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公开(公告)号：US09891769B2
公开(公告)日：2018-02-13
申请号：US14814730
申请日：2015-07-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Jung Hyuck Han , Yu Lim Choe , Chan Kyu Koo , Jun Sik Shin , Joon Hyuk Yang , Seung Jin Lee , Yu Hong Jeon
CPC classification number: G06F3/044 , G06F2203/04112 , H05K1/0296 , H05K3/28 , H05K2201/09245 , H05K2201/09272
Abstract: A touch window includes a substrate; and an electrode on the substrate, wherein the electrode includes a first mesh line extending in a first direction and having a first width; a second mesh line extending in a direction different from the first direction and having a second width; and an cross area in which the first and second mesh lines cross each other, the cross area having a third width, wherein the third width is larger than the first width, and the third width is equal to or less than 10 times of the first width.
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公开(公告)号：US20180026676A1
公开(公告)日：2018-01-25
申请号：US15659275
申请日：2017-07-25
Applicant: Optical Cable Corporation
Inventor： Derrick F. Stikeleather , John Michael Ray , Ian J. Timmins
IPC: H04B3/32 , H01R13/6467 , H01R24/64 , H05K1/02
CPC classification number: H04B3/32 , H01R13/6466 , H01R13/6467 , H01R24/64 , H05K1/0228 , H05K2201/09236 , H05K2201/09245 , H05K2201/10189
Abstract: A system that reduces crosstalk and return loss within electrical communication connectors includes at least two compensating capacitors connected in series that compensate each offending capacitor. An additional inductive component that is connected between two compensating capacitors so that the adjustable inductance of the inductive component can be varied to modify the capacitive coupling effect achieved by the compensating capacitors as a function of frequency. A shape-neutral structure containing two compensating capacitors and one series inductive component in between is positioned so that each compensating capacitor is juxtaposed parallel to the offending capacitor. There is no direct contact between the shape-neutral structure and the transmission lines, and the shape-neutral structure does not change the shape of PCB traces and reduces both crosstalk and return loss.
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公开(公告)号：US20170324198A1
公开(公告)日：2017-11-09
申请号：US15656443
申请日：2017-07-21
Applicant: Panduit Corp.
Inventor： Jack E. Caveney , Masud Bolouri-Saransar , Scott M. Lesniak
IPC: H01R24/64 , H01R13/6466 , H01R13/6467 , H05K1/02 , H01R4/24 , H01R13/502 , H01R12/59 , H01R12/67 , H01R12/77 , H01R13/46 , H01R13/719 , H01R13/6461 , H01R12/62 , H01R13/66 , H01R107/00 , H05K1/18
CPC classification number: H01R24/64 , H01R4/2429 , H01R4/2433 , H01R12/592 , H01R12/62 , H01R12/675 , H01R12/775 , H01R13/46 , H01R13/502 , H01R13/6461 , H01R13/6466 , H01R13/6467 , H01R13/6658 , H01R13/719 , H01R24/62 , H01R2107/00 , H01R2201/04 , H05K1/0228 , H05K1/028 , H05K1/189 , H05K2201/09245 , H05K2201/10189 , Y10S439/941 , Y10T29/49121 , Y10T29/49128 , Y10T29/49147 , Y10T29/49174 , Y10T29/49222
Abstract: An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.
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公开(公告)号：US20170303391A1
公开(公告)日：2017-10-19
申请号：US15518135
申请日：2015-10-22
Applicant: CANON KABUSHIKI KAISHA
Inventor： Jin MIYASAKA
CPC classification number: H05K1/0245 , H05K1/0228 , H05K1/0243 , H05K1/18 , H05K2201/09245 , H05K2201/10159
Abstract: Provided is a printed circuit board including a first semiconductor device and a second semiconductor device mounted on a printed wiring board, the printed wiring board including a first and a second differential signal wirings each formed of a pair of signal transmission lines. The pair of signal transmission lines forming the first differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the first differential signal wiring in a wiring direction thereof. The pair of signal transmission lines forming the second differential signal wiring are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other at least once in the second differential signal wiring in a wiring direction thereof.
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公开(公告)号：US09673502B2
公开(公告)日：2017-06-06
申请号：US15285615
申请日：2016-10-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi Sasaki , Nobuo Ikemoto , Shigeru Tago
CPC classification number: H01P3/003 , H01P3/08 , H01P3/085 , H05K1/0225 , H05K1/0253 , H05K1/0284 , H05K1/0393 , H05K1/147 , H05K2201/09245 , H05K2201/09281 , H05K2201/09727
Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
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Patent Agency Ranking
公开(公告)号：US20170025730A1
公开(公告)日：2017-01-26
申请号：US15285615
申请日：2016-10-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi SASAKI , Nobuo IKEMOTO , Shigeru TAGO
IPC: H01P3/00
CPC classification number: H01P3/003 , H01P3/08 , H01P3/085 , H05K1/0225 , H05K1/0253 , H05K1/0284 , H05K1/0393 , H05K1/147 , H05K2201/09245 , H05K2201/09281 , H05K2201/09727
Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
Abstract translation: 电介质元件组件包括在层叠方向上彼此堆叠并沿x轴方向延伸的多个电介质层。 信号线设置在电介质元件组件中并沿x轴方向延伸。 参考接地导体相对于信号线在z轴方向的正侧设置。 辅助接地导体相对于信号线设置在z轴方向的负侧。 通孔导体连接参考接地导体和辅助接地导体，并且在y轴方向相对于中心的负侧设置介质元件组件。 包括通孔导体的部分中的信号线的一部分在不包括通孔导体的部分中位于相对于信号线的另一部分的y轴方向的正侧。
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137.发明授权公开(公告)号：US09484334B2
公开(公告)日：2016-11-01
申请号：US13716799
申请日：2012-12-17
Applicant: STATS ChipPAC, Ltd.
