DROPLET ANALYSIS UNIT AND SUBSTRATE TREATMENT APPARATUS INCLUDING THE SAME

    公开(公告)号:US20240034055A1

    公开(公告)日:2024-02-01

    申请号:US18347241

    申请日:2023-07-05

    CPC classification number: B41J2/04535 B41J2/0456 B41J29/17 B41J2202/15

    Abstract: A droplet analysis unit capable of measuring and digitizing the meniscus shape, motion, and position of ink droplets and a substrate treatment apparatus including the droplet analysis unit are provided. The substrate treatment apparatus includes: a process treatment unit supporting a substrate while the substrate is being treated; an inkjet head unit treating the substrate by ejecting a substrate treatment liquid onto the substrate using a plurality of nozzles; a gantry unit moving the inkjet head unit over the substrate; and a droplet analysis unit measuring a meniscus in each of the nozzles that is associated with the substrate treatment liquid, wherein the droplet analysis unit measures and quantifies three-dimensional (3D) information regarding the meniscus.

    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
    102.
    发明公开

    公开(公告)号:US20240011158A1

    公开(公告)日:2024-01-11

    申请号:US18474493

    申请日:2023-09-26

    CPC classification number: C23C16/4584 C23C16/45565

    Abstract: According to the disclosed substrate processing apparatus, a first bowl is located to correspond to a substrate, and a first chemical solution supply module supplies a first chemical solution while a support module rotates at a first speed, and a second bowl is located to correspond to the substrate, and a second chemical solution supply module supplies a second chemical solution at a first flow rate while a support module rotates at a second speed equal to or smaller than the first speed, and the second bowl is located to correspond to the substrate, and the second chemical solution supply module does not supply the second chemical solution or supplies the second chemical solution at a second flow rate smaller than the first flow rate while the support module rotates at a third speed smaller than the second speed.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20240006166A1

    公开(公告)日:2024-01-04

    申请号:US18332088

    申请日:2023-06-09

    CPC classification number: H01J37/32715 H01J37/32541 H01J37/32449

    Abstract: Provided is a substrate processing apparatus and substrate processing method capable of processing a substrate by using plasma, the substrate processing apparatus including a process chamber providing an internal space where a substrate is processed, a spin chuck serving as a lower electrode, supporting the substrate in the internal space of the process chamber, and rotating the supported substrate, and a plasma generation unit mounted in an upper portion of the process chamber to face the spin chuck, including a discharge space where an upper electrode is provided, generating plasma by using a process gas supplied from outside, linearly ejecting the plasma onto the substrate rotated by the spin chuck, and controlling a density of the plasma to change along an extension direction of the linearly ejected plasma.

    SUBSTRATE PROCESSING APPARATUS
    105.
    发明公开

    公开(公告)号:US20240006160A1

    公开(公告)日:2024-01-04

    申请号:US18142442

    申请日:2023-05-02

    Abstract: Provided is a substrate processing apparatus including a chamber including a processing space; a support table provided within the processing space of the chamber and configured to support a substrate; a dielectric plate covering an opening in an upper wall of the chamber; a transparent electrode provided on the dielectric plate; a laser supply head configured to supply a laser beam toward the substrate supported on the support table via the transparent electrode and the dielectric plate; and a cooling device configured to cool the transparent electrode by injecting a cooling gas toward the transparent electrode.

    System for processing substrate
    108.
    发明授权

    公开(公告)号:US11856680B2

    公开(公告)日:2023-12-26

    申请号:US17243954

    申请日:2021-04-29

    Abstract: A substrate processing system capable of setting a stable reference ground level for electrical components while handling electrostatic discharge (ESD) is provided. The substrate processing system includes a first ground bar connected to a building ground; and a second ground bar connected to the building ground and physically separated from the first ground bar, wherein the first ground bar is connected to a first electrical component to set a ground level of the first electrical component, wherein the second ground bar is dedicated to a charged component, and the second ground bar is connected to the first charged component to set a path of the electrostatic discharge current generated by the first charged component.

    ARTICLE TRANSFER APPARATUS AND ARTICLE TRANSFER METHOD

    公开(公告)号:US20230406631A1

    公开(公告)日:2023-12-21

    申请号:US18211098

    申请日:2023-06-16

    Inventor: No Jae PARK

    Abstract: Provided is an article transfer apparatus and article transfer method capable of autonomously loading or unloading an article by accurately checking a correct position in an article storage without a teaching process, the article transfer apparatus including a carriage body travelling along travel rails to transfer an article, and a position detection device mounted in the carriage body to detect position information related to a correct position from a detection target mounted in an article storage capable of storing the article in order to place the article at the correct position in the article storage where the article is to be stored.

    MOVING ASSEMBLY FOR RECOVERY GUARD AND SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20230405648A1

    公开(公告)日:2023-12-21

    申请号:US18201934

    申请日:2023-05-25

    CPC classification number: B08B13/00 B08B3/04

    Abstract: The moving assembly for a recovery guard includes a recovery vessel including a first recovery vessel disposed to surround a substrate support and a second recovery vessel disposed inside of the first recovery vessel, concentrically with respect to the first recovery vessel, and a lifting driver connected to the first and second recovery vessels and elevating the first and second recovery vessels. The lifting driver includes a motor, a drive shaft connected to the motor and rotated in a first direction, a first shaft connected to the first recovery vessel and extending in a second direction, perpendicular to the first direction, a second shaft connected to the second recovery vessel and extending in the second direction, a first clutch connecting the drive shaft and the first shaft, and a second clutch connecting the drive shaft and the second shaft.

Patent Agency Ranking