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287 条记录 (耗时 0.014 秒)

    Method for improving the alignment of holes with other elements on a printed circuit board
    92.
    发明授权
    Method for improving the alignment of holes with other elements on a printed circuit board 失效
    用于改善与印刷电路板上的其它元件的孔对准的方法

    公开(公告)号：US5710063A

    公开(公告)日：1998-01-20

    申请号：US660091

    申请日：1996-06-06

    申请人： Douglas W. Forehand ,  Karl A. Sauter

    发明人： Douglas W. Forehand ,  Karl A. Sauter

    IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H01L21/18

    CPC分类号： H05K3/303 ,  H05K1/0269 ,  H05K3/0008 ,  H05K1/114 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10325 ,  H05K2201/10378 ,  H05K2201/10568 ,  H05K2201/10719 ,  H05K2203/161 ,  H05K2203/167 ,  H05K3/0047 ,  H05K3/108 ,  H05K3/244 ,  H05K3/325 ,  H05K3/3452 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/49131 ,  Y10T29/49139

    摘要： A method of locating a socket on a printed circuit board which includes the steps of fabricating a plurality of pads and one or more fiducials on the upper surface of the printed circuit board, optically aligning a drill with the fiducial, and then drilling a socket hole through the printed circuit board at the location defined by the fiducial. A peg of the socket is inserted into the socket hole to align the socket with the printed circuit board. Alternatively, a method for locating holes on a printed circuit board includes the steps of forming a master tooling hole through the printed circuit board, locating a fiducial on the printed circuit board using the master tooling hole as a guide, focusing on the fiducial with an optically alignable drill, thereby aligning the drill, and then drilling a hole through the printed circuit board using the aligned drill. The fiducial is selected to be a material which provides a sharp optical contrast with the area surrounding the fiducial, thereby allowing the drill to be easily and accurately focused on the fiducial.

    摘要翻译： 一种在印刷电路板上定位插座的方法，包括以下步骤：在印刷电路板的上表面上制造多个焊盘和一个或多个基准，将钻头与基准光学对准，然后钻一个插座孔 通过印刷电路板在由基准定义的位置。 将插座插入插座孔，以将插座与印刷电路板对准。 或者，用于在印刷电路板上定位孔的方法包括以下步骤：通过印刷电路板形成主工具孔，使用主工具孔作为引导件将基准点定位在印刷电路板上，以基准为基准 光学对准钻头，从而对准钻头，然后使用对准的钻孔钻孔穿过印刷电路板。 基准被选择为与基准面周围的区域形成尖锐的光学对比度的材料，从而允许钻头容易且准确地聚焦在基准上。

    Printed wiring board having an electromagnetic wave shielding layer
    93.
    发明授权
    Printed wiring board having an electromagnetic wave shielding layer 失效
    具有电磁波屏蔽层的印刷电路板

    公开(公告)号：US5416667A

    公开(公告)日：1995-05-16

    申请号：US87848

    申请日：1993-07-02

    申请人： Junichi Ichikawa ,  Katsutomo Nikaido ,  Shin Kawakami

    发明人： Junichi Ichikawa ,  Katsutomo Nikaido ,  Shin Kawakami

    IPC分类号： F42B3/18 ,  H01Q17/00 ,  H05K1/02 ,  H05K3/28 ,  H05K9/00 ,  H05K3/00

    CPC分类号： H05K9/0039 ,  F42B3/18 ,  H01Q17/00 ,  H05K1/0269 ,  H05K1/0218 ,  H05K2201/0715 ,  H05K2203/161 ,  H05K3/28 ,  Y10T29/49126

    摘要： A printed wiring board comprises a substrate, a printed wiring circuit formed on the substrate, and insulating layer formed on the printed wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer, and an overcoat layer provided on the electromagnetic shielding layer. The electromagnetic shielding layer has a first color, and the overcoat layer has a second color different from the first color. The color of the overcoat layer may be any color which is easily visually distinguishable from the color of the electromagnetic wave shielding layer so that visual inspection of the working condition of the overcoat layer is facilitated.

