公开(公告)号：US20110273930A1

公开(公告)日：2011-11-10

申请号：US12904792

申请日：2010-10-14

Applicant: Kuo-Pin Chang ,  Hang-Ting Lue

Inventor： Kuo-Pin Chang ,  Hang-Ting Lue

IPC: G11C11/36

CPC classification number: G11C13/0002 ,  G11C2213/33 ,  G11C2213/72

Abstract: A diode memory device has an intermediate structure between the two terminals, such as a p terminal and the n terminal.

Abstract translation: 二极管存储器件在两个端子之间具有中间结构，例如p端子和n端子。

公开(公告)号：US20110241061A1

公开(公告)日：2011-10-06

申请号：US12879584

申请日：2010-09-10

Applicant: Chen-Hua YU ,  Hung-Pin CHANG ,  Yung-Chi LIN ,  Chia-Lin YU ,  Jui-Pin HUNG ,  Chien Ling HWANG

Inventor： Chen-Hua YU ,  Hung-Pin CHANG ,  Yung-Chi LIN ,  Chia-Lin YU ,  Jui-Pin HUNG ,  Chien Ling HWANG

IPC: H01L33/48

CPC classification number: H01L21/76898 ,  H01L21/3065 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76843 ,  H01L21/76876 ,  H01L21/76877 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L33/005 ,  H01L33/0054 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2933/0066 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The package substrates with through silicon plugs (or vias) described above provide lateral and vertical heat dissipation pathways for semiconductor chips that require thermal management. Designs of through silicon plugs (TSPs) with high duty ratios can most effectively provide heat dissipation. TSP designs with patterns of double-sided combs can provide high duty ratios, such as equal to or greater than 50%. Package substrates with high duty ratios are useful for semiconductor chips that generate large amount of heat. An example of such semiconductor chip is a light-emitting diode (LED) chip.

Abstract translation: 具有上述通孔硅封装（或通孔）的封装衬底为需要热管理的半导体芯片提供侧向和垂直散热​​路径。 具有高占空比的通过硅插头（TSP）的设计可以最有效地提供散热。 具有双面梳状图案的TSP设计可以提供等于或大于50％的高占空比。 具有高占空比的封装衬底对于产生大量热量的半导体芯片是有用的。 这种半导体芯片的例子是发光二极管（LED）芯片。

公开(公告)号：US20110241040A1

公开(公告)日：2011-10-06

申请号：US12897124

申请日：2010-10-04

Applicant: Chen-Hua YU ,  Hung-Pin CHANG ,  Yung-Chi LIN ,  Chia-Lin YU ,  Jui-Pin HUNG ,  Chien Ling HWANG

Inventor： Chen-Hua YU ,  Hung-Pin CHANG ,  Yung-Chi LIN ,  Chia-Lin YU ,  Jui-Pin HUNG ,  Chien Ling HWANG

IPC: H01L33/38 ,  H01L23/532 ,  H01L21/768

CPC classification number: H01L21/76898 ,  H01L21/3065 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76843 ,  H01L21/76876 ,  H01L21/76877 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L33/005 ,  H01L33/0054 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2933/0066 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns.

Abstract translation: 具有上述通孔硅衬底（或通孔）的基板消除了对导电凸块的需要。 流程非常简单，成本效益高。 所描述的结构将单独的TSV，再分配层和导电凸块结构组合成单个结构。 通过组合单独的结构，产生具有高散热能力的低电阻电连接。 此外，具有通过硅插头（或通孔或沟槽）的基板还允许将多个芯片封装在一起。 通过硅沟槽可围绕一个或多个芯片，以在制造期间提供防止铜扩散到相邻器件的保护。 此外，具有相似或不同功能的多个芯片可以集成在TSV基板上。 通过具有不同图案的硅插头可以在半导体芯片下使用以改善散热并解决制造问题。

公开(公告)号：USD643433S1

公开(公告)日：2011-08-16

申请号：US29376970

申请日：2010-10-14

Applicant: Jung-Kun Hsieh ,  Guan-Hua Tzeng ,  Shan-Pin Chang

Designer： Jung-Kun Hsieh ,  Guan-Hua Tzeng ,  Shan-Pin Chang

公开(公告)号：US20110074563A1

公开(公告)日：2011-03-31

申请号：US12631502

申请日：2009-12-04

Applicant: Pin Chang ,  Yu-Jen Wang ,  Chien Li ,  Chung-De Chen ,  Pei-Fen Wu

Inventor： Pin Chang ,  Yu-Jen Wang ,  Chien Li ,  Chung-De Chen ,  Pei-Fen Wu

IPC: B62J6/00 ,  B62J6/06 ,  F03G7/08 ,  G01P3/16

CPC classification number: G01P3/16 ,  B62J6/003 ,  B62J6/06 ,  B62J6/20 ,  F03G7/08

