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公开(公告)号：US20090072387A1
公开(公告)日：2009-03-19
申请号：US11857812
申请日：2007-09-19
IPC分类号： H01L23/34
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译： 一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入 曲线特征及其组合。 包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。
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92.发明申请Optimized Thermally Conductive Plate and Attachment Method for Enhanced Thermal Performance and Reliability of Flip Chip Organic Packages 有权优化的导热板和附着方法，用于增强热性能和倒装芯片有机封装的可靠性公开(公告)号：US20080303021A1
公开(公告)日：2008-12-11
申请号：US12116655
申请日：2008-05-07
申请人： Jeffrey T. Coffin , Michael A. Gaynes , David L. Questad , Kamal K. Sikka , Hilton T. Toy , Jamil A. Wakil
发明人： Jeffrey T. Coffin , Michael A. Gaynes , David L. Questad , Kamal K. Sikka , Hilton T. Toy , Jamil A. Wakil
IPC分类号： G01R31/28
CPC分类号： H01L23/34 , H01L23/3735 , H01L23/42 , H01L2224/73204 , H01L2224/73253 , H01L2924/3511 , Y10T29/49004 , Y10T29/49083 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49135 , Y10T29/4935
摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.
摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。
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公开(公告)号：US07079393B2
公开(公告)日：2006-07-18
申请号：US10904555
申请日：2004-11-16
申请人： Evan G. Colgan , Frank L. Pompeo , Glenn G. Daves , Hilton T. Toy , Bruce K. Furman , David L. Edwards , Michael A. Gaynes , Mukta G. Farooq , Sung K. Kang , Steven P. Ostrander , Jaimal M. Williamson , Da-Yuan Shih , Donald W. Henderson
发明人： Evan G. Colgan , Frank L. Pompeo , Glenn G. Daves , Hilton T. Toy , Bruce K. Furman , David L. Edwards , Michael A. Gaynes , Mukta G. Farooq , Sung K. Kang , Steven P. Ostrander , Jaimal M. Williamson , Da-Yuan Shih , Donald W. Henderson
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要： A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.
摘要翻译： 提供了一种用于组件载体上的电子部件的冷却系统。 该系统包括框架，喷雾歧管和密封构件。 框架具有开口并且可连接到部件载体，使得在开口和电子部件之间限定环形区域。 喷雾歧管被密封在开口上以限定电子部件的后表面上方的喷射区域。 喷雾歧管在后表面喷洒冷却液。 密封构件密封环形区域，使得部件载体上的输入/输出连接器与冷却流体隔离。
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公开(公告)号：US06981880B1
公开(公告)日：2006-01-03
申请号：US10873037
申请日：2004-06-22
IPC分类号： H01R9/09
CPC分类号： H01R13/2414 , H01R12/714 , H01R13/2407 , H05K7/1069
摘要： A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.
摘要翻译： 一种用于通过插入件布置中的弹性导线将电子模块与衬底相互连接的方法和装置。 具有孔阵列的绝缘材料的载体层，被布置成与电子模块上的电焊盘和基板上的电触点对准，每个保持例如弹性填充的电线连接器。 每个连接器延伸穿过提供的并超出载体层的上表面和下表面的孔。 每个弹性填充的电线连接器和孔被具有充分可变形的弹性体绝缘材料封装，从而允许所述弹性填充电线连接器在施加来自每个侧面的法向力时变形，以将连接器压入其孔。 封装防止在处理时填充电线连接器的损坏或污迹。
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公开(公告)号：US06949415B2
公开(公告)日：2005-09-27
申请号：US10787471
申请日：2004-02-26
CPC分类号： H01L23/16 , H01L23/10 , H01L2224/16 , H01L2224/73253 , H01L2924/01012 , H01L2924/01019 , H01L2924/16195
摘要： A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.
摘要翻译： 一种用于将盖板粘合地耦合到半导体器件的方法和结构。 半导体器件电耦合到衬底。 围绕半导体器件的加强环粘合地耦合到衬底。 分别使用第一和第二粘合剂将覆盖板粘合地耦合到半导体器件的顶表面和加强环的顶表面。 第一粘合剂的模量小于第二粘合剂的模量。
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公开(公告)号：US06893591B2
公开(公告)日：2005-05-17
申请号：US10191061
申请日：2002-07-10
IPC分类号： H01L21/00 , H01L23/36 , H01L23/373 , B28B7/14
CPC分类号： H01L21/67132 , H01L23/36 , H01L23/3737 , H01L2924/0002 , Y10T428/24479 , H01L2924/00
摘要： Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.
