公开(公告)号：US5622303A

公开(公告)日：1997-04-22

申请号：US429715

申请日：1995-04-27

Applicant: Rainer Worthmann

Inventor： Rainer Worthmann

IPC: B23K1/08 ,  H05K3/34 ,  B23K3/06

CPC classification number: B23K1/08 ,  H05K3/3468 ,  B23K2201/36 ,  H05K2203/1581

Abstract: The method and the device serve for soldering of workpieces, namely of pc boards and substrates, which are equipped with chip component parts and/or microelements and/or assemblies comprised thereof. Such boards are passed through a main solder bath or at least one main solder wave, and the workpiece is contacted with the surface of the wave. The solder wave has an imaginary break edge 2, i.e., a break edge at which the solder loses the contact with the workpiece in connection with an unwettable workpiece. The imaginary break edge 2 of the soldering device 1 extends not in a straight line and, viewed in the direction of conveyance 3, has at least one diminution 4, i.e., two edge parts ending in a point, i.e., the edges form a triangle.

Abstract translation: 该方法和装置用于焊接装配有芯片部件和/或微元件和/或其组件的组件的印刷电路板和基板的工件。 这样的板通过主焊锡槽或至少一个主焊波，并且工件与波的表面接触。 焊波具有假想断裂边缘2，即断裂边缘，在该断裂边缘处焊料与不可接受的工件相连接失去与工件的接触。 焊接装置1的虚假断裂边缘2不是以直线延伸，并且从输送方向3看，具有至少一个减少部分4，即以一个点终止的两个边缘部分，即边缘形成三角形 。

公开(公告)号：US5560100A

公开(公告)日：1996-10-01

申请号：US411798

申请日：1995-04-03

Applicant: Klaus Englert

Inventor： Klaus Englert

IPC: H05K13/00 ,  B23K1/018 ,  H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0486 ,  B23K1/018 ,  B23K2201/36 ,  Y10T29/49131 ,  Y10T29/53052 ,  Y10T29/53087 ,  Y10T29/53178 ,  Y10T29/53183

Abstract: An apparatus for automatically removing electronic components mounted on printed circuit boards has a lighting device for illuminating the printed circuit boards, an optical sensor, an image processing systems and various devices for removing the electronic components therefrom. The image processing system recognizes the coordinates of the contours and, preferably, also the types of components from the output signals supplied by the optical sensor and controls the device for removing the electronic components. Alternatively, the contours of the electronic components are recognized by infrared radiation. Additionally, a process is disclosed for removing the electronic components from printed circuit boards using the disclosed apparatus.

Abstract translation: PCT No.PCT / DE93 / 01104 Sec。 371日期：1995年4月3日 102（e）日期1995年4月3日PCT 1993年11月20日PCT公布。 出版物WO94 / 13124 日期1994年6月9日一种用于自动移除安装在印刷电路板上的电子部件的装置具有用于照亮印刷电路板的照明装置，光学传感器，图像处理系统和用于从其中移除电子部件的各种装置。 图像处理系统从光学传感器提供的输出信号中识别轮廓的坐标，最好也识别分量的类型，并且控制用于移除电子部件的装置。 或者，通过红外辐射识别电子部件的轮廓。 此外，公开了一种使用所公开的装置从印刷电路板移除电子部件的方法。

公开(公告)号：US5545465A

公开(公告)日：1996-08-13

申请号：US449029

申请日：1995-05-24

Applicant: Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

Inventor： Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

IPC: B05C5/02 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34 ,  B32B9/00

CPC classification number: H01L24/27 ,  B23K3/0692 ,  H01L21/4853 ,  H01L21/4867 ,  H01L24/83 ,  H05K3/1233 ,  H05K3/3484 ,  B23K2201/36 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2201/0989 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K3/321 ,  H05K3/3452 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.

