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    WIRING BOARD STRUCTURE
    103.
    发明申请
    WIRING BOARD STRUCTURE 审中-公开
    接线板结构

    公开(公告)号：US20150053462A1

    公开(公告)日：2015-02-26

    申请号：US14062912

    申请日：2013-10-25

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Wei-Ming Cheng ,  Hung-Lin Chang

    IPC: H05K1/02

    CPC classification number: H05K1/0206 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73259 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/16 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/09527 ,  H05K2201/10219

    Abstract: A wiring board structure adapted to carry a heat generating component is provided. The wiring board structure includes a core layer, an active cooler, a dielectric layer and a plurality of conductive vias. The core layer has a cavity penetrating through the core layer. The active cooler includes a cold surface and a hot surface. The active cooler is disposed in the cavity. The dielectric layer covers the core layer and fills a gap between the active cooler and the cavity. The heat-generating component is disposed on an outer surface of the dielectric layer. The conductive vias are disposed in the dielectric layer and connecting the cold surface and the outer surface to connect the heat-generating component and the active cooler. A wiring board structure having an active cooling via is also provided.

    Abstract translation: 提供适于承载发热部件的布线板结构。 布线板结构包括芯层，有源冷却器，电介质层和多个导电通孔。 芯层具有穿透芯层的腔体。 主动冷却器包括冷表面和热表面。 有源冷却器设置在空腔中。 电介质层覆盖芯层并填充主动式冷却器和空腔之间的间隙。 发热部件设置在电介质层的外表面上。 导电通孔设置在电介质层中，并连接冷表面和外表面，以连接发热部件和主动冷却器。 还提供了具有主动冷却通路的布线板结构。

    THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD OF PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
    104.
    发明申请
    THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD OF PRODUCING SUCH A METAL-CERAMIC SUBSTRATE 审中-公开
    热电发生器模块，金属陶瓷基板和生产这种金属陶瓷基板的方法

    公开(公告)号：US20140345664A1

    公开(公告)日：2014-11-27

    申请号：US14368372

    申请日：2013-01-22

    Applicant: Curamik Electronics GmbH

    Inventor： Andreas Meyer ,  Jurgen Schulz-Harder

    IPC: H05K1/03 ,  H05K3/00 ,  H01L35/30 ,  H05K1/11

    CPC classification number: H05K1/0306 ,  C04B37/021 ,  C04B37/026 ,  C04B37/028 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/64 ,  C04B2237/706 ,  C04B2237/86 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/11 ,  H05K3/0067 ,  H05K2201/06 ,  H05K2201/10219 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: The invention relates to a thermoelectric generator module with a hot zone and a cold zone including at least a first metal-ceramic substrate, which has a first ceramic layer and at least one structured first metallization applied to the first ceramic layer and is assigned to the hot zone, and at least a second metal-ceramic substrate, which has a second ceramic layer and at least one structured second metallization applied to the second ceramic layer and is assigned to the cold zone, and also a number of thermoelectric generator components located between the first and second structured metallizations of the metal-ceramic substrates. The first metal-ceramic substrate, assigned to the hot zone, has at least one layer of steel or high-grade steel, wherein the first ceramic layer is arranged between the first structured metallization and the at least one layer of steel or high-grade steel. The invention also relates to an associated metal-ceramic substrate and to a method for producing it.

    Abstract translation: 本发明涉及一种具有热区和至少包含第一金属陶瓷衬底的冷区的热电发电机模块，该第一金属陶瓷衬底具有施加到第一陶瓷层的第一陶瓷层和至少一个构造的第一金属化层，并被分配给 热区和至少第二金属陶瓷衬底，其具有施加到第二陶瓷层并被分配给冷区的第二陶瓷层和至少一个构造的第二金属化，以及位于第二陶瓷层之间的多个热电发电机组件 金属陶瓷基板的第一和第二结构化金属化。 分配给热区的第一金属陶瓷基体具有至少一层钢或高级钢，其中第一陶瓷层布置在第一结构化金属化和至少一层钢之间或高级 钢。 本发明还涉及一种相关联的金属 - 陶瓷衬底及其制造方法。

