公开(公告)号：US5909837A

公开(公告)日：1999-06-08

申请号：US853877

申请日：1997-05-09

Applicant: Ali Reza Safabakhsh ,  John Joseph Kilgarriff

Inventor： Ali Reza Safabakhsh ,  John Joseph Kilgarriff

IPC: B23K1/005 ,  B23K3/04 ,  B23K20/00 ,  H05K13/04 ,  B32B31/20 ,  B32B31/26

CPC classification number: H01L24/78 ,  B23K1/0053 ,  B23K20/004 ,  B23K3/04 ,  H05K13/0408 ,  B23K2201/36 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01039 ,  H01L2924/01082

Abstract: In a pick and place machine of the type having an X-Y movable bond head there is provided a vertically movable pick up tool in the bond head having a tip for picking up and placing a device. The tip of the bonding tool is mounted opposite a radiant heating element which is juxtaposed and separated from the tip of the bonding tool. The tip of the bonding tool is heated to a predetermined control temperature with the radiant energy heating element and during a bonding operation it incurs some cooling. The amount of cooling is calculated by the time and the length of the extension of the bonding tool from its heating element and a computer controller calculates a compensation factor over a predetermined fixed time which includes retracting the bonding tool tip a predetermined vertical distance into the heater to reheat the tool and compensate for the amount of cooling that occurred during the pick and place operation.

Abstract translation: 在具有X-Y可移动接合头的拾取和放置机器中，在接合头中设置有用于拾取和放置装置的尖端的可垂直移动的拾取工具。 焊接工具的尖端与辐射加热元件相对安装，辐射加热元件与焊接工具的尖端并置并分离。 用辐射能量加热元件将接合工具的尖端加热至预定的控制温度，并且在接合操作期间，它引起一些冷却。 冷却量根据焊接工具从其加热元件的延伸的时间和长度计算，并且计算机控制器在预定的固定时间内计算补偿系数，该预定固定时间包括将接合工具尖端缩回到加热器中的预定垂直距离 以重新加热工具并补偿在拾取和放置操作期间发生的冷却量。

公开(公告)号：US5860582A

公开(公告)日：1999-01-19

申请号：US762723

申请日：1996-12-10

Applicant: William Sund

Inventor： William Sund

IPC: B23K1/012 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: H05K3/3468 ,  B23K1/012 ,  B23K1/08 ,  B23K3/0669 ,  B23K2201/36 ,  H05K2203/0763 ,  H05K2203/086 ,  H05K3/3447

Abstract: An inert atmosphere spot soldering process and apparatus uses pockets arranged to match the arrangement of the terminals to be soldered. The pockets are filled to over flowing with liquid solder by lowering the pockets below the surface of the molten solder in a solder pot. A flow of hot inert gas is provided through orifices adjacent the pockets. The terminals and their surrounding area are exposed to the hot inert gas for a period sufficient to drive off substantially all volatile liquids and the terminals are then immersed in the solder to a depth determined by the menicus of the solder in the pockets. After immersion, the terminals are seperated from the solder surface and the flow of inert gas is terminated after permitting the solder to solidify. The inert gas may be heated by thermal conduction from the liquid solder.

Abstract translation: 惰性气氛点焊方法和装置使用排列成匹配要焊接的端子的布置的凹穴。 通过在焊料罐中降低熔融焊料表面下方的口袋，将袋子充满液体焊料过度流动。 通过邻近口袋的孔提供热惰性气体流。 端子及其周围区域暴露于热惰性气体中足以驱除基本上所有挥发性液体的时间，然后将端子浸入焊料中至由凹穴中的焊料的多孔确定的深度。 浸渍后，端子与焊料表面分离，惰性气体的流动在允许焊料固化后终止。 可以通过来自液体焊料的热传导来加热惰性气体。

公开(公告)号：US5825629A

公开(公告)日：1998-10-20

申请号：US709674

申请日：1996-09-09

Applicant: Karl Grant Hoebener ,  Eric Max Hubacher ,  Julian Peter Partridge

Inventor： Karl Grant Hoebener ,  Eric Max Hubacher ,  Julian Peter Partridge

IPC: B41F15/08 ,  B23K3/06 ,  B41M1/12 ,  H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H05K3/12 ,  H05K3/34 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K7/02

