公开(公告)号：US10513049B2

公开(公告)日：2019-12-24

申请号：US14414651

申请日：2014-11-02

申请人： Kai Liu

发明人： Kai Liu

IPC分类号： B28B11/24 ,  B01J3/04 ,  F22B1/00 ,  F22B33/18 ,  F24S90/00 ,  F24S10/40 ,  A61L2/07

摘要： The present invention discloses a pump-type autoclave system and a providing method for steam and pressure thereof, wherein the pump-type autoclave system comprises an autoclave, a steam providing device and a compressor, said steam providing device comprises a water storage container and a heating device used for heating said water storage container, said water storage container, the compressor and the autoclave are connected through a pipeline to form a closed loop, an inlet of the compressor is connected with a steam output port of the water storage container, an outlet of the compressor is connected to a steam input port of the autoclave, and a condensate water drain outlet of the autoclave is connected to the water storage container. The present invention uses the compressor to depressurize an intermediate-low temperature water source to obtain steam, and the steam is pumped into the autoclave and condensed to release heat to obtain corresponding temperature and pressure. Since the present invention fully utilizes a great amount of low-cost intermediate-low temperature heat sources obtained from natural, industrial or living waste heat to provide needed high temperature, steam and pressure to the autoclave system, the energy is saved.

公开(公告)号：US09571489B2

公开(公告)日：2017-02-14

申请号：US13209212

申请日：2011-08-12

申请人： Nobukazu Sugiyama ,  Kai Liu ,  Ludovic Douillet ,  Lobrenzo Wingo

发明人： Nobukazu Sugiyama ,  Kai Liu ,  Ludovic Douillet ,  Lobrenzo Wingo

IPC分类号： H04L29/06 ,  G06F21/57

CPC分类号： H04L63/0853 ,  G06F21/572 ,  H04L63/083 ,  H04L63/168

摘要： According to one embodiment of the invention, a method for secured execution of commands is described. Initially, a second electronic device authenticates a first electronic device and registers the first electronic device as a trusted device. Thereafter, up receipt of a message with one or more embedded commands, such commands are executed without any pre-established communication protocol if the message is from the registered first electronic device.

摘要翻译： 根据本发明的一个实施例，描述了用于安全执行命令的方法。 最初，第二电子设备认证第一电子设备并将第一电子设备注册为可信设备。 此后，如果消息来自注册的第一电子设备，则在没有任何预先建立的通信协议的情况下执行具有一个或多个嵌入式命令的消息的接收，这样的命令被执行。

公开(公告)号：US20150102425A1

公开(公告)日：2015-04-16

申请号：US14052711

申请日：2013-10-12

申请人： Ming Sun ,  Kai Liu ,  Xiao Tian Zhang ,  Yueh Se Ho ,  Leeshawn Luo

发明人： Ming Sun ,  Kai Liu ,  Xiao Tian Zhang ,  Yueh Se Ho ,  Leeshawn Luo

IPC分类号： H01L23/495 ,  H01L29/78 ,  H01L29/66 ,  H01L23/00

CPC分类号： H01L23/49562 ,  H01L23/492 ,  H01L23/4928 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/97 ,  H01L29/66477 ,  H01L29/78 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83895 ,  H01L2224/97 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/014

摘要： A power device package for containing, protecting and providing electrical contacts for a power transistor includes a top and bottom lead frames for directly no-bump attaching to the power transistor. The power transistor is attached to the bottom lead frame as a flip-chip with a source contact and a gate contact directly no-bumping attaching to the bottom lead frame. The power transistor has a bottom drain contact attaching to the top lead frame. The top lead frame further includes an extension for providing a bottom drain electrode substantially on a same side with the bottom lead frame. In a preferred embodiment, the power device package further includes a joint layer between device metal of source, gate or drain and top or bottom lead frame, through applying ultrasonic energy.