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公开(公告)号：US06427323B2
公开(公告)日：2002-08-06
申请号：US09859690
申请日：2001-05-17
IPC分类号： H05K336
CPC分类号： H05K3/325 , H05K3/4614 , H05K2201/0373 , H05K2201/09536 , H05K2201/10666 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165 , Y10T29/49194
摘要： A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.”
摘要翻译： 提供了一种用于连接电子电路封装中的两个导电层的方法，包括以下步骤：在第一导电层的选定区域上形成枝晶，在第二导电层的选定区域上形成枝晶，在第一导电层上施加环氧粘合剂材料 并且将第二导电层压缩附接到第一导电层，使得第一导电层上的枝晶与第二导电层上的枝晶接触。 还要求保护的是包括用于根据本发明制造的电互连的树突的电子电路封装。 本发明的替代实施例利用具有树突的中间表面金属代替“通孔”。
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公开(公告)号：US06369452B1
公开(公告)日：2002-04-09
申请号：US09361723
申请日：1999-07-27
IPC分类号： H01L2348
CPC分类号： H01L23/3142 , H01L23/4334 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/00 , H01L2224/0401
摘要： An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.
摘要翻译： 可与电子组件（例如芯片）结合的电子结构。 电子结构可以通过使用结构环氧树脂粘合剂连接到诸如芯片的电子组件。 电子结构包括金属板上的矿物层和矿物层上的粘附促进剂层。 金属板包括金属物质，其包括具有或不具有金属涂层的纯金属。 金属物质可以包括诸如不锈钢，铝，钛，铜，镀有镍的铜和涂有铬的铜等物质。 矿物层包括衍生自矿物的化合物; 例如来自石英的二氧化硅（SiO 2）。 这样的化合物可以包括二氧化硅，氮化硅和碳化硅等物质。 化合物可以以结晶或无定形形式存在。 粘合促进剂可以包括诸如硅烷，钛酸盐，锆酸盐和铝酸盐的化学物质。
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公开(公告)号：US6087021A
公开(公告)日：2000-07-11
申请号：US86399
申请日：1998-05-28
CPC分类号： H01L24/31 , B23K35/0244 , H01L24/29 , H01L24/83 , H05K3/321 , B23K35/26 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29409 , H01L2224/29411 , H01L2224/8319 , H01L2224/838 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H05K2201/0218 , H05K2203/0425 , Y10T428/12014 , Y10T428/12181 , Y10T428/12569 , Y10T428/12646 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903
摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.
摘要翻译： 提供了在两个表面上的焊盘之间形成冶金结合的技术。 放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。 第一和第二种金属包括低熔点成分。 两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。 基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。 提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。 核心金属和涂覆金属一起包括低熔点成分。 以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。 含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。 将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相 材料和贱金属进入涂料。
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公开(公告)号：US6043110A
公开(公告)日：2000-03-28
申请号：US225268
申请日：1999-01-05
IPC分类号： H01L23/433 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/433 , H01L2924/0002
摘要： Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Volume and thickness of the bond are controlled by the inclusion of a wire mesh embedded in a preform or through which the thermoplastic adhesive is pressed during bonding. The wire mesh also increases heat transfer through the adhesive in a regulated and even manner over the area of the bond or any desired portion thereof. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.
摘要翻译： 热塑性粘合剂预成型件的弯曲表面提供改进的气体加热和排除调节，因为待粘合的表面被加热并压靠在热塑性粘合剂预型件上。 结合体的体积和厚度通过包含嵌入在预成型体中的丝网来控制，或者在粘结期间通过该金属网挤压热塑性粘合剂。 丝网还可以在粘合区域或其任何所需部分上以均匀的方式增加通过粘合剂的热传递。 可以将微粒或丝状材料加入到热塑性粘合剂中以调节热膨胀系数或进一步增加通过粘合剂或两者的热传递。 优选地通过模制来制造预成型件，优选地与从完全粘结的大致相同厚度的幅材对所需体积的预成型件进行模切而成型。
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