    摘要翻译： 印刷布线板包括基板，形成在基板上的印刷布线电路和形成在印刷布线电路上的绝缘层，设置在绝缘层上的电磁波屏蔽层和设置在电磁屏蔽层上的外涂层。 电磁屏蔽层具有第一颜色，并且外涂层具有与第一颜色不同的第二颜色。 外涂层的颜色可以是易于视觉上与电磁波屏蔽层的颜色区分的任何颜色，从而便于对外涂层的工作状态的目视检查。

    System for generating hole diameter information of printed board and the like
    95.
    发明授权
    System for generating hole diameter information of printed board and the like 失效
    用于产生印刷板等的孔径信息的系统

    公开(公告)号：US4659938A

    公开(公告)日：1987-04-21

    申请号：US654384

    申请日：1984-09-25

    申请人： Yoshiyuki Aoyama ,  Shuitsu Funabashi ,  Masaaki Matsuzaka

    发明人： Yoshiyuki Aoyama ,  Shuitsu Funabashi ,  Masaaki Matsuzaka

    IPC分类号： B23B39/08 ,  B23P19/00 ,  G05D3/12 ,  G06F17/50 ,  G06K7/12 ,  G06T1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  G06K7/10

    CPC分类号： H05K3/0008 ,  G06K7/12 ,  H05K3/0002 ,  H05K1/0269 ,  H05K1/116 ,  H05K2203/056 ,  H05K2203/161 ,  H05K3/0047 ,  Y02T10/82

    摘要： Hole diameter information is represented by color information. After detecting the color information, the detected color information is converted and generated into the hole diameter information. In this manner, a plurality of kinds of hole diameter information can be processed simultaneously, and efficiently with error reduction. The invention disclosed includes a pattern figure (2a) having a plurality of marks corresponding to holing positions of a printed board or the like and indicated by identification colors (3) corresponding to hole diameters of the holing positions. A detecting device 4 for generating detection signals corrsponding to the identification colors (2) of the marks in the pattern figure (2a), and hole diameter information generating means (6) for generating information representing the hole diameters by deciding the identification colors.

    摘要翻译： 孔直径信息由颜色信息表示。 在检测到颜色信息之后，将检测到的颜色信息转换并生成到孔径信息中。 以这种方式，可以同时处理多种孔径信息，并且有效地进行误差减小。 所公开的发明包括具有对应于印刷板等的凹坑位置并由对应于孔位置的孔直径的识别颜色（3）表示的多个标记的图案图形（2a）。 一种检测装置4，用于产生响应于图形图（2a）中的标记的识别颜色（2）的检测信号，以及孔直径信息产生装置（6），用于通过确定识别颜色来产生表示孔直径的信息。

    Method for the evaluation of solderability
    96.
    发明授权
    Method for the evaluation of solderability 失效
    评估可焊性的方法

    公开(公告)号：US4409333A

    公开(公告)日：1983-10-11

    申请号：US327595

    申请日：1981-12-04

    申请人： Soitiro Tosima ,  Shigeo Harada

    发明人： Soitiro Tosima ,  Shigeo Harada

    IPC分类号： B23K31/12 ,  G01N13/02 ,  H05K1/02 ,  H05K3/34 ,  B23K1/00

    CPC分类号： B23K31/12 ,  H05K3/3468 ,  G01N2013/0225 ,  H05K1/0269 ,  H05K2201/0108 ,  H05K2201/10204 ,  H05K2203/161 ,  H05K2203/162

    摘要： A test procedure is disclosed for evaluating the solderability properties of molten solder. In the method of this invention, a testpiece is provided which has a transparent support with a film of metal such as copper deposited on one surface of the transparent support. The surface having the metal film is immersed in the molten solder and the time required for alloying to occur and be observed through the transparent support is measured to determine rate of alloying and, thereby, the solderability properties of the molten solder under evaluation.

    摘要翻译： 公开了用于评估熔融焊料的可焊性的测试程序。 在本发明的方法中，提供了一种具有透明支撑件的试件，其具有沉积在透明支架的一个表面上的诸如铜的金属膜。 将具有金属膜的表面浸入熔融焊料中，测量通过透明载体发生和观察合金化所需的时间，以确定合金化速率，从而确定待评估的熔融焊料的可焊性。

    Wired circuit board and producing method thereof
    100.
    发明授权
    Wired circuit board and producing method thereof 有权

    公开(公告)号：US09839137B2

    公开(公告)日：2017-12-05

    申请号：US14524318

    申请日：2014-10-27

    申请人： NITTO DENKO CORPORATION

    发明人： Norihiko Okamoto

    IPC分类号： H05K3/10 ,  G11B5/48 ,  H05K1/02

    CPC分类号： H05K3/10 ,  G11B5/4833 ,  G11B5/486 ,  H05K1/0269 ,  H05K2203/161 ,  Y10T29/49004 ,  Y10T29/49155

    摘要： A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.