Abstract: The present disclosure provides a swinging device having a swinging mechanism disposed on an energy provider, wherein volume and shape of the swinging mechanism and a distance between the swinging mechanism and the energy provider are adjusted so as to control the ratio of the distance and a characteristic value corresponding to the swinging mechanism in a specific range such that the swinging mechanism is capable of resonating with respect to the rotation of the energy provider. The swinging mechanism is capable of detecting the rotating frequency of the energy provider as well as combining with a display unit which is capable of displaying information with respect to the rotating status or displaying image patterns controlled according to the rotating status.

Abstract translation: 本公开提供了一种具有设置在能量提供者上的摆动机构的摆动装置，其中调节摆动机构的体积和形状以及摆动机构和能量提供者之间的距离，以便控制距离和特性的比率 相应于摆动机构的特定范围的值，使得摆动机构能够相对于能量提供者的旋转而谐振。 摆动机构能够检测能量提供者的旋转频率，以及与能够显示关于旋转状态的信息的显示单元或显示根据旋转状态控制的图像模式的组合。

公开(公告)号：US20100276658A1

公开(公告)日：2010-11-04

申请号：US12836304

申请日：2010-07-14

Applicant: Wei-Chih Chien ,  Kuo-Pin Chang ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

Inventor： Wei-Chih Chien ,  Kuo-Pin Chang ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

IPC: H01L45/00

CPC classification number: H01L45/04 ,  H01L45/085 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/146 ,  H01L45/147 ,  H01L45/148 ,  H01L45/1625 ,  H01L45/1633 ,  Y10S438/90

Abstract: A memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to them. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. Another memory device comprises first and second electrodes with a memory element and a buffer layer, having a thickness of less than 50 Å, located between and electrically coupled to them. The memory comprises one or more metal oxygen compounds. An example of a method of fabricating a memory device includes forming first and second electrodes. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride.

Abstract translation: 存储器件包括具有存储元件的第一和第二电极以及位于它们之间并与之电耦合的缓冲层。 记忆元件包括一种或多种金属氧化合物。 缓冲层包括氧化物和氮化物中的至少一种。 另一个存储器件包括具有存储元件和缓冲层的第一和第二电极，其厚度小于50，位于它们之间并与之电耦合。 记忆体包括一种或多种金属氧化合物。 制造存储器件的方法的一个例子包括形成第一和第二电极。 形成位于第一和第二电极之间并电耦合到第一和第二电极的存储器; 存储器包括一种或多种金属氧化合物，并且缓冲层包括氧化物和氮化物中的至少一种。

公开(公告)号：US20100244247A1

公开(公告)日：2010-09-30

申请号：US12722949

申请日：2010-03-12

Applicant: Hung-Pin CHANG ,  Wen-Chih CHIOU ,  Chen-Hua YU

Inventor： Hung-Pin CHANG ,  Wen-Chih CHIOU ,  Chen-Hua YU

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L21/76898 ,  H01L2924/0002 ,  Y10S438/978 ,  H01L2924/00

Abstract: A via etching process forms a through-substrate via having a round corner and a tapered sidewall profile. A method includes providing a semiconductor substrate; forming a hard mask layer and a patterned photoresist layer on the semiconductor substrate; forming an opening in the hard mask and exposing a portion of the semiconductor substrate; forming a via passing through at least a part of the of semiconductor substrate using the patterned photoresist layer and hard mask layer as a masking element; performing a trimming process to round the top corner of the via; and removing the photoresist layer.