摘要翻译： 用于容纳，保护和提供用于功率晶体管的电触头的功率器件封装包括用于直接不连接到功率晶体管的顶部和底部引线框架。 功率晶体管作为具有源极接触的倒装芯片附接到底部引线框架，并且栅极接触件直接地不连接到底部引线框架上。 功率晶体管具有附接到顶部引线框架的底部漏极接触。 顶部引线框架还包括用于提供与底部引线框架基本上在同一侧上的底部漏极电极的延伸部分。 在优选实施例中，功率器件封装还包括通过施加超声波能量的源极，栅极或漏极以及顶部或底部引线框架的器件金属之间的接合层。

公开(公告)号：US08981866B2

公开(公告)日：2015-03-17

申请号：US13571068

申请日：2012-08-09

申请人： Robert C. Frye ,  Kai Liu

发明人： Robert C. Frye ,  Kai Liu

IPC分类号： H03H7/42 ,  H01L23/522 ,  H01P5/10

CPC分类号： H01L23/5227 ,  H01L23/5223 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device has an RF balun formed over a substrate. The RF balun includes a first conductive trace wound to exhibit inductive properties with a first end coupled to a first terminal of the semiconductor device and second end coupled to a second terminal of the semiconductor device. A first capacitor is coupled between the first and second ends of the first conductive trace. A second conductive trace is wound to exhibit inductive properties with a first end coupled to a third terminal of the semiconductor device and second end coupled to a fourth terminal of the semiconductor device. The first conductive trace is formed completely within the second conductive trace. The first conductive trace and second conductive trace can have an oval, circular, or polygonal shape separated by 50 micrometers. A second capacitor is coupled between the first and second ends of the second conductive trace.

摘要翻译： 半导体器件具有在衬底上形成的RF平衡 - 不平衡变压器。 RF平衡 - 不平衡变压器包括缠绕以显示感应特性的第一导电迹线，其中第一端耦合到半导体器件的第一端子，第二端耦合到半导体器件的第二端子。 第一电容器耦合在第一导电迹线的第一和第二端之间。 第二导电迹线被卷绕以呈现感应特性，其中第一端耦合到半导体器件的第三端子，第二端耦合到半导体器件的第四端子。 第一导电迹线完全在第二导电迹线内形成。 第一导电迹线和第二导电迹线可以具有由50微米分开的椭圆形，圆形或多边形形状。 第二电容器耦合在第二导电迹线的第一端和第二端之间。

公开(公告)号：US08921127B2

公开(公告)日：2014-12-30

申请号：US13426576

申请日：2012-03-21

申请人： Robert C. Frye ,  Kai Liu

发明人： Robert C. Frye ,  Kai Liu

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： G01R31/2858 ,  G01R31/048 ,  G01R31/2853 ,  H01L21/561 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/81805

摘要： A semiconductor device has a substrate and conductive layer over the substrate. A resistive element is formed between first and second portions of the conductive layer. A plurality of semiconductor die each with first and second bumps is mounted to the substrate with the first and second bumps electrically connected to the first and second portions of the conductive layer. A test current is routed in sequence through the first portion of the conductive layer, through the first and second bumps, and through the second portion of the conductive layer until continuity failure of the second bump. The test current originates from a single power supply. The test current continues to flow through the resistive element after the continuity failure of the second bump. The continuity failure can be detected by sensing an increase in voltage across the second bump.

摘要翻译： 半导体器件在衬底上具有衬底和导电层。 在导电层的第一和第二部分之间形成电阻元件。 每个具有第一和第二凸块的多个半导体管芯被安装到基板上，其中第一和第二凸块电连接到导电层的第一和第二部分。 测试电流依次穿过导电层的第一部分，穿过第一和第二凸起，并穿过导电层的第二部分，直到第二凸块的连续性故障。 测试电流来自单个电源。 在第二凸块的连续性故障之后，测试电流继续流过电阻元件。 可以通过感测跨越第二凸块的电压的增加来检测连续性故障。

