公开(公告)号：US12040592B2

公开(公告)日：2024-07-16

申请号：US17445786

申请日：2021-08-24

Applicant: Lumentum Operations LLC

Inventor： Wei Shi ,  Hao Huang ,  Siu Kwan Cheung ,  Huanlin Zhu ,  Lijun Zhu

IPC: H01S5/024 ,  H01L23/373 ,  H01L23/498 ,  H01S5/02315 ,  H01S5/183

CPC classification number: H01S5/02469 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49833 ,  H01S5/02315 ,  H01S5/183

Abstract: A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

公开(公告)号：US20240128710A1

公开(公告)日：2024-04-18

申请号：US18487043

申请日：2023-10-14

Applicant: NICHIA CORPORATION

Inventor： Yoshihiro KIMURA ,  Tadaaki MIYATA

IPC: H01S5/02345 ,  H01S5/02315 ,  H01S5/42

CPC classification number: H01S5/02345 ,  H01S5/02315 ,  H01S5/423 ,  H01S5/18361

Abstract: A light-emitting device includes a substrate, a base disposed on the substrate, a light-emitting element disposed over the base, a frame body, and at least one of a functional element and a wire. The frame body includes an inner wall surface surrounding the base and the light-emitting element, an upper surface, and a lower surface connected to the substrate. At least one of the functional element and the wire is disposed on the substrate. At least a part of the at least one of the functional element and the wire is disposed below the light-emitting element. The inner wall surface includes an inclined surface that is inclined so that a distance between the inclined surface and the light-emitting element increases from an upper surface side toward a lower surface side. The at least one of the functional element and the wire is disposed between the inclined surface and the base.

公开(公告)号：US20240047937A1

公开(公告)日：2024-02-08

申请号：US18364443

申请日：2023-08-02

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA

IPC: H01S5/02315 ,  H01S5/00 ,  H01S5/02253

CPC classification number: H01S5/02315 ,  H01S5/0014 ,  H01S5/02253

Abstract: A light-emitting device includes a light-emitting element, a substrate supporting the light-emitting element, and one or more lateral wall portions joined to the substrate to surround the light-emitting element. The one or more lateral wall portions includes a first lateral wall portion having a light incident surface configured to receive a light emitted from the light-emitting element and traveling in a first direction and a light exit surface configured to emit the light. The substrate has a joint surface joined to the first lateral wall portion and a lateral surface meeting the joint surface. The lateral surface is located between the light incident surface and the light exit surface in a top view as viewed in a direction perpendicular to the joint surface.

公开(公告)号：US20240030678A1

公开(公告)日：2024-01-25

申请号：US18033623

申请日：2021-07-15

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Nobutaka SUZUKI ,  Naota AKIKUSA ,  Tadataka EDAMURA

IPC: H01S5/024 ,  H01S5/34 ,  H01S5/02315

CPC classification number: H01S5/02423 ,  H01S5/3401 ,  H01S5/02315

Abstract: In a semiconductor laser device, a supply path that guides a cooling fluid supplied from a supply port side, toward a disposition region, spray holes that spray the cooling fluid guided by the supply path, from below the disposition region, and a discharge path that guides the cooling fluid sprayed from the spray holes, toward a discharge port are provided within a body portion of a heat sink. The spray holes are disposed along a resonance direction of a semiconductor laser element disposed in the disposition region, and the discharge path extends in a direction intersecting with the resonance direction of the semiconductor laser element disposed in the disposition region.

公开(公告)号：US20240014634A1

公开(公告)日：2024-01-11

申请号：US18254501

申请日：2020-11-27

Applicant: ENKRIS SEMICONDUCTOR, INC.

Inventor： Kai Cheng

IPC: H01S5/20 ,  H01S5/40 ,  H01S5/02315 ,  H01S5/042 ,  H01S5/02 ,  H01S5/343

CPC classification number: H01S5/2077 ,  H01S5/4031 ,  H01S5/02315 ,  H01S5/04256 ,  H01S5/0217 ,  H01S5/34333

Abstract: A GaN-based laser and a manufacturing method thereof are provided in this present disclosure. The GaN-based laser includes: an epitaxial substrate unit; and a light-emitting unit located on the epitaxial substrate unit, where the light-emitting unit includes an active layer unit, which is arranged parallel to the epitaxial substrate unit; the light emitting unit includes a pair of first sidewall and second sidewall, which are opposite to each other; a first reflector is provided on the first sidewall and a second reflector is provided on the second sidewall, and the first reflector or second reflector corresponds to the light emitting surface. The first reflector and the second reflector are arranged on the side surfaces of the active layer unit.