Abstract translation: 在电子电路的制造中将焊接剂和导电粘合剂等粘合剂施加到焊盘部位的方法使用糊剂注入头。 具有腔体开口的永久性掩模施加在载体上的导电焊盘周围。 导电垫对应于芯片附接位置。 使注射头与掩模的表面接触，并且将压力施加到注射头中的粘合剂。 然后将注射头移动到掩模的表面上，用粘合剂填充空腔开口。 然后将注射头从掩模的表面去除。 如果使用焊膏，则将红外线辐射施加到填充的空腔开口，以蒸发浆料焊剂并回流焊料，以在突出在掩模上方的空腔开口内形成焊球。 如果使用导电粘合剂，则在将掩模与所述注射头接触之前，将模板施加到掩模的表面。 当腔开口被填充时，将模板从掩模中取出，并且填充空腔开口的导电粘合剂被干燥。

公开(公告)号：US5513424A

公开(公告)日：1996-05-07

申请号：US389968

申请日：1995-02-15

Applicant: Philippe Mysson ,  Ronan Stephan

Inventor： Philippe Mysson ,  Ronan Stephan

IPC: B23K3/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/18 ,  H01G4/33

CPC classification number: H01G4/232 ,  B23K3/0653 ,  H01G4/228 ,  B23K2201/36 ,  Y10T29/435

Abstract: A method for the manufacture of foil capacitors with metallized plastic films, said method comprising the following steps:coiling at least one pair of metallized plastic films so as to form the stacked structure of the capacitors;metallizing the lateral faces of the coiled structure in order to create the plates of the capacitors;cutting out the coiled and metallized structure, or parent capacitor, into semi-finished capacitors;putting the semi-finished capacitors and their connection wires through a cleansing flux;soldering the connection wires to the plates of the semi-finished capacitors;wherein the soldering is done by wave soldering and wherein, between said metallization and said cutting, a heat treatment operation designed to give the plastic film the characteristics needed to withstand the wave soldering and a new metallization designed to ensure the mechanical and electrical quality of the connections are carried out successively.

Abstract translation: 一种用金属化塑料膜制造箔电容器的方法，所述方法包括以下步骤：卷绕至少一对金属化塑料膜，以形成电容器的堆叠结构; 对卷绕的结构的侧面进行金属化，以便形成电容器的板; 将线圈和金属化结构或母电容器切割成半成品电容器; 将半成品电容器及其连接线穿过清洁助焊剂; 将连接线焊接到半成品电容器的板上; 其中所述焊接是通过波峰焊进行的，并且其中在所述金属化和所述切割之间进行热处理操作，该热处理操作被设计成使塑料膜具有承受波峰焊所需的特性，以及设计成确保塑料膜的机械和电气质量的新的金属化 连接依次进行。

公开(公告)号：US5507882A

公开(公告)日：1996-04-16

申请号：US203176

申请日：1994-02-28

Applicant: Samuel V. Bristol ,  Eugene H. Hanaway ,  Delbert R. Walls

Inventor： Samuel V. Bristol ,  Eugene H. Hanaway ,  Delbert R. Walls

IPC: B23K35/36 ,  B23K35/34

CPC classification number: B23K35/3618 ,  B23K2201/36

Abstract: Low residue water-based soldering flux, and process and system for using the same. The flux includes a mixture of succinic, glutaric and adipic acid in water, and optionally a wetting agent. The flux is applied to a surface to be soldered. The flux is dried. The surface is soldered. The flux is applied at an application station, dried at a drying station and soldered at a soldering station.

Abstract translation: 低残留水性助焊剂，以及使用它的工艺和系统。 助熔剂包括琥珀酸，戊二酸和己二酸在水中的混合物，以及任选的润湿剂。 焊剂被施加到待焊接的表面上。 通量干燥。 表面焊接。 助焊剂在施工台施加，在干燥站干燥并在焊接站焊接。

公开(公告)号：US5499668A

公开(公告)日：1996-03-19

申请号：US330380

申请日：1994-10-27

Applicant: Kaoru Katayama ,  Shinichi Kazui ,  Yasuhiro Iwata ,  Hiroshi Fukuda ,  Toshihiko Ohta

