitic capacitance and/or inductance of the semiconductor package formed thereby.

摘要翻译： 公开了制造半导体封装的方法和由此形成的半导体封装。 半导体封装可以包括一个或多个半导体管芯，其具有沿着单侧的管芯附接焊盘。 引线框架可以包括多个细长的电引线，从引线框架的第一侧延伸到管芯下方，并且沿着模具的单个边缘终止在与引线框架相邻的接合焊盘的第二侧。 引线框架还可以包括细长引线上的电介质间隔层。 使用间隔层从细长引线间隔半导体管芯减小了由此形成的半导体封装的寄生电容和/或电感。

公开(公告)号：US20100052155A1

公开(公告)日：2010-03-04

申请号：US12614945

申请日：2009-11-09

申请人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

发明人： Che-Jung Chang ,  Chin-Tien Chiu ,  Cheeman Yu ,  Hem Takiar ,  Jack Chang Chien ,  Ning Liu

IPC分类号： H01L23/04

CPC分类号： G06K19/077 ,  B29C45/14311 ,  B29C45/14647 ,  B29C2045/14327 ,  G06K19/07724 ,  G06K19/07732 ,  H01L23/10 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

摘要翻译： 公开了一种闪存卡及其制造方法。 卡包括制造成接收单面或双面盖的半导体封装。 半导体封装的表面可以形成有孔，沟槽和/或戳记。 在形成孔，沟和/或标记之后，可以在注射成型工艺中将盖子附接到包装表面。 在注射成型过程中，熔融的塑料流入与半导体封装的表面互连的孔，沟槽和/或戳痕。 因此，当熔融塑料硬化时，孔，沟槽和/或戳痕确保盖保持牢固地附接到半导体封装。

公开(公告)号：US20090325321A1

公开(公告)日：2009-12-31

申请号：US12165383

申请日：2008-06-30

申请人： KH Ong ,  Robertito Piaduche ,  Ning Ye ,  Hem Takiar

发明人： KH Ong ,  Robertito Piaduche ,  Ning Ye ,  Hem Takiar

IPC分类号： H01L21/70

CPC分类号： H01L23/5382 ,  H01L24/98 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2224/48 ,  H01L2924/00

摘要： A method of forming a semiconductor card. A semiconductor package having a damaged controller die is reclaimed. The reclaim process includes severing the electrical connections between the controller die and the semiconductor package substrate without exposing the passive component. In one embodiment, the cutting tool comprises a saw blade. An electrically insulating material is deposited over the exposed bond wires to complete the reclaim process. The reclaimed package and a new controller die are affixed to a second substrate to electrically couple the memory die of the reclaimed package with the new controller die—forming a new package. The new package is encapsulated to form a new memory card.

摘要翻译： 一种形成半导体卡的方法。 回收具有损坏的控制器管芯的半导体封装。 回收过程包括切断控制器管芯和半导体封装衬底之间的电连接，而不暴露被动元件。 在一个实施例中，切割工具包括锯片。 电绝缘材料沉积在暴露的接合线上以完成回收过程。 将回收的包装和新的控制器管芯固定到第二基板上以将再生包装的存储管芯与新的控制器电连接，从而形成新的封装。 新封装封装形成新的存储卡。

公开(公告)号：US20090166828A1

公开(公告)日：2009-07-02

申请号：US11966303

申请日：2007-12-28

申请人： Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

发明人： Suresh Upadhyayula ,  Bonnie Ming-Yan Chan ,  Shih-Ping Fan-chiang ,  Hem Takiar

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.

摘要翻译： 公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 半导体封装包括引线框和固定到引线框的管芯焊盘的一个或多个半导体管芯。 引线框形成有多个电端子，其表面安装到主机PCB。 引线框还包括一个或多个延伸导线，其中至少一个包括导电岛，该导电岛用电端子表面安装到主机PCB。 岛屿有效地增加了封装内的数字端子，而不会增加封装的占位面积。