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    Process and arrangement for connecting a plurality of mutually remote electric contact points
    111.
    发明授权
    Process and arrangement for connecting a plurality of mutually remote electric contact points 失效
    用于连接多个相互远离的电接触点的处理和布置

    公开(公告)号：US06027347A

    公开(公告)日：2000-02-22

    申请号：US860438

    申请日：1997-08-26

    Applicant: Hans Reichle

    Inventor： Hans Reichle

    IPC: H01R12/77 ,  H01R24/62 ,  H01R31/02 ,  H01R35/02 ,  H05K1/00 ,  H05K1/11 ,  H01R9/07

    CPC classification number: H05K1/118 ,  H01R12/777 ,  H01R2107/00 ,  H01R24/62 ,  H05K1/029 ,  H05K2201/0133 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10189 ,  H05K2201/10363

    Abstract: In a connection device with a number of spaced and through-connected electrical contacts, the contacts are through-connected by means of band-shaped flexible printed conductor foil, whereby at least partially electrically separable contacts are through-connected via a number of at least partially parallel printed conductors on the printed conductor foil and whereby printed conductor sections create direct plugged contacts tacts in the plug areas of modular plugging and/or socket means of the connection device.

    Abstract translation: PCT No.PCT / CH96 / 00375 Sec。 371日期：1997年8月26日 102（e）日期1997年8月26日PCT 1996年10月24日PCT公布。 出版物WO96 / 40955 日期1996年12月19日在具有多个间隔并且连通的电触点的连接装置中，触点通过带状柔性印刷导体箔通过连接，由此至少部分电可分离触点通过 印刷导体箔上的至少部分平行的印刷导体的数量，由此印刷的导体部分在连接装置的模块化插塞和/或插座装置的插塞区域中产生直接的插入触点。

    Thermal print head
    113.
    发明授权
    Thermal print head 失效
    热打印头

    公开(公告)号：US5166700A

    公开(公告)日：1992-11-24

    申请号：US814451

    申请日：1991-12-30

    Applicant: Shigeo Ota

    Inventor： Shigeo Ota

    IPC: B41J2/345 ,  H05K3/22

    CPC classification number: B41J2/345 ,  H05K3/222 ,  H05K2201/10287 ,  H05K2201/10363 ,  H05K2201/10689

    Abstract: A thermal print head comprises a head circuit board which is made of an insulating material, the heat circuit board carrying a heating resistor, a plurality of drive elements for heating the resistor, a plurality of connection terminals, and a wiring conductor pattern connecting the connection terminals to the drive elements. The wiring conductor pattern comprises a plurality of separate printed wirings, at least one of the wirings having at least one pair of separated ends which are connected by a raised wire, at least one of the other wirings being made to extend between the pair of separated ends.

    Abstract translation: 热敏打印头包括由绝缘材料制成的头电路板，承载加热电阻器的热电路板，用于加热电阻器的多个驱动元件，多个连接端子和连接该连接件的布线导体图案 端子到驱动元件。 所述布线导体图案包括多个单独的印刷布线，所述布线中的至少一个具有至少一对分开的端部，所述至少一对分隔端部通过凸起的线连接，所述另一布线中的至少一个布线在所述一对分离的布线之间延伸 结束。

    Three dimensional circuit modules for thick-film circuits and the like and methods for making same
    116.
    发明授权
    Three dimensional circuit modules for thick-film circuits and the like and methods for making same 失效
    用于薄膜电路的三维电路模块及其制造方法

    公开(公告)号：US3755891A

    公开(公告)日：1973-09-04

    申请号：US3755891D

    申请日：1971-06-03

    Applicant: HAWKINS S ,  MUCKELROY W

    Inventor： MUCKELROY W ,  HAWKINS S

    IPC: H01R12/55 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16 ,  H05K1/18 ,  H05K1/04

    CPC classification number: H05K1/189 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/16 ,  H05K2201/09018 ,  H05K2201/09181 ,  H05K2201/0999 ,  H05K2201/10363 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10651 ,  Y10T29/49155

    Abstract: Three Dimensional Circuit Modules For Thick-Film Circuits And The Like And Methods For Making Same are provided in which such circuits are printed in selected portions on both the internal and external walls of a hollow cylindrical substrate to remove the crossovers normally present in an equivalent planar circuit configuration. The circuit sections are disposed on the substrate such that common connections therebetween are effected by conductive clips straddling the end faces of the substrate in notches or declivities formed therein to receive the clips. Like declivities are utilized to both physically and electrically interconnect a plurality of substrates and/or external circuit components and the like. These substrates also comprise a housing for self-contained functional circuit modules of the foregoing type.

    Abstract translation: 提供用于厚膜电路等的三维电路模块及其制造方法相同的方法，其中这些电路以中空圆柱形基板的内壁和外壁的选定部分印刷，以去除通常存在于等效平面中的交叉 电路配置。 电路部分设置在基板上，使得它们之间的公共连接通过以形成在其中的凹口或倾斜度跨接在基板的端面上的导电夹来实现，以接收夹子。 类似的表现被用于物理和电互连多个基板和/或外部电路部件等。 这些基板还包括用于上述类型的独立功能电路模块的壳体。

    Circuit interconnection method for microelectronic circuitry
    117.
    发明授权
    Circuit interconnection method for microelectronic circuitry 失效
    用于微电子电路的电路互连方法

    公开(公告)号：US3597839A

    公开(公告)日：1971-08-10

    申请号：US3597839D

    申请日：1969-03-10

    Applicant: BELL TELEPHONE LABOR INC

    Inventor： JACCODINE RALPH J

    IPC: H01L27/00 ,  H05K3/22 ,  H05K3/30

    CPC classification number: H05K3/222 ,  H01L27/00 ,  H05K2201/10363 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/49789 ,  Y10T29/49792

    Abstract: A crossover interconnection element for integrated or other microelectronic circuits comprises an arch member of dielectric material, typically ceramic or oxidized silicon, having an array of substantially parallel conductive strips on the underside of the arch and projecting transversely therefrom as self-supporting members. The eight of the arched member and the thickness of the conductive strips are such as to provide clearance, and therefore electrical isolation, between the strips and a conductive pattern on an integrated circuit so that the arched member can be placed on the circuit with the conductive strips transversely disposed and bridging the conductors on the integrated circuit and the projecting terminal portions of the strips are then bonded to conductive members on the circuit board.

    SOLDERLESS BREADBOARD
    119.
    发明申请
    SOLDERLESS BREADBOARD 审中-公开

    公开(公告)号：US20180199430A1

    公开(公告)日：2018-07-12

    申请号：US15399924

    申请日：2017-01-06

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Fraser I. MACINTOSH

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0286 ,  H05K1/115 ,  H05K2201/10303 ,  H05K2201/10363

    Abstract: Embodiments of the invention provide a solderless breadboard for prototyping electrical circuits. The breadboard includes a plurality of electrically conductive lines arranged parallel to each other on an electrically non-conductive breadboard structure. An electrically conductive line includes a plurality of electrical insertion positions and at an electrical insertion position a moveable electrically conductive line section which is operable for breaking the electrically conductive line in moving from a closed to an open position. A plurality of pegs are inserted into the breadboard structure at electrical insertion positions to contact the moveable sections. A peg is rotatable after insertion and includes a head portion and a cylindrical shaft extending from the head portion to a terminating foot. The shaft includes a centrally arranged channel extending from an opening in the head portion towards the terminating foot.

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