Inventor： Kaoru Katayama ,  Shinichi Kazui ,  Yasuhiro Iwata ,  Hiroshi Fukuda ,  Toshihiko Ohta

IPC: B08B7/00 ,  B23K1/00 ,  B23K1/20 ,  B23K26/00 ,  B23K26/40 ,  C23G5/00 ,  H01L21/306 ,  H01L21/60 ,  H01L23/10 ,  H05K3/34 ,  B08B3/12

CPC classification number: H01L21/02046 ,  B08B7/0042 ,  B23K1/206 ,  B23K26/40 ,  H01L23/10 ,  H01L24/81 ,  H05K3/3489 ,  B23K2201/36 ,  B23K2203/14 ,  B23K2203/26 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166

Abstract: Oxide films, and residues of organic matters, carbons, if any, are removed from a metal surface simply without using complicated steps and without giving adverse effects on electronic parts or electronic devices by irradiating the metal surface with a laser beam of lower energy level than energy capable of changing the metal surface structure, thereby cleaning the metal surface.

Abstract translation: 氧化膜和有机物残留物（如果有的话）从金属表面除去，而不用复杂的步骤，并且通过用较低能级的激光束照射金属表面而不会对电子部件或电子器件产生不利影响 能够改变金属表面结构的能量，从而清洁金属表面。

公开(公告)号：US5492263A

公开(公告)日：1996-02-20

申请号：US250758

申请日：1994-05-26

Applicant: Mark E. Webster ,  John A. Hearn ,  Daniel R. Bellus ,  Steven M. Stansberry ,  Steven A. Middleton ,  Ronald D. Myer ,  Gregory L. Hall

Inventor： Mark E. Webster ,  John A. Hearn ,  Daniel R. Bellus ,  Steven M. Stansberry ,  Steven A. Middleton ,  Ronald D. Myer ,  Gregory L. Hall

IPC: B23K20/00 ,  B23K20/10

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/10 ,  H01L24/48 ,  B23K2201/36 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/2076 ,  Y10T428/1275

Abstract: A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.

Abstract translation: 提供了一种用于将铝线引线连接到电子封装的引线的表面的方法。 该方法需要镍电镀工艺和超声波接合工艺，它们一起协作以在电线和引线部件之间形成可靠和高度可重复的接头。 超声波接合工艺专门针对通过电镀工艺生产的镀镍，以显着提高所得超声波接合接头的结合强度。 电镀工艺被设计成产生比通常实施的更厚的镍电镀，其表面的特征在于具有相对平滑的微精加工，其意外地用于增强超声波接合接头的结合强度。

公开(公告)号：US5452841A

公开(公告)日：1995-09-26

申请号：US277859

申请日：1994-07-20

Applicant: Sinji Sibata ,  Shuji Sakou ,  Akihiko Ogino

Inventor： Sinji Sibata ,  Shuji Sakou ,  Akihiko Ogino

IPC: H01L21/60 ,  B23K26/20 ,  H01L23/48 ,  B23K26/00

CPC classification number: H01L24/85 ,  B23K26/20 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  B23K2201/32 ,  B23K2201/36 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48472 ,  H01L2224/48799 ,  H01L2224/78313 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/351

Abstract: A wire bonding apparatus and method which enable fully automatic wire bonding between a connecting electrode on a circuit board and an external lead terminal while saving space to prevent enlargement of the package size. The wire bonding method has the steps of welding one end of a ribbon shaped flat copper wire to the terminal (external lead terminal); welding the other end of the copper wire to the pad (connecting electrode) which is disposed at a level below the level of the terminal, while turning the intermediate portion of the copper wire on and around the cylindrical portion of the forming member which is disposed at a level above the terminal within the horizontal span between the pad and the terminal; and depressing the bent portion of the copper wire which has been bent by being turned around the cylindrical portion of the forming member down to a level below the level of the terminal so that the copper wire, within the vertical span between the pad and the terminal, is bent to form the first acute bend and then bent back to form the second acute bend and then extended to the pad.