CPC classification number: H05K3/3484 ,  B23K3/06 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H05K3/1225 ,  B23K2201/36 ,  H01L2224/11 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/09727 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/0485 ,  H05K2203/0557 ,  H05K2203/1476 ,  H05K3/1216

Abstract: A product created through the reflow of low melting point solder on select contacts of a printed circuit board. In one form, the printed circuit board has fine pitch devices, including flip-chip integrated circuits, connected to a board having conventional coarse pitch surface. The fine pitch contacts of the board are exposed through holes in a stencil characterized in its ability to withstand solder reflow temperatures, not be wettable by solder, and have a coefficient of thermal expansion relatively matching the printed circuit board. Low temperature solder paste is screen deposited into the stencil openings. With the stencil fixedly positioned on the board, the solder paste retained by the stencil pattern is reflowed to selectively form on the underlying contacts of the printed circuit board. Thereafter, the stencil is removed from the board and the board is subject to previously practiced depositions of flux and paste in preparation for fine and coarse pitch component placement and ensuing solder reflow. The fine contact pitch and coarse contact pitch differ by nominal factor of two or more.

Abstract translation: 通过在印刷电路板的选定触点上通过低熔点焊料回流产生的产品。 在一种形式中，印刷电路板具有连接到具有常规粗节距表面的板的精细间距装置，包括倒装芯片集成电路。 板的细间距触点通过模板中的孔露出，其特征在于其能够承受焊料回流温度，不能被焊料润湿，并且具有与印刷电路板相对匹配的热膨胀系数。 低温焊膏被屏幕沉积在模板孔中。 当模板固定在板上时，由模板图案保持的焊膏被回流以选择性地形成在印刷电路板的下面的触点上。 此后，将模板从板上移除，并且板经历先前实践的焊剂和浆料沉积，以准备精细和粗略的沥青组分放置以及随后的回流焊。 精细的接触间距和粗略的接触间距由两个或更多的公称因数的不同而不同。

公开(公告)号：US5751068A

公开(公告)日：1998-05-12

申请号：US847320

申请日：1997-04-23

Applicant: Jack McMahon ,  George Chiu

Inventor： Jack McMahon ,  George Chiu

IPC: B23K3/06 ,  B23K35/02 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/16 ,  B23K3/0623 ,  B23K3/0692 ,  B23K35/0222 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/81 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11013 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/27438 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/0113 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/303 ,  Y02P70/613

Abstract: An electronic component with insulative tape-held solder forms is disclosed. Electronic components may be any of the integrated circuit chips, chip packages and printed circuit boards. The solder forms are coupled to conductive pads of the electronic component through through-holes in the insulative tape. The solder forms may be shaped as balls, cylinders, polygonal boxes, barrels, or hour-glasses. The insulative tape is thermally conductive and heat resistant. The tape may be made of an organic material such as an elastomer. The tape may further have impregnated materials such as ceramic, aluminum nitride, or solder flux to improve its thermal, mechanical, and/or electrical properties.

Abstract translation: 公开了一种具有绝缘带状焊接形式的电子部件。 电子部件可以是集成电路芯片，芯片封装和印刷电路板中的任何一个。 焊料形式通过绝缘带中的通孔耦合到电子部件的导电焊盘。 焊料形状可以形成为球，圆柱体，多边形盒，桶或小时眼镜。 绝缘带是导热和耐热的。 胶带可以由诸如弹性体的有机材料制成。 带可以进一步具有诸如陶瓷，氮化铝或助焊剂的浸渍材料，以改善其热，机械和/或电性质。