公开(公告)号：US08895147B2

公开(公告)日：2014-11-25

申请号：US13450737

申请日：2012-04-19

申请人： Kai-Li Jiang ,  Chen Feng ,  Lin Xiao ,  Zhuo Chen ,  Liang Liu ,  Shou-Shan Fan ,  Qun-Qing Li ,  Li Qian ,  Kai Liu ,  Yang Wei

发明人： Kai-Li Jiang ,  Chen Feng ,  Lin Xiao ,  Zhuo Chen ,  Liang Liu ,  Shou-Shan Fan ,  Qun-Qing Li ,  Li Qian ,  Kai Liu ,  Yang Wei

IPC分类号： B32B9/00 ,  G06F3/045 ,  B82Y30/00

CPC分类号： G06F3/045 ,  B82Y30/00 ,  Y10T428/26 ,  Y10T428/30

摘要： An elastic device includes a first elastic supporter; a second elastic supporter and a carbon nanotube film. The second elastic supporter is spaced from the first elastic supporter. The carbon nanotube film has a first side fixed on the first elastic supporter and a second side opposite to the first side and fixed on the second elastic supporter. The carbon nanotube film includes a plurality of first carbon nanotubes orientated primarily along a first direction and a plurality of second carbon nanotubes having orientations different from the first direction. At least one portion of each of the second carbon nanotubes contacts with at least two adjacent first carbon nanotubes. The carbon nanotube film is capable of elastic deformation along a second direction that is substantially perpendicular to the first direction.

摘要翻译： 弹性装置包括第一弹性支撑件; 第二弹性支撑体和碳纳米管膜。 第二弹性支撑件与第一弹性支撑件间隔开。 碳纳米管膜具有固定在第一弹性支撑体上的第一侧和与第一侧相反的第二侧并且固定在第二弹性支撑体上。 碳纳米管膜包括主要沿着第一方向取向的多个第一碳纳米管和具有与第一方向不同的取向的多个第二碳纳米管。 每个第二碳纳米管的至少一部分与至少两个相邻的第一碳纳米管接触。 碳纳米管膜能够沿着与第一方向基本垂直的第二方向弹性变形。

公开(公告)号：US08874236B2

公开(公告)日：2014-10-28

申请号：US13096209

申请日：2011-04-28

申请人： Kai Liu ,  Li Fan ,  Ying-Hui Sun ,  Wen-Mei Zhao

发明人： Kai Liu ,  Li Fan ,  Ying-Hui Sun ,  Wen-Mei Zhao

IPC分类号： A61N1/00 ,  A61N1/05 ,  B82Y30/00

CPC分类号： A61N1/0529 ,  B82Y30/00

摘要： A pacemaker lead includes a body and an insulation layer. The body includes at least one carbon nanotube yarn. The at least one carbon nanotube yarn includes a plurality of carbon nanotubes. The carbon nanotubes are interconnected along an axis of the body by van der Waals force. The insulation layer covers an outer surface of the body.

摘要翻译： 起搏器引线包括主体和绝缘层。 身体包括至少一个碳纳米管纱线。 至少一个碳纳米管纱线包括多个碳纳米管。 碳纳米管通过范德华力沿身体的轴线互连。 绝缘层覆盖主体的外表面。

公开(公告)号：US08859895B2

公开(公告)日：2014-10-14

申请号：US13395112

申请日：2010-05-05

申请人： Zhusen Sun ,  Qiang Zhang ,  Minghua Li ,  Zhijun Li ,  Ting Liu ,  Feng Huo ,  Min Dai ,  Kai Liu ,  Xiong Wu ,  Dingxie Gu ,  Peihong Zhou ,  Ying Lou ,  Zhenqiang Li ,  Huiwen He