公开(公告)号：US20240014628A1

公开(公告)日：2024-01-11

申请号：US18245185

申请日：2021-08-30

Applicant: ams-OSRAM International GmbH

Inventor： Zeljko Pajkic ,  Markus Boss ,  Michael Müller

IPC: H01S5/02315 ,  H01S5/02257 ,  H01S5/068

CPC classification number: H01S5/02315 ,  H01S5/02257 ,  H01S5/06825 ,  H01S5/183

Abstract: In a method of manufacturing a package, in particular an injection molded circuit carrier, MID, at least one injection molded cover plate forming a cavity is provided having a cover area and a perimeter defining the cover area; wherein the cover area includes an opening. Two conductive traces having a first portion on a top edge of the surround, a second portion on a side surface of the surround, and a third portion on the cover area are formed, and then an optical element is formed in the opening of the cover area. Finally, a loop-shaped interlock circuit is applied to the optical element in an edge portion between the opening and the cover area, wherein one end of the loop-shaped interlock circuit is connected to each of the first and second conductive paths.

公开(公告)号：US20230352905A1

公开(公告)日：2023-11-02

申请号：US18344546

申请日：2023-06-29

Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.

Inventor： Xiao CHEN ,  Yunsong ZHAO ,  Jingsi LI ,  Zhicheng LIU ,  Zhaosong LI

IPC: H01S5/02315 ,  H01S5/02345 ,  H04B10/50

CPC classification number: H01S5/02315 ,  H01S5/02345 ,  H04B10/503

Abstract: Disclosed is an optical module, comprising: a light emitting component for generating and outputting signal light, including a laser; the laser includes: a laser chip for generating signal light; a substrate which is provided with a chip mounting groove in its top side, a circuit is laid on a top surface of the substrate, the laser chip is arranged in the chip mounting groove, with the laser chip being connected to the circuit via bonding wires.

公开(公告)号：US11799267B2

公开(公告)日：2023-10-24

申请号：US17874383

申请日：2022-07-27

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kosuke Okawa ,  Naoki Itabashi ,  Tomoya Saeki ,  Hiroshi Hara

IPC: H05K1/02 ,  H01S5/0237 ,  H01S5/02315 ,  H05K3/34 ,  H05K1/18

CPC classification number: H01S5/0237 ,  H01S5/02315 ,  H05K1/0218 ,  H05K1/18 ,  H05K3/34

Abstract: An optical module includes a circuit board having a through hole for the lead terminal, a signal wiring connected to the lead terminal, a ground layer providing a reference potential, an opening through which the ground layer is exposed, and a bonding material connecting the ground layer to the metallic base. The lead terminal extends in a first direction, and the circuit board and the signal wiring extend in a second direction. When the circuit board is viewed from the first direction, the opening overlaps with the signal wiring, or when the opening does not overlap with the signal wiring, a first distance between the signal wiring and a closest point of the opening to the signal wiring is smaller than a second distance between the closest point and an edge of the circuit board.

公开(公告)号：US11799266B2

公开(公告)日：2023-10-24

申请号：US16673519

申请日：2019-11-04

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma

IPC: H01S5/02257 ,  H01S5/02315 ,  H01S5/02216 ,  H01S5/42 ,  H01S5/0237 ,  H01S5/343 ,  H01S5/02335 ,  H01S5/183 ,  H01S5/02345

CPC classification number: H01S5/02257 ,  H01S5/02216 ,  H01S5/02315 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2924/16195 ,  H01S5/0237 ,  H01S5/02335 ,  H01S5/02345 ,  H01S5/18313 ,  H01S5/18347 ,  H01S5/3432 ,  H01S5/34353 ,  H01S5/423

Abstract: A semiconductor light-emitting device, includes: a semiconductor light-emitting element; a support including a base and a conductive part and configured to support the semiconductor light-emitting element; and a cover configured to overlap the semiconductor light-emitting element as viewed in a first direction, and to transmit light from the semiconductor light-emitting element, wherein the cover includes a base layer having a front surface and a rear surface which transmit the light from the semiconductor light-emitting element and face opposite sides to each other in the first direction, wherein the rear surface faces the semiconductor light-emitting element, wherein the base layer includes a plurality of undulation parts bonded to the support by a bonding material, and wherein the undulation parts are more uneven than the rear surface.

公开(公告)号：US20230327396A1

公开(公告)日：2023-10-12

申请号：US18189290

申请日：2023-03-24

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: H01S5/024 ,  H01S5/02218 ,  H01S5/02315

CPC classification number: H01S5/02453 ,  H01S5/02218 ,  H01S5/02315 ,  H01S5/02476

Abstract: A light source device includes: a substrate having a support face; a lateral wall part disposed on the substrate and having an upper face and inner wall faces, the inner wall faces defining a space; a laser diode located in the space; a first submount having a mounting face bonded to an upper face of the laser diode, and an upper face located opposite the mounting face; a sealing member bonded to the upper face of the lateral wall part and the upper face of the first submount, thereby sealing the space; a heat dissipating block located above the first submount; and a heat conducting member located between the first submount and the heat dissipating block.