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公开(公告)号：US20130270588A1
公开(公告)日：2013-10-17
申请号：US13850375
申请日：2013-03-26
Inventor： CHIOU-YUEH WANG , CHEN-HSIU LIN , SHIH-CHANG HSU
IPC: H01L33/62 , H01L27/15 , H01L23/495
CPC classification number: H01L33/62 , F21K9/00 , F21S4/20 , F21Y2103/10 , F21Y2115/10 , H01L23/495 , H01L25/0753 , H01L27/153 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: A lead frame assembly includes a surrounding frame and a plurality of lead frame sets arranged in a matrix. Each lead frame set includes spaced-apart first and second lead frames and a connecting structure interconnecting one of the lead frame sets to an adjacent lead frame set. Each lead frame set is further connected to the surrounding frame through the connecting structure thereof. A plurality of insulated bars are spacedly formed on a lead frame panel. Each insulated bar covers a corresponding row of the lead frame sets and exposes bottom surfaces of the first and second lead frames. Each insulated bar further covers portions of the surrounding frame that are adjacent to two opposite outermost ones of the lead frame sets.
Abstract translation: 引线框架组件包括围绕框架和布置成矩阵的多个引线框架组件。 每个引线框架组包括间隔开的第一引线框架和第二引线框架以及将引线框架组中的一个互连到相邻引线框架组的连接结构。 每个引线框架组件通过其连接结构进一步连接到周围框架。 多个绝缘棒间隔地形成在引线框架面板上。 每个绝缘棒覆盖引线框架组的相应行并且暴露第一引线框架和第二引线框架的底表面。 每个绝缘棒还覆盖与引线框架组中两个相对最外面的框架相邻的周围框架的部分。
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132.发明申请公开(公告)号：US20130126928A1
公开(公告)日：2013-05-23
申请号：US13713307
申请日：2012-12-13
Inventor： CHIH-CHIANG KAO
CPC classification number: H01L33/52 , H01L33/0095 , H01L33/20 , H01L33/385 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/62 , H01L2224/32145 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/01019 , H01L2924/01087 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting diode chip includes a substrate, an epitaxial layer, two inclined plane units, and two electrode units. The substrate has top and bottom surfaces. The epitaxial layer is disposed on the top surface of the substrate. Each of the inclined plane units is inclined downwardly and outwardly from the epitaxial layer toward the bottom surface of the substrate, and includes an inclined sidewall formed on the epitaxial layer, and a substrate inclined wall formed on the substrate. Each of the electrode units includes an electrode disposed on the epitaxial layer, and a conductive portion extending from the electrode to the substrate inclined wall along corresponding one of the inclined plane units.
Abstract translation: 发光二极管芯片包括衬底，外延层，两个倾斜平面单元和两个电极单元。 衬底具有顶表面和底表面。 外延层设置在基板的顶表面上。 每个倾斜平面单元从外延层朝向基板的底表面向下和向外倾斜，并且包括形成在外延层上的倾斜侧壁和形成在基板上的基板倾斜壁。 每个电极单元包括设置在外延层上的电极和从相应的一个倾斜平面单元从电极延伸到基板倾斜壁的导电部分。
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公开(公告)号：US10686096B2
公开(公告)日：2020-06-16
申请号：US16188182
申请日：2018-11-12
Inventor： Tsan-Yu Ho , Chen-Hsiu Lin , Meng-Sung Chou
IPC: H01L31/14 , A61B5/026 , H01L31/173 , H01L31/02 , H01L31/024 , A61B5/1455 , A61B5/00
Abstract: A lead frame includes a main plate and a side plate. The main plate has a support portion and a projecting portion. The support portion has two opposite first sides and a support face located between the first sides. The projecting portion projects upward from one of the first sides in a direction opposite to the support face. The side plate is disposed separately from the one of the first sides of the support portion and is spaced apart from the projecting portion.
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134.发明授权公开(公告)号：US10097177B2
公开(公告)日：2018-10-09
申请号：US15262188
申请日：2016-09-12
Inventor： Wen-Che Tsai , Shih-Ming Chen , Yong-Long Lee , Jin-Yuan Lai
IPC: H03K17/687 , H03K17/567 , H02J9/06 , H03K17/12 , H03K17/693 , H03K17/73 , H01H71/12 , H03K17/51
Abstract: A switch device includes first and second switch units that are coupled respectively to first and second output terminals. Each of the first and second switch units includes a plurality of diodes and at least one semiconductor-controlled rectifier (SCR), where at least one of the diodes and one of the at least one SCR cooperatively permit a current to flow therethrough to a corresponding one of the first and second output terminals when each thereof operates in an ON state, and where at least one of the diodes and one of the at least one SCR cooperatively permit a current to flow therethrough from a corresponding one of the first and second output terminals when each thereof operates in an ON state.