Abstract translation: 通孔蚀刻工艺通过具有圆角和锥形侧壁轮廓形成通孔基板。 一种方法包括提供半导体衬底; 在所述半导体衬底上形成硬掩模层和图案化的光致抗蚀剂层; 在所述硬掩模中形成开口并暴露所述半导体衬底的一部分; 使用图案化的光致抗蚀剂层和硬掩模层作为掩模元件形成穿过半导体衬底的至少一部分的通孔; 执行修整过程以绕过通孔的顶角; 并除去光致抗蚀剂层。

公开(公告)号：US07804492B2

公开(公告)日：2010-09-28

申请号：US11800373

申请日：2007-05-03

Applicant: Yuan-Pin Chang

Inventor： Yuan-Pin Chang

IPC: G06F3/041

CPC classification number: G06F1/1647 ,  G06F1/1626 ,  G06F1/1639 ,  G09G3/001

Abstract: A method of controlling a portable communications device with an image projecting capability includes: controlling an image projecting unit to project an output screen of an application program, and controlling a touch control display unit to display an operation interface set up according to characteristics of the application program; and in response to actuation of the operation interface, controlling the image projecting unit such that the output screen projected thereby is a result of interaction between the operation interface and the application program.

Abstract translation: 一种控制具有图像投影能力的便携式通信装置的方法包括：控制图像投影单元投影应用程序的输出画面，并且控制触摸控制显示单元以显示根据应用的特征设置的操作界面 程序; 并且响应于操作界面的启动，控制图像投影单元使得由此投影的输出屏幕是操作界面和应用程序之间的交互的结果。

公开(公告)号：US07784070B2

公开(公告)日：2010-08-24

申请号：US11745206

申请日：2007-05-07

Applicant: Chieh-Pin Chang ,  Jen-Ping Weng

Inventor： Chieh-Pin Chang ,  Jen-Ping Weng

IPC: H04N7/16 ,  H04N7/167 ,  H04N7/20

CPC classification number: H04N7/163 ,  H04N21/4524 ,  H04N21/4623 ,  H04N21/6143

Abstract: A satellite signal receiver includes a downconverter, a GPS chip and a transmission controller. The downconverter downconverts satellite signal of digital television into baseband signal for output to the transmission controller. The GPS chip scrambles and encrypts GPS signal into address data and outputs address data to the transmission controller for enabling the transmission controller to convert address data into analog signal for output with the baseband signal to a set-top-box, which converts analog address data into digital GPS signal and compares it with an authorization address carried in the satellite signal and then outputs authorized digital television satellite signal when the comparison is matched.

Abstract translation: 卫星信号接收机包括下变频器，GPS芯片和变速器控制器。 下变频器将数字电视的卫星信号下变频为基带信号，输出到变速器控制器。 GPS芯片将GPS信号加密并加密成地址数据，并将地址数据输出到传输控制器，以使传输控制器能够将地址数据转换为模拟信号，以便将基带信号输出到机顶盒，该机顶盒将模拟地址数据 将其与卫星信号中携带的授权地址进行比较，然后在比较匹配时输出授权的数字电视卫星信号。

公开(公告)号：US07753239B2

公开(公告)日：2010-07-13

申请号：US11736014

申请日：2007-04-17

Applicant: Hsu-pin Chang

Inventor： Hsu-pin Chang

IPC: B65D83/00

CPC classification number: B67D1/0462

Abstract: A pressurized water container for use with a drinking water purification system includes a housing having a top opening and lower first and second valves; a sealing assembly releasably mounted on the opening of the housing; a flexible upper water chamber including a top opening in communication with the opening of the housing; a lower pressure chamber having a rigid top surface fixedly secured to an inner surface of the housing wherein pressurized air is adapted to feed into the pressure chamber through the second valve for storage; an air chamber between the water chamber and the pressure chamber; and a tube interconnecting the first valve and a bottom surface of the air chamber, the tube having a port in communication with the pressure chamber, and a hand wheel for either opening or closing the port. Replacement of the water chamber is made easy by detaching the sealing assembly.

Abstract translation: 一种与饮用水净化系统一起使用的加压水容器包括具有顶部开口和下部第一和第二阀门的壳体; 密封组件，其可释放地安装在所述壳体的所述开口上; 柔性上水室，包括与壳体的开口连通的顶部开口; 低压室，其具有固定地固定到壳体的内表面的刚性顶表面，其中加压空气适于通过第二阀进入压力室以进行储存; 在水室和压力室之间的空气室; 以及将所述第一阀和所述空气室的底表面互连的管，所述管具有与所述压力室连通的端口，以及用于打开或关闭所述端口的手轮。 通过拆卸密封组件，可以方便地更换水室。