公开(公告)号：US08690455B2

公开(公告)日：2014-04-08

申请号：US13532829

申请日：2012-06-26

Applicant: Shmuel Levy ,  Shai Rephaeli ,  Nimer Khazen ,  Yonatan Malkiman

Inventor： Shmuel Levy ,  Shai Rephaeli ,  Nimer Khazen ,  Yonatan Malkiman

IPC: G02B6/38 ,  G02B6/43

CPC classification number: G02B6/3885 ,  G02B6/2804 ,  G02B6/2817 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49826

Abstract: An apparatus includes an optical Input/Output (I/O) connector, which has a central axis that is mounted in a plane and which is configured to connect to external optical fibers for transferring input optical signals to the apparatus and output optical signals from the apparatus. A first optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the input optical signals from the optical I/O connector to respective optical detectors. A second optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the output optical signals from respective optical emitters to the optical connector. A light rotation module is configured to bend and transfer the input and output optical signals between the optical I/O connector and the perpendicularly-mounted first and second optical ferrules.

Abstract translation: 一种设备包括光输入/输出（I / O）连接器，其具有安装在平面中的中心轴，并被配置为连接到外部光纤以将输入光信号传送到设备并输出来自 仪器。 第一光学套圈垂直于平面中的光学I / O连接器安装，并且被配置为将输入的光信号从光学I / O连接器传送到相应的光学检测器。 第二光学套圈垂直于平面中的光学I / O连接器安装，并且被配置为将来自相应的光发射器的输出光信号传送到光学连接器。 光旋转模块被配置为在光学I / O连接器和垂直安装的第一和第二光学套圈之间弯曲和传送输入和输出光学信号。

公开(公告)号：US20130328543A1

公开(公告)日：2013-12-12

申请号：US13567527

申请日：2012-08-06

Applicant: Lien-Hsing CHEN ,  Li-Hao Liu ,  Cheng-Te Tsai

Inventor： Lien-Hsing CHEN ,  Li-Hao Liu ,  Cheng-Te Tsai

IPC: G05F3/04

CPC classification number: H02M7/003 ,  H01F5/00 ,  H01F27/292 ,  H01F27/402 ,  H01F2027/297 ,  H02M3/00 ,  H05K1/144 ,  H05K1/145 ,  H05K1/148 ,  H05K1/18 ,  H05K1/189 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/09181 ,  H05K2201/1003

Abstract: A miniaturized voltage-transforming device includes a first circuit board and a second circuit board parallel to and separated from each other by a predetermined distance so that there is no physical connection therebetween, and a transformer having a plurality of primary-side pins and a plurality of secondary-side pins, wherein the transformer is located beside the first circuit board and the second circuit board, and has its primary-side pins and secondary-side pins directly or indirectly connected to the first circuit board and the second circuit board physically, so that the transformer is electrically connected to the first circuit board and the second circuit board via the primary-side pins and the secondary-side pins.

Abstract translation: 小型化电压转换装置包括第一电路板和彼此平行并分离预定距离的第二电路板，使得它们之间不存在物理连接，以及具有多个初级侧引脚和多个 其中所述变压器位于所述第一电路板和所述第二电路板旁边，并且其初级侧引脚和次级侧引脚在物理上直接或间接地连接到第一电路板和第二电路板， 使得变压器经由初级侧引脚和次级侧引脚电连接到第一电路板和第二电路板。

公开(公告)号：US08471377B2

公开(公告)日：2013-06-25

申请号：US13091204

申请日：2011-04-21

Applicant: Naoki Kosaka ,  Hirotaka Amasuga ,  Kou Kanaya

Inventor： Naoki Kosaka ,  Hirotaka Amasuga ,  Kou Kanaya

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L24/80 ,  H01L21/6835 ,  H01L23/49833 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/2003 ,  H01L29/7322 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2224/1146 ,  H01L2224/11831 ,  H01L2224/11845 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27831 ,  H01L2224/27845 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/8001 ,  H01L2224/80013 ,  H01L2224/80123 ,  H01L2224/80129 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H05K1/14 ,  H05K2201/047 ,  H05K2201/10515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01049 ,  H01L2924/01031

