公开(公告)号：US09874586B2

公开(公告)日：2018-01-23

申请号：US14533526

申请日：2014-11-05

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01R1/18 ,  G01R31/28 ,  G01R1/073 ,  G01R1/067

CPC classification number: G01R1/18 ,  G01R1/06772 ,  G01R1/07307 ,  G01R31/2884 ,  G01R31/2886

Abstract: A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.

公开(公告)号：US20170373040A1

公开(公告)日：2017-12-28

申请号：US15368159

申请日：2016-12-02

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani

IPC: H01L25/065 ,  G01R31/27 ,  H01L25/00 ,  G01R31/28 ,  H01L21/66

CPC classification number: H01L25/0657 ,  G01R31/27 ,  G01R31/2884 ,  H01L22/14 ,  H01L22/32 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device provided with a package housing a stacked structure formed by dies of semiconductor material, which have a respective integrated circuit and a respective top surface, which extends in a horizontal plane, and are stacked on one another in a vertical direction, transverse to the horizontal plane, and staggered parallel to the same horizontal plane. Provided at a first portion of the top surface is a first plurality of contact pads, and provided at a second portion of the top surface is a second plurality of contact pads. The first portion is covered by a overlying die, and the second portion is exposed and freely accessible. At least some of the contact pads of the first plurality are electrically coupled to internal through silicon vias traversing a substrate of the overlying die to put overlapping dies in electrical contact.

公开(公告)号：US09835515B2

公开(公告)日：2017-12-05

申请号：US14511346

申请日：2014-10-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto Pagani

IPC: G01L25/00 ,  G01L1/16 ,  G01L1/22 ,  G01L1/26

CPC classification number: G01L25/00 ,  G01L1/16 ,  G01L1/2206 ,  G01L1/26

Abstract: A pressure sensor is for positioning within a structure. The pressure sensor may include a pressure sensor integrated circuit (IC) having a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit. The pressure sensor may include a support body having a recess therein coupled to the pressure sensor IC so that the pressure sensor IC bends into the recess when the pressure sensor IC is subjected to external pressure.

公开(公告)号：US09823304B2

公开(公告)日：2017-11-21

申请号：US14958093

申请日：2015-12-03

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani

IPC: G01R31/3177 ,  G01R31/317 ,  G01R31/3185

CPC classification number: G01R31/3177 ,  G01R31/31713 ,  G01R31/318536 ,  G01R31/318563

Abstract: An electronic device having a functional portion and a test portion. The test portion includes a boundary scan register formed by a plurality of test cells arranged in the body according to a register sequence, where first test cells are configured to form a serial-to-parallel converter and second test cells are configured to form a parallel-to-serial converter. The test cells are each coupled to a respective data access pin of the device and to a respective input/output point of the functional part and have a first test input and a test output. The boundary scan register defines two test half-paths formed, respectively, by the first test cells and by the second test cells. The first test cells are directly coupled according to a first sub-sequence, and the second test cells are directly coupled according to a second sub-sequence.

公开(公告)号：US09778117B2

公开(公告)日：2017-10-03

申请号：US14780819

申请日：2014-03-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani

IPC: G01L1/14 ,  G01L25/00 ,  G01L1/26

CPC classification number: G01L1/142 ,  G01L1/144 ,  G01L1/148 ,  G01L1/26 ,  G01L25/00

Abstract: The integrated electronic device detects the pressure related to a force applied in a predetermined direction within a solid structure. The device includes an integrated element that is substantially orthogonal to the direction of application of the force. First and second conductive elements are configured to face an operating surface. A measure module includes first and second measurement terminals which are electrically connected to the first and second conductive elements, respectively. A detecting element is arranged in the predetermined direction such that the operating surface is sandwiched between the first and second conductive elements and this detecting element. An insulating layer galvanically insulates the first and second conductive elements. A layer of dielectric material is sandwiched between the detecting element and the insulating layer, and is elastically deformable following the application of the force to change an electromagnetic coupling between the detecting element and the first and second conductive elements.

公开(公告)号：US20170271057A1

公开(公告)日：2017-09-21

申请号：US15614292

申请日：2017-06-05

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Alessandro Motta

IPC: H01C7/10 ,  H01L49/02 ,  H01L23/34 ,  H01L29/36 ,  H01L27/02

CPC classification number: H01C7/10 ,  H01L22/34 ,  H01L23/34 ,  H01L27/0207 ,  H01L28/20 ,  H01L29/36

Abstract: In one example, a method of compensating resistance in an integrated circuit includes providing a four terminal resistor in a semiconductor substrate. The resistor includes a first resistor and a second resistor coupled in series, a first terminal at a first end of the resistor, a second terminal at a second end of the resistor, a test terminal at a node connecting the first resistor and the second resistor, and a tuning terminal. The first resistor has a first conductivity type and the second resistor has a second conductivity type opposite to the first conductivity type. The first resistor includes a first portion extending along a first direction and a second portion extending along a second direction perpendicular to the first direction. The method further includes computing a voltage to be applied at the tuning terminal to compensate the difference between the resistance of the first and the second resistors.

公开(公告)号：US09726587B2

公开(公告)日：2017-08-08

申请号：US14610068

申请日：2015-01-30

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto Pagani ,  Bruno Murari ,  Federico Giovanni Ziglioli

IPC: G01N3/08 ,  H01L23/31 ,  G01N3/06

CPC classification number: G01N3/08 ,  G01L1/005 ,  G01N3/066 ,  H01L23/3107

Abstract: A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured.

公开(公告)号：US09698295B2

公开(公告)日：2017-07-04

申请号：US15071525

申请日：2016-03-16

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01L31/0352 ,  H01L31/105 ,  H01L27/14 ,  H01L31/02 ,  H01L31/0216 ,  H01L27/146 ,  H01L31/0232

CPC classification number: H01L31/105 ,  H01L27/14 ,  H01L27/14643 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/02327 ,  H01L31/035281

Abstract: An optoelectronic device for detecting electromagnetic radiation includes a body of semiconductor material. A first region and a second region that form a junction are provided within the body. A recess extends into the body and is delimited by side arranged transverse to a main surface of the body. The junction is exposed by the sidewall to coupled electromagnetic radiation received in the recess into a photodiode formed by the junction.

公开(公告)号：US09618532B2

公开(公告)日：2017-04-11

申请号：US15081507

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giulio Ricotti ,  Alberto Pagani ,  Fulvio Vittorio Fontana ,  Ubaldo Mastromatteo

IPC: G01P15/11 ,  G01P15/105 ,  G01P15/08 ,  B81B7/00 ,  B81C1/00 ,  G01C19/5783 ,  G01P15/097

CPC classification number: G01P15/11 ,  B81B7/008 ,  B81B2201/025 ,  B81B2207/012 ,  B81C1/0023 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/097 ,  G01P15/105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis.

公开(公告)号：US20170092625A1

公开(公告)日：2017-03-30

申请号：US15376485

申请日：2016-12-12

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Giovanni Girlando

IPC: H01L25/065 ,  H01L23/66 ,  H01L23/48 ,  H01Q1/38 ,  H01L23/522 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/36 ,  H01L23/64 ,  H01L49/02

CPC classification number: H01L25/0657 ,  G01R1/07314 ,  G01R31/3025 ,  H01L23/48 ,  H01L23/481 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L28/10 ,  H01L29/82 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/207 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.