摘要:
Disclosed is a semiconductor radiation detector element of Schottky barrier type, comprising: a compound semiconductor crystal including cadmium and tellurium as main components; and voltage application means for applying voltage to the compound semiconductor crystal. According to the present invention, said voltage application means includes a compound of indium, cadmium and tellurium: InxCdyTez formed on one surface of the compound semiconductor crystal. Preferably, the rate “z” of occupation of tellurium in the compound InxCdyTez is in the range of not less than 42.9%, but not greater than 50% by ratio of number of atoms. Furthermore, preferably, the rate “y” of occupation of cadmium in the compound InxCdyTez is in the range of not less than 0%, but not greater than 10% by ratio of number of atoms.
摘要:
The present invention provides for a method of fabricating a semiconductor device comprising a non-selectively grown SiGe(C) heterojunction bipolar transistor including the steps of forming an insulating layer (12, 40) on a substrate and providing a layer structure including a conductive layer (14, 42) on the insulating layer (12, 40), etching a transistor area opening (12, 44) through the conductive layer (14, 42), depositing a SiGe base layer (24, 46) on the inner wall of the transistor area opening (22, 44) and forming an insulator (32, 52) on an upper surface so as to fill the transistor area opening wherein prior to the filling step, a nitride layer (30, 50) is formed as an inner layer of the transistor area opening (22, 44).
摘要:
A semiconductor device comprises a base substrate, a silicon oxide layer formed on the base substrate, a first semiconductor layer formed on the silicon oxide layer, the first semiconductor layer including an SiGe layer with a Ge concentration not less than 30 atomic %, a second semiconductor layer formed on the first semiconductor layer, the second semiconductor layer including a Ge layer or an SiGe layer with a Ge concentration higher than the first semiconductor layer, a gate electrode configured to induce a channel in a surface region of the second semiconductor layer, and a gate insulating film formed between the second semiconductor layer and the gate electrode.
摘要:
Very fast integrated OPL circuits, such as pseudo-NMOS OPL and dynamic OPL, comprising CMOS gate arrays having ultra-thin vertical NMOS transistors are disclosed. The ultra-thin vertical NMOS transistors of the CMOS gate arrays are formed with relaxed silicon germanium (SiGe) body regions with graded germanium content and strained silicon channels.
摘要:
A method of manufacturing a semiconductor device includes implanting germanium ions into a selected portion of a semiconductor region containing at least silicon, forming P-type and N-type diffusion layers in the semiconductor region, and forming a silicide film which extends from the N type diffusion layer over to the boundary region and the P-type diffusion layer. A boundary region between the P-type and N-type diffusion layers is formed in the selected portion.
摘要:
A photodetector having improved responsivity includes first, second and third contact layers and first and second absorption layers. The first and second absorption layers are disposed on opposite sides of the first contact layer. The second contact layer is disposed on the first absorption layer and the third contact layer is disposed on the second absorption layer. The first contact layer has a first polarity. The second and third contact layers have a second polarity which is opposite the first polarity. Preferably, the first and second absorption layers are each made of a material having approximately equivalent electrical characteristics and the second and third contact layers are interconnected. Alternatively, one absorption layer is responsive to a first wavelength and another absorption layer is responsive to a second wavelength.
摘要:
A photosensitive device, e.g. for use as an optical sensor for a video camera, is designed to capture light and to deliver an electrical signal representative of the captured light, and presenting a resistance to hard electromagnetic radiation. The device includes a photosensitive element in hydrogenated amorphous silicon and a collector for the electrical charges induced by the photoelectric effect in the photosensitive element capturing the light and for delivering an electrical signal resulting therefrom. The device is electrically connected to an electronic processor for processing the electrical signal.
摘要:
A pin photodiode having a structure capable improving the frequency response and the saturation output while maintaining the effective internal quantum efficiency and CR time constant. A pin photodiode is formed by: a first semiconductor layer in a first conduction type; a second semiconductor layer in a second conduction type; a third semiconductor layer sandwiched between the first and second semiconductor layers, having a doping concentration lower than those of the first and second semiconductor layers; a fourth semiconductor layer in the first conduction type, provided at one side of the first semiconductor layer opposite to a side at which the third semiconductor layer is provided; and a cathode electrode and an anode electrode connected directly or indirectly to the second semiconductor layer and the fourth semiconductor layer, respectively. The first semiconductor layer has a bandgap energy by which a charge neutrality condition is maintained in at least a part of the first semiconductor layer and the first semiconductor layer is made to function as a light absorption layer, while the second and third semiconductor layers have bandgap energies by which the second and third semiconductor layers are made not to function as a light absorption layer, and the fourth semiconductor layer has a bandgap energy greater than that of the first semiconductor layer.
摘要:
A novel photoelectric conversion semiconductor device having an amplifying function which can be readily fabricated is provided. An N.sup.+ -type impurity domain whose impurity concentration is higher than that of an N.sup.- -type semiconductor substrate is formed on one surface thereof and a P.sup.+ -type impurity domain is formed on the opposite surface. An SiO.sub.2 film, an Si.sub.3 N.sub.4 film and an SiO.sub.2 film are formed extending to the domain of the N.sup.- -type semiconductor substrate, exceeding the N.sup.+ -type impurity domain. An anode electrode is formed on the N.sup.+ -type impurity domain and a cathode electrode is formed on the P.sup.+ -type impurity domain. A polysilicon gate electrode is formed on the SiO.sub.2 film, i.e. the top layer, and an Al gate electrode is formed thereon. A reverse voltage is applied between the anode electrode and the cathode electrode and a predetermined voltage is applied between the anode electrode and the Al gate electrode.
摘要:
An integrated heterostructure of Group III-V nitride compound semiconductors is formed on a multicomponent platform which includes a substrate of monocrystalline silicon carbide and a non-nitride buffer layer of monocrystalline zinc oxide. The zinc oxide may be formed by molecular beam epitaxy (MBE) using an MBE effusion cell containing zinc, and a source of atomic oxygen, such as an MBE-compatible oxygen plasma source which converts molecular oxygen into atomic oxygen. An ohmic contact for a semiconductor device formed of Group III-V nitride compound semiconductor materials including a layer of aluminum nitride or aluminum gallium nitride, includes a continuously graded layer of aluminum gallium nitride and a layer of gallium nitride or an alloy thereof on the continuously graded layer. The continuously graded layer eliminates conduction or valence band offsets. A multiple quantum well may also be used instead of the continuously graded layer where the thickness of the layers of gallium nitride increase across the multiple quantum well. The ohmic contacts may be used for Group III-V nitride laser diodes, light emitting diodes, electron emitters, bipolar transistors and field effect transistors.