Inventor： Robert C. Frye , Kai Liu
CPC classification number: H01L27/01 , H01L21/70 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2924/13091 , H01L2924/15174 , H01L2924/15311 , H01P5/10 , H03H7/48 , H05K1/0233 , H05K1/0239 , H05K1/0243 , H05K1/025 , H05K1/165 , H05K2201/09245 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor device has a substrate and RF coupler formed over the substrate. The RF coupler has a first conductive trace with a first end coupled to a first terminal of the semiconductor device, and a second conductive trace with a first end coupled to a second terminal of the semiconductor device. The first conductive trace is placed in proximity to a first portion of the second conductive trace. An integrated passive device is formed over the substrate. A second portion of the second conductive trace operates as a circuit component of the integrated passive device. The integrated passive device can be a balun or low-pass filter. The RF coupler also has a first capacitor coupled to the first terminal of the semiconductor device, and second capacitor coupled to a third terminal of the semiconductor device for higher directivity. The second conductive trace is wound to exhibit an inductive property.
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公开(公告)号：US20160212859A1
公开(公告)日：2016-07-21
申请号：US14601285
申请日：2015-01-21
Applicant: Gil Bellaiche , Aurel Faibis
Inventor： Gil Bellaiche , Aurel Faibis
IPC: H05K3/10
CPC classification number: H05K1/097 , B33Y80/00 , H05K3/0091 , H05K3/125 , H05K2201/0145 , H05K2201/026 , H05K2201/0323 , H05K2201/0326 , H05K2201/09245 , H05K2203/0759
Abstract: A method of making a printed circuit board includes providing a substrate; providing a circuit design; determining non-conducting intersections between each of a plurality of conductive traces; forming a first set of conductive traces on the substrate; applying insulation material on the first set of traces at each of the non-conducting intersections; and forming a second set of conductive traces over the first set of traces and insulating material.
Abstract translation: 制造印刷电路板的方法包括提供基板; 提供电路设计; 确定多个导电迹线中的每一个之间的非导通交点; 在所述衬底上形成第一组导电迹线; 在每个非导电交叉点处在第一组轨迹上施加绝缘材料; 以及在第一组迹线和绝缘材料上形成第二组导电迹线。
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139.发明授权公开(公告)号：US09318787B2
公开(公告)日：2016-04-19
申请号：US14461074
申请日：2014-08-15
Applicant: Chung Yuan Christian University
Inventor： Guang-Hwa Shiue
CPC classification number: H01P3/088 , H01P3/026 , H01P3/08 , H01P5/028 , H05K1/0228 , H05K1/0245 , H05K2201/09245 , H05K2201/09727
Abstract: A transmission line structure emplaces at a substrate which includes a first layout layer, a first dielectric layer, a second dielectric layer, a second dielectric layer, and a grounding layer includes a first transmission line pair and at least one second transmission line. The first transmission line pair is set on the first layout layer. The second transmission line is set on the second layout layer. A line of first transmission line pair and a line of the second transmission line cross each other and form a crossing area. A width of the line is narrow. A distance between the first transmission line pair and the second transmission line at the crossing area is less than a distance at an outstanding area.
Abstract translation: 传输线结构放置在包括第一布局层，第一介电层，第二介电层，第二介电层的基板处，并且接地层包括第一传输线对和至少一个第二传输线。 第一传输线对设置在第一布局层上。 第二传输线设置在第二布局层上。 一条第一传输线对和第二条传输线的一条线彼此交叉并形成一个交叉区域。 线的宽度窄。 交叉区域的第一传输线对和第二传输线之间的距离小于突出区域的距离。
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公开(公告)号：US20160081192A1
公开(公告)日：2016-03-17
申请号：US14947558
申请日：2015-11-20
Applicant: MC10, Inc.
Inventor： Yung-Yu Hsu
CPC classification number: H05K1/185 , H05K1/0271 , H05K1/028 , H05K1/0283 , H05K1/036 , H05K1/0393 , H05K1/09 , H05K1/118 , H05K1/147 , H05K1/148 , H05K1/189 , H05K3/4691 , H05K3/4694 , H05K2201/0133 , H05K2201/0154 , H05K2201/0187 , H05K2201/09245 , H05K2201/1028 , H05K2201/10287 , H05K2201/2009
Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.
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