公开(公告)号：US5747102A

公开(公告)日：1998-05-05

申请号：US682160

申请日：1996-07-17

Applicant: James C. Smith ,  Patrick T. Hogan ,  Laurence B. Saidman

Inventor： James C. Smith ,  Patrick T. Hogan ,  Laurence B. Saidman

IPC: B05D1/26 ,  B05B1/24 ,  B05B1/30 ,  B05B1/32 ,  B05C5/00 ,  B05C5/02 ,  B05C11/10 ,  B05D3/00 ,  B23K1/20 ,  B23K3/00 ,  B23K3/06 ,  F16K1/32 ,  G01F11/00 ,  G01F13/00 ,  H05K3/34 ,  H05K13/04 ,  B05D5/12

CPC classification number: B05C5/001 ,  B05C11/1034 ,  B05C5/02 ,  B05C5/0225 ,  B23K1/203 ,  B23K3/0607 ,  G01F13/006 ,  B23K2201/36 ,  B23K2201/42

Abstract: Apparatus and methods for dispensing droplets of liquid or viscous material are disclosed. A valve is opened to dispense a stream of the heated liquid or viscous material through an elongated orifice of a nozzle. The stream of material being dispensed from the elongated orifice is broken into droplets by rapidly closing the valve. Furthermore, a method for varying the height of a droplet of liquid or viscous material is disclosed by which two or more droplets combine to form a droplet of a desired height. A method for applying a plurality of droplets of material onto a substrate so that the droplets flow together to form a uniform film of desired thickness and shape is also disclosed. A second embodiment of the invention relates to dispensing apparatus with a heater assembly removably attached to the dispenser housing. Another modification of the invention relates to a modified seat assembly wherein the valve has three positions with respect to the valve seat and a modified nozzle assembly wherein the nozzle is constructed of a thin walled tube.

Abstract translation: 公开了用于分配液体或粘性材料液滴的装置和方法。 打开阀门以通过喷嘴的细长孔分配加热的液体或粘性材料流。 通过快速关闭阀门，从细长孔口分配的物料流被分解成液滴。 此外，公开了一种用于改变液体或粘性材料液滴的高度的方法，通过该方法两个或更多个液滴组合以形成所需高度的液滴。 还公开了一种将多个材料液滴施加到基底上使得液滴一起形成所需厚度和形状的均匀膜的方法。 本发明的第二个实施例涉及具有可移除地附接到分配器壳体上的加热器组件的分配装置。 本发明的另一变型涉及一种改进的座椅组件，其中阀具有相对于阀座的三个位置和改进的喷嘴组件，其中喷嘴由薄壁管构成。

公开(公告)号：US5711473A

公开(公告)日：1998-01-27

申请号：US577308

申请日：1995-12-22

Applicant: William Sund

Inventor： William Sund

IPC: B23K1/012 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: H05K3/3468 ,  B23K1/012 ,  B23K1/08 ,  B23K3/0669 ,  B23K2201/36 ,  H05K2203/0763 ,  H05K2203/086 ,  H05K3/3447

Abstract: An inert atmosphere spot soldering process and apparatus uses cups arranged to match the arrangement of the terminals to be soldered. The cups are filled to over flowing with liquid solder and provided with a enveloping flow of hot inert gas. The terminals and their surrounding area are exposed to the hot inert gas for a period sufficient to drive off substantially all volatile liquids and the terminals are then immersed in the solder. After immersion, the terminals are raised gently non parallel to the solder surface until they are above the solder and then the flow of inert gas is terminated permitting the solder to solidify. The inert gas may be heated by thermal conduction from the liquid solder.

Abstract translation: 惰性气氛点焊方法和装置使用配置成匹配要焊接的端子的布置的杯。 杯子充满液体焊料过度流动，并提供热惰性气体的包络流。 端子及其周围区域暴露于热惰性气体中足以驱除基本上所有挥发性液体的时间，然后将端子浸入焊料中。 浸渍后，将端子轻轻地不平行于焊料表面升高，直到它们在焊料上方，然后终止惰性气体流动，使焊料固化。 可以通过来自液体焊料的热传导来加热惰性气体。

