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121 条记录 (耗时 0.027 秒)

    Solder paste and electronic device
    94.
    发明申请
    Solder paste and electronic device 有权
    焊膏和电子设备

    公开(公告)号：US20070245852A1

    公开(公告)日：2007-10-25

    申请号：US11812005

    申请日：2007-06-14

    申请人： Hidekiyo Takaoka ,  Kosuke Nakano

    发明人： Hidekiyo Takaoka ,  Kosuke Nakano

    IPC分类号： C22C1/04

    CPC分类号： B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

    摘要： In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. A second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder. Accordingly, the likelihood of unreacted components remaining after a heat treatment can be suppressed, and even when a reflow treatment is repeated a plurality of times, a decrease in the bonding strength of solder bonding can be prevented.

    摘要翻译： 在本发明的焊膏中，将第一金属粉末，第二金属粉末和第三金属粉末分散在助熔剂或热固性树脂中。 第一金属粉末包括用作贱金属的第一金属材料如Cu，Ag，Au或Pd。 具有比第一金属材料低的熔点的第二金属材料如Sn或In涂覆在第一金属材料的表面上。 第二金属粉末由熔点低于第一金属材料的Sn或In等金属材料制成。 第三金属粉末如Cu，Ag，Au或Pd粉末的平均粒径小于第一金属材料的平均粒径，并可与第二金属材料和第二金属粉末形成化合物。 因此，可以抑制在热处理后残留的未反应成分的可能性，并且即使重复多次回流处理，也可以防止焊接接合的接合强度的降低。

    Mixture for applying a non-corrosive, thin polymer coating which can be shaped in a low-abrasive manner, and method for producing the same
    95.
    发明申请
    Mixture for applying a non-corrosive, thin polymer coating which can be shaped in a low-abrasive manner, and method for producing the same 失效
    用于施加可以以低磨损方式成形的非腐蚀性，薄的聚合物涂层的混合物及其制备方法

    公开(公告)号：US20050161641A1

    公开(公告)日：2005-07-28

    申请号：US10511223

    申请日：2003-04-17

    申请人： Georg Gros

    发明人： Georg Gros

    IPC分类号： B23K35/22 ,  C08K5/00 ,  C09D5/08 ,  C09D5/10 ,  C09D5/24 ,  H01B1/22 ,  B05D1/12 ,  H01C1/00

    CPC分类号： C09D5/24 ,  B23K35/226 ,  C08K5/0008 ,  C09D5/082 ,  C09D5/084 ,  C09D5/10 ,  H01B1/22 ,  Y10T428/24909 ,  Y10T428/25 ,  Y10T428/2843 ,  Y10T428/31551 ,  Y10T428/31681

    摘要： The invention relates to a mixture for applying a thin polymer, especially less than 6 ?m, non-corrosive, electroconductive or semiconductive coating which can be shaped in a low-abrasive manner, to a base. Said mixture contains A) electroconductive and/or semiconductive elements/compounds selected from the group of a) electroconductive and/or semiconductive particles having a particle size distribution with a transfer value d80 which is less than or equal to 6 ?m, b) electroconductive and/or semi-conductive polymer compounds, and c) electroconductive and/or semiconductive compounds containing amine and/or ammonium, B) at least one binding agent optionally containing reactive thinning agents, C) at least one crosslinking agent and/or at least one photoinitiator, D) optionally at least one constituent selected from d) post-crosslinking compounds, e) additives, f) anticorrosion pigments, and g) non-particulate corrosion inhibitors, and optionally E) an organic solvent and/or water, the sum of all of the conductive and/or semiconductive elements/compounds A) amounting to between 0.5 and 70 wt. %, and the particle content a) amounting to between 0 and 60 wt. %. The invention also relates to a method for producing a non-corrosive, viscoplastic coating on a base, said coating containing polymer and inorganic particles, and to an electroconductive or semiconductive coating containing polymer and inorganic particles.

    摘要翻译： 本发明涉及一种用于将低聚物（特别是小于6μm）非腐蚀性导电或半导电涂层（其可以以低磨损方式成形）施用于基底的混合物。 所述混合物包含A）导电和/或半导体元素/选自a）导电和/或半导电颗粒的化合物，所述导电和/或半导电颗粒具有小于或等于转移值d <80的粒度分布 b）导电和/或半导电聚合物化合物，和c）含有胺和/或铵的导电和/或半导电化合物，B）至少一种任选含有反应性稀释剂的粘合剂，C）至少 一种交联剂和/或至少一种光引发剂，D）任选的至少一种选自d）后交联化合物，e）添加剂，f）防腐颜料，和g）非颗粒腐蚀抑制剂，以及任选的E） 有机溶剂和/或水，所有导电和/或半导体元素/化合物A）的总和为0.5至70wt。 ％，颗粒含量a）为0至60重量％。 ％。 本发明还涉及一种用于在基底上生产非腐蚀性粘塑性涂层的方法，所述涂层含有聚合物和无机颗粒，以及含有聚合物和无机颗粒的导电或半导体涂层。