Abstract: A semiconductor circuit substrate includes a transistor-forming substrate and a circuit-forming substrate. The transistor-forming substrate is a GaN substrate and has a Bipolar Junction Transistor (BJT) located in its top surface. The bottom surface of the transistor-forming substrate is flat and has contact regions. The circuit-forming substrate is a material other than a compound semiconductor and has no semiconductor active elements. The circuit-forming substrate has a flat top surface, contact regions buried in and exposed at the top surface, and passive circuits. The transistor-forming substrate and the circuit-forming substrate are directly bonded together without any intervening film, such as an insulating film.

Abstract translation: 半导体电路衬底包括晶体管形成衬底和电路形成衬底。 晶体管形成衬底是GaN衬底并且具有位于其顶表面中的双极结晶体管（BJT）。 晶体管形成基板的底表面是平坦的并且具有接触区域。 电路形成用基板是化合物半导体以外的材料，不具有半导体活性元素。 电路形成基板具有平坦的顶表面，埋入并暴露在顶表面的接触区域和无源电路。 晶体管形成基板和电路形成基板直接接合在一起，而没有任何中间膜，例如绝缘膜。

公开(公告)号：US20130092421A1

公开(公告)日：2013-04-18

申请号：US13699883

申请日：2010-12-24

Applicant: Atsushi Kajiya

Inventor： Atsushi Kajiya

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0393 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/10106

Abstract: The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer 3a adapted to be electrically connected to a circuit element, an insulating layer 2, and a heat dissipation layer 3b, and which is characterized in that said wiring layer 3a is formed of a copper foil which has a tensile strength of 250 MPa or less and a thickness of 50 μm or less, and said heat dissipation layer is formed of a copper foil which has a tensile strength of 400 MPa or more and a thickness of 70 μm or more.

Abstract translation: 本发明提供了一种具有散热层的柔性电路板，能够容易地实现弯曲加工，同时实现其减薄，并且可以保持散热层的平坦度。 柔性电路板至少具有适于电连接到电路元件，绝缘层2和散热层3b的布线层3a，其特征在于，所述布线层3a由铜 箔的拉伸强度为250MPa以下，厚度为50μm以下，所述散热层由拉伸强度为400MPa以上且厚度为70μm以上的铜箔形成。

公开(公告)号：US20130083533A1

公开(公告)日：2013-04-04

申请号：US13678887

申请日：2011-05-10

Applicant: Raymond G. Janik ,  Carlo Scianna ,  Ted Lowl Thompson

Inventor： Raymond G. Janik ,  Carlo Scianna ,  Ted Lowl Thompson

IPC: F21V21/00

CPC classification number: F21V21/00 ,  F21K9/232 ,  F21K9/90 ,  F21V3/00 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/14 ,  H05K3/0052 ,  H05K3/0061 ,  H05K2201/047 ,  H05K2201/10106 ,  Y10T29/49002

Abstract: A method of forming a light bulb core, and a light bulb or lamp incorporating the core. The method includes forming a heat sink having at least six working facets located equally on opposite sides of a central plane, and then mounting a light source on each of the working facets. The light sources are mounted on circuit boards, each circuit board corresponding to a respective one of the working facets. The boards are then applied to respective working facets. The bulb is composed of a screw base, an external heat sink mounted in the screw base, and the light bulb core mounted in and extending from the external heat sink. The light source comprises a plurality of light emitting diodes.