Abstract translation: 一种引线接合装置和方法，其能够在电路板上的连接电极与外部引线端子之间实现全自动引线接合，同时节省空间以防止封装尺寸的扩大。 引线接合方法具有将带状扁平铜线的一端焊接到端子（外部引线端子）的步骤; 将铜线的另一端焊接到布置在端子高度以下的焊盘（连接电极）的同时，使铜线的中间部分在设置的成形构件的圆筒部分周围转动 在焊盘和端子之间的水平跨度内的端子上方; 并且通过围绕成形构件的圆筒部分转动而弯曲的铜线的弯曲部分下降到低于端子水平的水平，使得铜线在衬垫和端子之间的垂直跨度内 弯曲形成第一急弯，然后弯曲回形成第二急弯，然后延伸到垫。

公开(公告)号：US5439164A

公开(公告)日：1995-08-08

申请号：US71400

申请日：1993-06-04

Applicant: Yo Hasegawa ,  Masahiro Nagasawa ,  Masahide Tsukamoto

Inventor： Yo Hasegawa ,  Masahiro Nagasawa ,  Masahide Tsukamoto

IPC: B23K20/16 ,  B23K35/00 ,  B23K35/02 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H05K3/34

CPC classification number: B23K20/16 ,  B23K35/007 ,  H05K3/4069 ,  B23K2201/36 ,  B23K35/025 ,  H05K1/095 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4623

Abstract: The copper or its alloys can be bonded to each other or can be bonded to noble metals or to other metals whose surface is covered with a noble metal thin film in an oxidative atmosphere. The surface of the copper or its alloys to be bonded should be covered with the layer of a noble metal thin film or a metal oxide remover or a conductive paste mainly consisting of a copper or copper alloy particles and the metal oxide remover. This method can be applied to a metallurgical industry and also to an electronics industry. This method is especially suitable for the production of a multilayered printed wiring board.

Abstract translation: 铜或其合金可以彼此键合或者可以结合到贵金属或其它金属，其表面在氧化气氛中被贵金属薄膜覆盖。 铜或其待结合的合金的表面应该被主要由铜或铜合金颗粒和金属氧化物去除剂组成的贵金属薄膜或金属氧化物去除剂或导电浆料层覆盖。 该方法可应用于冶金工业以及电子工业。 该方法特别适用于生产多层印刷线路板。

公开(公告)号：US5395037A

公开(公告)日：1995-03-07

申请号：US169625

申请日：1993-12-20

Applicant: Hiroyuki Takahashi ,  Shinichi Fujino ,  Kazuhiro Sakamoto ,  Tomoyasu Hirano

Inventor： Hiroyuki Takahashi ,  Shinichi Fujino ,  Kazuhiro Sakamoto ,  Tomoyasu Hirano

IPC: B23K1/00 ,  H01L23/49 ,  H01R43/02 ,  H05K13/06 ,  H01L21/60 ,  B23K35/38

CPC classification number: B23K1/0008 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01R43/02 ,  H05K13/06 ,  B23K2201/32 ,  B23K2201/36 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85075 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L24/45 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041

Abstract: A method for bonding a solder wire is provided wherein a lower ball end of a material solder wire is first bonded to a first bonding portion of a workpiece. Then, the material solder wire is thermally cut to provide a solder wire segment held bonded to the first bonding portion and having an upper ball end. Finally, the upper ball end is bonded to a second bonding portion of the workpiece. All of the wire bonding process steps are performed in an oxygen-free atmosphere to prevent oxidation of the solder wire.

Abstract translation: 提供一种用于焊接焊接的方法，其中首先将材料焊丝的下球端接合到工件的第一接合部分。 然后，材料焊丝被热切割以提供保持接合到第一接合部分并具有上球端的焊丝段。 最后，将上球端接合到工件的第二接合部分。 所有的引线接合工艺步骤在无氧气氛中进行以防止焊丝的氧化。