    SYSTEMS AND METHODS FOR HARVESTING DISSIPATED HEAT FROM INTEGRATED CIRCUITS (ICS) IN ELECTRONIC DEVICES INTO ELECTRICAL ENERGY FOR PROVIDING POWER FOR THE ELECTRONIC DEVICES
    106.
    发明申请
    SYSTEMS AND METHODS FOR HARVESTING DISSIPATED HEAT FROM INTEGRATED CIRCUITS (ICS) IN ELECTRONIC DEVICES INTO ELECTRICAL ENERGY FOR PROVIDING POWER FOR THE ELECTRONIC DEVICES 审中-公开
    用于将电子设备中的集成电路（ICS）中的散热加热到用于为电子设备提供电力的电能的系统和方法

    公开(公告)号：US20140252531A1

    公开(公告)日：2014-09-11

    申请号：US13924687

    申请日：2013-06-24

    Applicant: QUALCOMM Incorporated

    Inventor： Babak Aryan ,  Senthil Kumar Govindaswamy ,  Venkat Rangan

    IPC: H01L27/16

    CPC classification number: H01L27/16 ,  H01L23/38 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/185 ,  H05K2201/10219 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: Systems and methods for harvesting dissipated heat from integrated circuits (ICs) in electronic devices into electrical energy for providing power for the electronic devices are disclosed. In one embodiment, energy transferred from one or more ICs in the form of dissipated heat is harvested to convert at least a portion of this dissipated heat into electricity. This power can be used to provide power to the ICs to reduce overall power consumption by the electronic device. The harvested dissipated heat can be supplied to ICs in the electronic device to provide power to the ICs. Alternatively, or in addition, the harvested dissipated heat can be stored in an energy storage device to provide power to the ICs at a later time.

    Abstract translation: 公开了用于从电子设备中的集成电路（IC）将耗散的热量收集到用于为电子设备供电的电能的系统和方法。 在一个实施例中，收集从散热形式的一个或多个IC转移的能量，以将该散热的至少一部分转化成电。 该功率可用于为IC提供电力以减少电子设备的总功耗。 所获得的耗散的热量可以提供给电子设备中的IC以向IC提供电力。 或者或另外，收获的耗散热量可以存储在能量存储装置中，以在稍后的时间向IC提供电力。

    IC card having improved heat dissipation
    110.
    发明授权
    IC card having improved heat dissipation 失效
    具有改善散热性能的IC卡

    公开(公告)号：US5508885A

    公开(公告)日：1996-04-16

    申请号：US231913

    申请日：1994-04-25

    Applicant: Shin-ichi Ishimoto

    Inventor： Shin-ichi Ishimoto

    IPC: B42D15/10 ,  G06K19/077 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K5/02 ,  H05K7/20

    CPC classification number: H05K1/0209 ,  H05K5/026 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/181 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2201/10219 ,  H05K2201/10553 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K3/341

    Abstract: An IC card includes a ground pattern of high heat conductivity disposed between a substrate and a mounted element, such as a semiconductor element, and in contact with the mounted element. Heat generated by the mounted element is transmitted through the ground pattern and ground terminals to which the ground pattern is connected and radiated by a cooling system disposed outside of the IC card. Therefore, heat generated by the mounted element can be radiated efficiently and malfunctioning of the mounted element due to heat can be prevented, resulting in improved electrical reliability.

    Abstract translation: IC卡包括设置在基板和诸如半导体元件的安装元件之间并与安装元件接触的高导热性的接地图案。 由安装元件产生的热量通过设置在IC卡外部的冷却系统通过接地图案和接地图案连接和辐射的接地端子传输。 因此，可以有效地辐射由安装的元件产生的热量，并且可以防止由于加热而导致的安装元件的故障，从而提高电气可靠性。

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