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公开(公告)号：US20180145205A1
公开(公告)日：2018-05-24
申请号：US15795739
申请日：2017-10-27
Inventor： HUNG-JUI CHEN , TSAN-YU HO , MENG-SUNG CHOU
IPC: H01L31/167 , G01J1/02 , G01J1/08 , H01L33/62 , H01L33/52 , H01L25/16 , H01L31/02 , A61B5/0205
CPC classification number: H01L31/167 , A61B5/0205 , A61B5/02433 , A61B5/0816 , A61B5/14552 , A61B5/6801 , A61B2562/0238 , G01J1/0209 , G01J1/0214 , G01J1/08 , H01L25/165 , H01L25/167 , H01L31/02005 , H01L33/52 , H01L33/62 , H01L2224/05554 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
Abstract: An optical biosensor module includes a circuit board having a mounting surface and first and second circuits. A light-receiving unit is disposed on the mounting surface, and includes a light receiver electrically connected to the first circuit and having a light-receiving surface. A light-emitting unit is disposed on the light-receiving surface, and includes a light emitter electrically connected to the second circuit and having a light-emitting surface, and a light emitter blocking wall surrounding the light emitter. An opaque interface exists between the light receiver and the light emitter, and a top side of the light emitter blocking wall is equal to or higher than the light-emitting surface.
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Patent Agency Ranking
公开(公告)号：US09954447B2
公开(公告)日：2018-04-24
申请号：US15155231
申请日：2016-05-16
Inventor： Ming-Chuan Yen , Chih-Hua Kung
CPC classification number: H02M3/33507 , H02M1/08 , H02M1/42 , H02M1/44 , H02M3/33523 , H02M2001/0009 , H02M2001/0025 , H03K5/00006 , H03K17/687 , Y02B70/12
Abstract: A power supply apparatus includes a flyback converter and a controller. The controller generates, in response to an output voltage generated by the flyback converter and stabilized at a selected one of a plurality of voltage values, a control signal associated with the selection of the voltage values. Based at least on the output voltage and the control signal, the controller generates a feedback voltage associated with loading of the power supply apparatus, and controls a switch of the flyback converter in such a manner that the switch operates at a switching frequency associated with the feedback voltage, and that at least one of the feedback voltage or a curve of the switching frequency with respect to the feedback voltage changes due to the control signal.
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公开(公告)号：US09933147B2
公开(公告)日：2018-04-03
申请号：US15080957
申请日：2016-03-25
Applicant: LITE-ON TECHNOLOGY CORP.
Inventor： Shih-Chang Wang , Pin-Hao Hsu , Hamid Kashani
IPC: F21V31/03 , F21V25/10 , F21V23/06 , F21V31/00 , F21W131/10
CPC classification number: F21V25/10 , F21V23/06 , F21V31/005 , F21W2131/10 , H01R13/6666 , H01R13/688
Abstract: A terminal block assembly includes a block housing, a surge protection device, a plurality of cable-receiving seats, a plurality of connector sets and a first fuse. The block housing defines an accommodating space that confines the surge protection device. The cable-receiving seats and the connector sets are mounted on the block housing. Each of the connector sets includes at least one first connector that is electrically connected to a light-emitting module of an outdoor lamp, and a second connector that extends into the accommodating space and that is electrically connected to the surge protection device. The first fuse is mounted to the block housing, and is electrically connected to the surge protection device.
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公开(公告)号：US09929635B2
公开(公告)日：2018-03-27
申请号：US14988091
申请日：2016-01-05
Inventor： I-Chao Chiu , Yeh Guan
CPC classification number: H02M1/12 , H02M1/126 , H02M1/44 , H02M3/28 , H02M3/335 , H02M7/04 , H02M2001/007
Abstract: A leakage current suppression circuit is adapted for use with an AC-to-DC power supply that includes a bridge rectifier converting an AC input voltage into a DC voltage and outputting the DC voltage through a first output terminal and a grounded second output terminal thereof, a DC-to-DC converter converting the DC voltage into a predetermined DC output voltage and outputting the DC output voltage through a first output end and a grounded second output end thereof, and a capacitor coupled to the second output terminal of the bridge rectifier at one terminal thereof. The leakage current suppression circuit includes a first impedance unit and a second impedance unit each coupled in parallel between the other terminal of the capacitor and ground.
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公开(公告)号：US09817449B2
公开(公告)日：2017-11-14
申请号：US14837391
申请日：2015-08-27
Inventor： Shu-Hua Mau , Yue-Wen Jiang
Abstract: A housing includes a housing body formed with an engaging groove and a carrier device disposed in the housing body. The carrier device includes a carrier frame and a latching assembly. The carrier frame is configured to carry an electronic component and includes a pivoting sidewall rotatably pivoted to the housing body. The carrier frame is rotatable between a first position, where the carrier frame is disposed in the housing body, and a second position, where the carrier frame is pivoted out of the housing body. The latching assembly is disposed on the pivoting sidewall and is releasably engaged to the engaging groove so as to position the carrier frame at the second position.
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公开(公告)号：US09812608B2
公开(公告)日：2017-11-07
申请号：US15258322
申请日：2016-09-07
Inventor： Kuo-Ming Chiu , Meng-Sung Chou , Hao-Chung Kuo , Che-Yu Liu
Abstract: A deep UV LED chip includes a light-emitting unit, an electrode unit, an electron blocking layer, and an optical layer. The electron blocking layer is disposed between a multiple quantum well layer and a p-type aluminum gallium nitride layer of the light-emitting unit. The optical layer is formed on the light-emitting unit and has a refractive index ranging from 1.0 to 2.3. Another deep UV LED chip further includes a light-transmitting substrate. The optical layer is formed on the light-transmitting substrate and has a refractive index ranging from 1.0 to a refractive index of the light-transmitting substrate. A package structure containing the deep UV LED chip is also disclosed.
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