Abstract:
A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.
Abstract:
Communication bus having at least one pair of communication lines designed to be connected in series respectively to conductors of a main communication bus designed to be connected to communicating devices of at least one electric panel. Said communication bus comprises at least two branched outputs each having at least two branch lines, said branch lines respectively having a first end connected to a communication line and having a second end designed for connection of the communicating devices. The communication lines are etched on a first conducting layer of a printed circuit, and the branch lines are etched on a second conducting layer of said printed circuit. The communication lines are separated from one another by a distance.
Abstract:
A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.
Abstract:
A display device having X electrodes and Y electrodes formed on an electrostatic capacitive type touch panel. Either one of the X electrodes and the Y electrodes is divided corresponding to a ratio between the number of X electrodes and the number of Y electrodes, and a floating electrode is formed in gaps formed along with the reduction of area of the electrode thus adjusting the area of the electrode. A first signal line and second signal lines are branched on a flexible printed circuit board so that both ends of a respective X electrode are supplied with a signal from the branched first signal line and both ends of a respective Y electrode are supplied with a signal from the branched second signal line.
Abstract:
A highly reliable electrostatic-capacitive-type display device with a touch panel which allows a user to perform finger touch inputting and exhibits excellent detection sensitivity is provided. A transparent conductive film is formed above a back surface of an electrostatic-capacitive-type touch panel so as to block noises generated by a display device. A conductive member is provided to supply a voltage to a transparent conductive film formed above a back surface of the touch panel. An electrode which is formed on the electrostatic-capacitive-type touch panel is divided in accordance with a ratio between the number of X electrodes and the number of Y electrodes. A floating electrode is formed in a gap defined between the electrodes so as to adjust an area of the electrode. Due to the shrinkage of the area of the electrode, it is possible to lower a noise level to a level equal to or lower than a signal level. Accordingly, an S/N ratio is increased thus enhancing detection sensitivity. Further, lines are branched on a flexible printed circuit board and intersecting lines are formed on a back surface of the flexible printed circuit board, and the intersecting lines are made to orthogonally intersect with lines formed on a front surface of the flexible printed circuit board thus lowering line capacitance.
Abstract:
A communication apparatus including: a frame; a transmission line connectable to a public line network; a print circuit board including a frame ground terminal portion and configured such that a dielectric strength between the transmission line and the frame ground terminal portion takes a specific value in a state in which elements are connected to between the transmission line and the frame ground terminal portion via conductor patterns. The frame ground terminal portion includes: a first land formed on a first conductor pattern formed on a face of the print circuit board, a surge protection element being connected to the first conductor pattern; and a second land formed on a second conductor pattern formed on the face, elements different from the surge protection element being connected to the second conductor pattern. The first and second lands contacts the frame by fixing of the print circuit board to the frame.
Abstract:
A flexible flat circuit cable includes first and second flexible circuit substrates extending in an extension direction. The first flexible circuit substrate has a first surface forming a first conductor layer and an insulation layer, and the second flexible circuit substrate has a first surface forming a second conductor layer and an insulation layer. A bonding material layer is applied at a predetermined section between the first flexible circuit substrate and the second flexible circuit substrate to bond the first and second flexible circuit substrates together in such a way to maintain a predetermined spacing distance between the first and second flexible circuit substrate and forming a gapped segment at sections where no bonding material is applied. The first and second flexible circuit substrates form a cluster section within the gapped segment, which has opposite ends respectively forming first and second connected sections each of which forms a connection plug or is provided with a connector.
Abstract:
A sub-mount adapted for AC and DC operation of devices mountable thereon, light emitting devices including such a sub-mount, and methods of manufacturing such a sub-mount are provided. The sub-mount including a base substrate including a first surface and a second surface different from the first surface, a conductive pattern on the first surface, a first pair and a second pair of first and second electrodes on the second surface, and vias extending through the base substrate between the first and second surfaces, wherein the conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes of the first and second pair of first and second electrodes through the vias.
Abstract:
A printed circuit board and method of manufacturing the printed circuit board, including a first and second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. Through holes are formed in portions of a cover insulating layer above the connection portions, respectively. First connecting layers made of copper, for example, are formed to fill the through holes of the cover insulating layer. A substantially rectangular second connecting layer made of copper, for example, is formed to integrally cover upper ends of the connecting layers. This causes the first and second lines to be electrically connected to each other through the first and second connecting layers.
Abstract:
A wiring board with an electronic device comprising a plurality of trenches arranged in parallel on a substrate, a common trench communicating the plurality of trenches with each other at one of their ends on the substrate, a metal layer formed at the bottom of the plurality of trenches, and an electrode layer connected with the metal layer and formed on a bottom of the common trench, wherein the electrode layer on the bottom of the common trench constitutes a source electrode or a drain electrode of a field effect transistor, whereby the wiring board and an electronic circuit having a good fine wire pattern and a good narrow gap between the patterns using a coating material can be formed, and a reduction for a cost of an organic thin film electronic device and the electronic circuit can be attained since they can be realized through a development of a printing technique.