公开(公告)号：US5707000A

公开(公告)日：1998-01-13

申请号：US636252

申请日：1996-04-23

Applicant: David Charles Olson ,  Robert Phillips, III

Inventor： David Charles Olson ,  Robert Phillips, III

IPC: B23K1/018 ,  G01R1/04 ,  G01R31/28 ,  H01L21/60 ,  H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0486 ,  B23K1/018 ,  G01R1/0483 ,  G01R31/2867 ,  H01L24/799 ,  H01L24/98 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/131 ,  H01L2224/75703 ,  H01L2224/7999 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T156/19

Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

公开(公告)号：US5651492A

公开(公告)日：1997-07-29

申请号：US714941

申请日：1996-09-17

Applicant: Hisashi Arai ,  Nobuharu Moriya

Inventor： Hisashi Arai ,  Nobuharu Moriya

IPC: H01L21/52 ,  B23K3/08 ,  H01L21/60

CPC classification number: B23K3/085 ,  B23K2201/36

Abstract: A heating device used in a bonding apparatus including a cover which is provided on a heating body so as to cover a guide groove which guides lead frames; and gas grooves are formed in the heating body so as to run along the guide groove, and an inert gas is supplied into the gas grooves so that the inert gas prevents the entry of air from the joining surfaces of the heating body and cover.

Abstract translation: 一种加热装置，其用于包括盖的接合装置，所述盖设置在加热体上以覆盖引导引线框架的引导槽; 并且在加热体中形成气体槽，以沿着引导槽延伸，并且惰性气体被供应到气体槽中，使得惰性气体防止空气从加热体和盖的接合表面进入。

公开(公告)号：US5647529A

公开(公告)日：1997-07-15

申请号：US402294

申请日：1995-03-10

Applicant: Henry F. Liebman ,  Anthony J. Suppelsa ,  Hal R. Canter

Inventor： Henry F. Liebman ,  Anthony J. Suppelsa ,  Hal R. Canter

IPC: B23K1/008 ,  H05K3/34

CPC classification number: H05K3/341 ,  B23K1/008 ,  B23K2201/36 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2203/083 ,  H05K2203/1121 ,  H05K2203/304 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material containing a fugitive material (109) to a predetermined portion of an electronic part which must be kept below the solder reflow temperature to prevent damage. Heat is then applied and the electronic part is subjected to a high reflow temperature capable of allowing solder to melt. The predetermined portion of the electronic part is controlled (113) at a substantially lower temperature than the high temperature due to evaporative cooling properties of the fugitive material avoiding damage to the electronic part.

Abstract translation: 一种用于在回流焊过程中控制电子部件的预定部分的温度的方法。 该方法包括以下步骤：将含有缓冲材料（109）的吸收材料施加到必须保持低于回流焊温度的电子部件的预定部分以防止损坏。 然后施加热量，电子部件经受能够使焊料熔化的高回流温度。 电子部件的预定部分由于缓冲材料的蒸发冷却特性而避免对电子部件的损坏而以比高温更低的温度被控制（113）。

公开(公告)号：US5620132A

公开(公告)日：1997-04-15

申请号：US461960

申请日：1995-06-05

Applicant: Andrew J. Downing ,  Donald C. Foster ,  Karl J. Puttlitz

Inventor： Andrew J. Downing ,  Donald C. Foster ,  Karl J. Puttlitz

IPC: B23K1/018 ,  H01L21/44

CPC classification number: B23K1/018 ,  B23K2201/36

Abstract: The present invention relates generally to a new apparatus and method for removing solid material and liquid material that may contain solid material from a substrate. More particularly, the invention encompasses an apparatus and method for removing molten solder which may contain solid particles and solder balls or columns from a substrate using a unique squeegee. Also, disclosed is a method for removing solder balls or columns from a substrate using a backer having an adhesive thereon.

Abstract translation: 本发明一般涉及一种用于从固体材料中除去固体材料和液体材料的新装置和方法，所述固体材料和液体材料可以含有来自基底的固体材料。 更具体地说，本发明包括一种用于去除熔融焊料的装置和方法，该装置和方法可以使用独特的刮板从基板上包含固体颗粒和焊球或者列。 此外，公开了一种使用其上具有粘合剂的衬垫从衬底去除焊球或柱的方法。