发明人： Zhusen Sun ,  Qiang Zhang ,  Minghua Li ,  Zhijun Li ,  Ting Liu ,  Feng Huo ,  Min Dai ,  Kai Liu ,  Xiong Wu ,  Dingxie Gu ,  Peihong Zhou ,  Ying Lou ,  Zhenqiang Li ,  Huiwen He

IPC分类号： H02G13/00 ,  H01R4/66 ,  H02G7/20 ,  H02G3/04

CPC分类号： H02G7/205 ,  H02G3/0481

摘要： A method for vertically grounding and leading down form a center of a composite pole tower includes the following steps: extending a ground down-leading wire from a center of a ground wire cross arm which is made of metal and is positioned on top of the pole tower, wherein the ground down-leading wire is vertically leaded down to the earth form the center of the composite pole tower, wherein when an lower portion of the tower body is a metal pipe, the ground down-leading wire is extended from the center of the composite material and is directly connected to the metal pipe. The method utilizes the advantage of the insulating intensity of the wall of the composite pole tower and enhances the insulating intensity of the transmission line on impact of lightning. The ground down-leading wires are prevented from short-circuiting with the tower body of the composite pole tower, so that advantage of the insulating property of the composite material of the pole towers is realized. Since the ground down-leading wire is penetrated through center of the pole tower, so that the ground down-leading wires are not exposed and are prevented from destroying by external force. And also the method is easy and simple for application.

摘要翻译： 将复合极塔的中心垂直接地和引导向下的方法包括以下步骤：将地面下降的导线从金属制成的地线交叉臂的中心延伸并位于极的顶部 塔，其中地下引线垂直引导到复合极塔的中心的地面，其中当塔体的下部是金属管时，地下导线从中心延伸 的复合材料，并直接连接到金属管。 该方法利用了复合极塔壁绝缘强度的优点，提高了雷击冲击下输电线路的绝缘强度。 防止地面下降的导线与复合极塔的塔体发生短路，从而实现了极塔复合材料绝缘性能的优点。 由于地面下降的导线穿过极塔的中心，使得地面下降的导线不被暴露，并且防止被外力破坏。 而且该方法简单易用。

公开(公告)号：US08815397B2

公开(公告)日：2014-08-26

申请号：US12583387

申请日：2009-08-20

申请人： Kai-Li Jiang ,  Chen Feng ,  Lin Xiao ,  Zhuo Chen ,  Liang Liu ,  Shou-Shan Fan ,  Qun-Qing Li ,  Li Qian ,  Kai Liu ,  Yang Wei

发明人： Kai-Li Jiang ,  Chen Feng ,  Lin Xiao ,  Zhuo Chen ,  Liang Liu ,  Shou-Shan Fan ,  Qun-Qing Li ,  Li Qian ,  Kai Liu ,  Yang Wei

IPC分类号： B32B9/00

CPC分类号： G06F3/045 ,  B82Y10/00 ,  B82Y30/00 ,  Y10T428/30

摘要： A carbon nanotube film includes a plurality of carbon nanotube strings and one or more carbon nanotubes. The plurality of carbon nanotube strings are separately arranged and located side by side. Distances between adjacent carbon nanotube strings are changed when a force is applied. One or more carbon nanotubes are located between adjacent carbon nanotube strings.

摘要翻译： 碳纳米管膜包括多个碳纳米管串和一个或多个碳纳米管。 多个碳纳米管串分开布置并并排设置。 施加力时，相邻碳纳米管柱之间的距离发生变化。 一个或多个碳纳米管位于相邻的碳纳米管串之间。

公开(公告)号：US08803630B2

公开(公告)日：2014-08-12

申请号：US12579299

申请日：2009-10-14

申请人： Kai Liu ,  Robert Charles Frye

发明人： Kai Liu ,  Robert Charles Frye

IPC分类号： H03H7/42 ,  H01P3/08 ,  H01F17/00

CPC分类号： H03H7/42 ,  H01F17/0013 ,  H03H7/1775 ,  Y10T29/4902 ,  Y10T29/49071

摘要： A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil.