Methods for uniform doping of non-planar transistor structures
    143.
    发明授权
    Methods for uniform doping of non-planar transistor structures 有权
    均匀掺杂非平面晶体管结构的方法

    公开(公告)号:US07494862B2

    公开(公告)日:2009-02-24

    申请号:US11529963

    申请日:2006-09-29

    IPC分类号: H01L21/8238

    摘要: Methods for uniformly tip doping a silicon body of a non-planar transistor and devices and systems formed by such methods. In one embodiment, a method can include vertical tip ion implantation of a silicon body with at least three surfaces on a substrate followed by conformal deposition of a dielectric material. The dielectric material can be selectively etched to expose a top surface of the silicon body followed by selective re-oxidation of the top surface for form a mask. The remaining dielectric material can be removed followed by angled ion implantation of at least two sidewalls of the silicon body. The mask can be removed resulting in a silicon body with uniform doping.

    摘要翻译: 用于均匀尖端掺杂非平面晶体管的硅体的方法以及通过这种方法形成的器件和系统。 在一个实施例中,一种方法可以包括在衬底上具有至少三个表面的硅体的垂直尖端离子注入,随后是电介质材料的共形沉积。 可以选择性地蚀刻介电材料以暴露硅体的顶表面,随后选择性地再次氧化顶表面以形成掩模。 可以除去剩余的电介质材料,然后对硅体的至少两个侧壁进行成角度的离子注入。 可以去除掩模,从而产生均匀掺杂的硅体。