Abstract translation: 一种形成灯泡芯的方法，以及结合该芯的灯泡或灯。 该方法包括形成散热器，其具有均匀地位于中心平面的相对侧上的至少六个工作面，然后将光源安装在每个工作面上。 光源安装在电路板上，每个电路板对应于相应的一个工作面。 然后将板应用于相应的工作面。 灯泡由螺丝底座，安装在螺丝底座中的外部散热器和安装在外部散热器中并从外部散热器延伸的灯泡芯组成。 光源包括多个发光二极管。

公开(公告)号：US20130025369A1

公开(公告)日：2013-01-31

申请号：US13194574

申请日：2011-07-29

Applicant: Matthew S. Bottkol ,  Richard D. Elliott ,  Michael Y. Feng ,  Thomas F. Marinis ,  Michael F. McManus ,  Shan Mohiuddin ,  Peter G. Sherman ,  John E. Pritchett ,  Jeffery W. Warren ,  Charles H. Lange

Inventor： Matthew S. Bottkol ,  Richard D. Elliott ,  Michael Y. Feng ,  Thomas F. Marinis ,  Michael F. McManus ,  Shan Mohiuddin ,  Peter G. Sherman ,  John E. Pritchett ,  Jeffery W. Warren ,  Charles H. Lange

IPC: G01P15/08 ,  H05K3/30

CPC classification number: H05K1/0201 ,  H05K2201/047 ,  H05K2201/062 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/4913

Abstract: A micro-electro-mechanical systems (MEMS) inertial measurement system facilitates accurate location and/or attitude measurements via passive thermal management of MEMS inertial sensors. Accuracy of the system is also improved by subjecting the inertial sensors to programmed single-axis gimbal motion, and by performing coarse and fine adjustments to the attitude estimates obtained by the system based on the programmed motion and on the passive thermal management of the sensors.

Abstract translation: 微机电系统（MEMS）惯性测量系统通过MEMS惯性传感器的被动热管理有助于精确定位和/或姿态测量。 通过对惯性传感器进行编程的单轴万向运动，并且通过基于编程的运动和传感器的被动热管理对系统获得的姿态估计进行粗略和精细的调整，也提高了系统的精度。

公开(公告)号：US20120243195A1

公开(公告)日：2012-09-27

申请号：US13228357

申请日：2011-09-08

Applicant: Gukchan Lim ,  Seehyung Lee ,  Kun Joo ,  Sangmo Park ,  Jinsu Lee ,  Dongchul Jin ,  Sooyoul Yang ,  Yoonho Kim

Inventor： Gukchan Lim ,  Seehyung Lee ,  Kun Joo ,  Sangmo Park ,  Jinsu Lee ,  Dongchul Jin ,  Sooyoul Yang ,  Yoonho Kim

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K1/141 ,  H05K1/144 ,  H05K2201/047

Abstract: A printed circuit board (PCB) assembly includes a main PCB, a body PCB and a cover PCB. The main PCB has a first electronic component mounted thereon. The body PCB is mounted on the main PCB and includes a cavity therethrough. The first electronic component is positioned within the cavity when the body PCB is mounted on the main PCB. The cover PCB is aligned and mounted on the body PCB to cover the cavity. The cover PCB has a second electronic component mounted on a surface thereof. When the cover PCB is mounted on the body PCB, the second electronic component is positioned within the cavity and faces the main PCB. A method of fabricating the PCB assembly and a mobile terminal including the PCB assembly are also provided.

Abstract translation: 印刷电路板（PCB）组件包括主PCB，主体PCB和盖PCB。 主PCB具有安装在其上的第一电子部件。 主体PCB安装在主PCB上并且包括穿过其中的空腔。 当主体PCB安装在主PCB上时，第一个电子元件位于腔内。 盖PCB对准并安装在主体PCB上以覆盖空腔。 盖PCB具有安装在其表面上的第二电子部件。 当盖PCB安装在主体PCB上时，第二电子部件位于空腔内并面向主PCB。 还提供了制造PCB组件的方法和包括PCB组件的移动终端。

公开(公告)号：US20120151098A1

公开(公告)日：2012-06-14

申请号：US13154325

申请日：2011-06-06

Applicant: Jason A. Sullivan

Inventor： Jason A. Sullivan

IPC: G06F13/00 ,  G06F21/00 ,  G06F1/16

CPC classification number: G06F1/181 ,  G06F1/1607 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/183 ,  G06F1/20 ,  G06F2200/1635 ,  H05K1/14 ,  H05K2201/047

