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139 条记录 (耗时 0.039 秒)

    Sensor-type semiconductor package and fabrication
    112.
    发明申请
    Sensor-type semiconductor package and fabrication 审中-公开
    传感器型半导体封装和制造

    公开(公告)号：US20080105941A1

    公开(公告)日：2008-05-08

    申请号：US11982514

    申请日：2007-11-02

    申请人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    发明人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L31/0203 ,  H01L21/00

    CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.

    摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该制造方法包括以下步骤：将传感器芯片附接到芯片载体; 经由多根接合线电连接传感器芯片和芯片载体; 将透光体安装到传感器芯片上，其中粘合剂层作为其间的隔板，其中透光体的平面尺寸大于要形成的传感器型半导体封装的预定平面尺寸; 在所述芯片载体上形成密封剂，用于封装所述传感器芯片，并且所述接合线与所述透光体的上表面暴露于所述密封剂; 并根据预定的平面尺寸切穿透光体，密封剂和芯片载体。 因此，切割的透光体和切割的密封剂之间的接触面积增加，并且增强了它们之间的粘结。

    Process applied to semiconductor
    114.
    发明申请
    Process applied to semiconductor 审中-公开
    工艺应用于半导体

    公开(公告)号：US20060137420A1

    公开(公告)日：2006-06-29

    申请号：US11319110

    申请日：2005-12-27

    申请人： Ru- Sheng Liu ,  Han-Lung Tsai ,  Cheng-Hsu Hsiao

    发明人： Ru- Sheng Liu ,  Han-Lung Tsai ,  Cheng-Hsu Hsiao

    IPC分类号： B21C23/00

    CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/32145 ,  H01L2924/3511

    摘要： A process applied to grinding, dicing, and/or stacking semiconductors is disclosed. One feature of the process is that after transparent material is stuck on its active surface, a semiconductor is ground from another surface thereof to become thinner, then the semiconductor is diced, by taking advantage of transparency of the transparent material, from its active surface, to obtain at least one smaller semiconductor unit such as die/dice or chip(s). Another feature is that the transparent material remains sticking to the active surface of the die by an adhesion layer until the die is attached to a carrier or another die, and then the transparent material and the adhesion layer are removed by taking advantage of a function of the adhesion layer: receiving a ray to lose adhesion between it and the active surface. Preferably the ray reaches the adhesion layer via the transparent material stuck on the active surface of the die.

    摘要翻译： 公开了一种应用于研磨，切割和/或堆叠半导体的方法。 该方法的一个特征是，在透明材料粘附在其有效表面上之后，从其另一表面研磨半导体以变薄，然后通过利用透明材料的透明度从其活性表面切割半导体， 以获得至少一个较小的半导体单元，例如芯片/芯片或芯片。 另一个特征是透明材料通过粘合层保持粘附到模具的活性表面，直到模具附接到载体或另一个模具，然后通过利用透明材料和粘合层的功能去除透明材料和粘附层 粘合层：接收光线以失去其与活性表面之间的粘附。 优选地，光线通过粘附在模具的有效表面上的透明材料到达粘附层。

    Semiconductor package with heat sink
    115.
    发明申请
    Semiconductor package with heat sink 有权
    半导体封装带散热片

    公开(公告)号：US20060017145A1

    公开(公告)日：2006-01-26

    申请号：US11212182

    申请日：2005-08-26

    申请人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Huang

    发明人： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Huang

    IPC分类号： H01L23/06

    CPC分类号： H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/00014

    摘要： A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

    摘要翻译： 提供了具有散热器的半导体封装，其中至少一个芯片安装在基板上并被散热器覆盖。 散热器在与基板接触的位置处形成有多个凹槽或孔，允许将粘合材料施加在散热器和基板之间并填充到用于将散热器附接到基板上的凹槽或孔中。 填充到槽或孔中的粘合剂材料提供了将散热器牢固地定位在基板上的锚固效果。 因此，不需要在基板上形成预定的孔，用于连接诸如螺栓的固定构件，并且散热器的结合不会影响迹线布线性以及诸如衬底上的焊球等输入/输出连接的布置 不会导致芯片的裂纹。

    Semiconductor package with heat spreader
    116.
    发明授权
    Semiconductor package with heat spreader 有权
    半导体封装带散热器

    公开(公告)号：US06919630B2

    公开(公告)日：2005-07-19

    申请号：US10437557

    申请日：2003-05-13

    申请人： Cheng-Hsu Hsiao

    发明人： Cheng-Hsu Hsiao

    IPC分类号： H01L21/56 ,  H01L23/10 ,  H01L23/36 ,  H01L23/34

    CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/10 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  Y10S257/93 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A semiconductor package with an embedded heat spreader (EHS) is proposed, which can be used for the fabrication of a semiconductor package, such as a FCBGA (Flip-Chip Ball Grid Array) package with a heat spreader, and which is characterized by the provision of a plurality of recessed portions, either in the heat spreader attach area of the substrate, or in the support portion of the heat spreader, or in both, so as to allow the fill-in portions of the adhesive layer that are filled in these recessed portions to form anchor structures to benefit the heat spreader against crosswise shear stress. Moreover, since the provision of these recessed portions allows an increase in the contact area of the adhesive layer with the substrate and the heat spreader, it can help increase the adhesive strength to provide the heat spreader more securely adhered in position on the substrate.

    摘要翻译： 提出了具有嵌入式散热器（EHS）的半导体封装，其可用于制造半导体封装，例如具有散热器的FCBGA（倒装芯片球栅阵列）封装，其特征在于： 在基板的散热器安装区域或散热器的支撑部分中或在两者中设置多个凹部，以便允许填充的粘合剂层的填充部分 这些凹陷部分形成锚结构，以便使散热器免受横向剪切应力的影响。 此外，由于设置这些凹部可以增加粘合剂层与基材和散热器的接触面积，所以可以有助于提高粘合强度，从而使散热器更牢固地粘附在基板上的适当位置。