Abstract: The present invention relates to systems and methods for providing a universal computing system. Implementations include a modular motherboard having two or more electronic circuit boards that are connected to form a motherboard. The two or more electronic circuit boards each include a security key structure on a connector for providing a keyed connector therebetween. Computing components may be provided on two of the major surfaces of the first electronic circuit board circuit board. Components are disclosed in which the computing system will not turn on unless the first printed circuit board is electrically connected to the second printed circuit board. A heat sink is disclosed that may be used in the universal computing system. A customizable encasement is disclosed. An expandable memory device is disclosed.

Abstract translation: 本发明涉及用于提供通用计算系统的系统和方法。 实现包括具有两个或多个连接以形成主板的电子电路板的模块化主板。 两个或更多个电子电路板各自包括用于在其间提供键控连接器的连接器上的安全密钥结构。 计算部件可以设置在第一电子电路板电路板的两个主表面上。 公开了其中计算系统将不会打开的组件，除非第一印刷电路板电连接到第二印刷电路板。 公开了可以在通用计算系统中使用的散热器。 公开了可定制的包装。 公开了一种可扩展存储器件。

公开(公告)号：US08164912B2

公开(公告)日：2012-04-24

申请号：US12524245

申请日：2007-10-09

Applicant: Cunliang Tong ,  Shuxian Shi

Inventor： Cunliang Tong ,  Shuxian Shi

IPC: H05K5/02

CPC classification number: G06F21/86 ,  H05K1/0275 ,  H05K1/0284 ,  H05K1/141 ,  H05K5/0208 ,  H05K2201/047 ,  H05K2201/10151

Abstract: The present invention is adapted for field of electronic circuit protection and provides a security protection box, for enclosing the protected region of a protected circuit board in order to protect the elements in the protected region. The security protection box comprises a circuit board. The circuit board with thin center and thick periphery forms a box shape, and has the circuit routing layers. The circuit routing layers trigger the associated circuit to erase or destroy the information in the elements in the protected region when the circuit routing layers are physically attacked. The present invention protects the elements in the protected region through covering the protected region on the protected circuit board with a circuit board having thin center and thick periphery.

Abstract translation: 本发明适用于电子电路保护领域，并提供了一个安全保护盒，用于封装受保护电路板的受保护区域，以保护受保护区域中的元件。 安全保护箱包括电路板。 具有薄中心和厚边缘的电路板形成盒形，并具有电路布线层。 当电路布线层遭到物理攻击时，电路布线层触发相关电路以擦除或破坏受保护区域中的元件中的信息。 本发明通过用具有薄的中心和厚的外围的电路板覆盖受保护的电路板上的保护区域来保护受保护区域中的元件。

公开(公告)号：US08000105B2

公开(公告)日：2011-08-16

申请号：US12172580

申请日：2008-07-14

Applicant: Jonathan Randall Hinkle

Inventor： Jonathan Randall Hinkle

IPC: H05K1/00

CPC classification number: G06F1/20 ,  H05K1/117 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/09745 ,  H05K2201/10159 ,  H05K2203/302 ,  Y10T29/49002

Abstract: Memory systems and methods of forming memory modules. In one embodiment, a computer memory system includes a substantially tubular frame with an elongate card edge extending along the frame. A flexible circuit comprising a flexible substrate, a plurality of memory chips affixed to the flexible substrate, and a plurality of electrical terminals interconnected with the memory chips, is secured along a perimeter of the tubular frame with the electrical terminals arranged along the card edge.

Abstract translation: 内存系统和形成内存模块的方法。 在一个实施例中，计算机存储器系统包括具有沿框架延伸的细长卡边缘的基本上管状的框架。 包括柔性基板，固定到柔性基板的多个存储芯片以及与存储芯片互连的多个电端子的柔性电路沿着管状框架的周边被固定，电端子沿卡边缘布置。