公开(公告)号：US20020011918A1

公开(公告)日：2002-01-31

申请号：US09960787

申请日：2001-09-21

Inventor： Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

IPC: H01C007/10

CPC classification number: H01C1/01 ,  H01C1/014 ,  H01C1/1406 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/062 ,  H05K2201/10378 ,  H05K2201/10643 ,  H05K2201/10659 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

Abstract translation: 在过电流保护电路中使用的具有正电阻 - 温度特性的热敏电阻具有相互相对的主表面上的电极，并且被安装到具有导电构件的基板上，使得可以控制由于发热引起的耐电压劣化。 与连接到热敏电阻电极之一的焊料之间插入具有比衬底更小的导热性并且被具有小横截面面积的导体片穿透的间隔物。 另一个电极通过细长的连接构件通过其横向于其纵向方向的截面来接触，使得导电的横截面面积减小。

公开(公告)号：US20020003694A1

公开(公告)日：2002-01-10

申请号：US09944232

申请日：2001-08-30

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K007/20

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract translation: 一种高密度垂直表面贴装封装及其热载体，包括散热片

公开(公告)号：US06334789B1

公开(公告)日：2002-01-01

申请号：US09392615

申请日：1999-09-09

Applicant: Ryozo Koyama

Inventor： Ryozo Koyama

IPC: H01R1360

CPC classification number: H05K3/341 ,  H01R12/707 ,  H01R12/716 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10659 ,  H05K2203/306 ,  Y02P70/613

Abstract: The surface-mount connector includes a fixing metal member (40) for attaching a connector body to a board. The fixing metal member has a securing section (41) to be attached to the connector body and an attaching section (42) to be attached to the board. The connector body is provided with an engaging section (31A) with which the securing section is engaged such that the fixing metal member rotates about the engaging section when the connector body moves relative to the board.

Abstract translation: 表面安装连接器包括用于将连接器主体附接到板的固定金属构件（40）。 固定金属构件具有安装到连接器主体的固定部分（41）和附接到板的附接部分（42）。 连接器主体设置有接合部分（31A），固定部分与所述接合部分接合，使得当所述连接器主体相对于所述板移动时，所述固定金属部件围绕所述接合部分旋转。

公开(公告)号：US06254429B1

公开(公告)日：2001-07-03

申请号：US09328259

申请日：1999-06-10

Applicant: Shigehiro Morita

Inventor： Shigehiro Morita

IPC: H01R1360

CPC classification number: H05K3/341 ,  H01R12/716 ,  H05K3/3426 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10659 ,  H05K2203/306 ,  Y02P70/613

Abstract: The connector comprises a housing (7) having a soldering portion (6, 15A or 15B) and a reinforcing metal member (5) movably attached to the housing such that it is vertically movable when it is soldered to a board (12). The reinforcing metal member is provided with a groove (14) to form with the solderable portion a gap between them, which permits soldering by capillary effects.

Abstract translation: 连接器包括具有焊接部分（6,15A或15B）和可移动地附接到壳体的加强金属构件（5）的壳体（7），使得当其被焊接到基板（12）时可以垂直移动。 加强金属构件设置有凹槽（14），以与可焊接部分形成它们之间的间隙，这允许通过毛细管效应进行焊接。

公开(公告)号：US6152765A

公开(公告)日：2000-11-28

申请号：US305142

申请日：1999-05-04

Applicant: Chiu-Yu Tang ,  Jerry Wu

Inventor： Chiu-Yu Tang ,  Jerry Wu

IPC: H01R12/55 ,  H01R13/73 ,  H05K3/34

CPC classification number: H01R12/7029 ,  H01R12/707 ,  H05K3/341 ,  H01R12/57 ,  H01R12/716 ,  H01R12/725 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10659 ,  H05K3/3447 ,  Y02P70/613

Abstract: An electrical connector (1/1A) for either through hole mounting or surface mounting comprises a common dielectric housing (10), a plurality of terminals (12) retained therein, and a pair of securing devices (20 or 120) mutually exclusively fixed in the housing. The securing devices are either a pair of board locks (21) or a pair of soldering pads (121). A mounting face (10b) of the housing forms two pairs of standoffs (15) at its opposite ends, and each pair of standoffs defines an opening (15a) therebetween. A retaining recess (14) is defined in the housing within each opening. The boardlocks (21) or soldering pads (121) each form a base portion (21a or 122) which engages with a retaining recess. A fork portion (21b) of each board lock engages with a retaining hole in a circuit board for through hole mounting, and a soldering portion (123) of each soldering pad engages with a mounting pad of a circuit board for surface mounting.

Abstract translation: 用于通孔安装或表面安装的电连接器（1 / 1A）包括公共绝缘壳体（10），多个端子（12）保持在其中，以及一对固定装置（20或120） 住房。 固定装置是一对板锁（21）或一对焊垫（121）。 壳体的安装面（10b）在其相对端处形成两对支座（15），并且每对支座在其间限定开口（15a）。 在每个开口内的壳体中限定一个保持凹槽（14）。 板锁（21）或焊盘（121）各自形成与保持凹部接合的基部（21a或122）。 每个板锁的叉部（21b）与用于通孔安装的电路板中的保持孔接合，并且每个焊垫的焊接部分（123）与用于表面安装的电路板的安装焊盘接合。

公开(公告)号：US5933710A

公开(公告)日：1999-08-03

申请号：US910608

申请日：1997-08-13

Applicant: Chok J. Chia ,  Patrick Variot

Inventor： Chok J. Chia ,  Patrick Variot

IPC: H01L23/12 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K3/34 ,  H01L21/44 ,  B23K31/02 ,  H01L23/48

CPC classification number: H01L23/24 ,  H01L23/3128 ,  H01L23/49531 ,  H01L23/49811 ,  H01L23/49816 ,  H05K3/341 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K2201/10659 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y02P70/613

Abstract: A surface mounted integrated circuit die package includes a group of peripheral leads extending laterally outwardly from the perimeter of the package and also includes an array of solder balls on the bottom of the package. The arrangement provides for a greater number of input/output connections to a die package by utilizing both peripheral leads and a ball grid array without requiring increases in package size or a reduction in the width of electrically conductive interconnections.

Abstract translation: 表面安装的集成电路管芯封装包括从封装的周边横向向外延伸的一组外围引线，并且还包括在封装的底部上的焊球阵列。 该布置通过利用外围引线和球栅阵列来提供更大数量的对封装的输入/输出连接，而不需要增加封装尺寸或减小导电互连的宽度。

公开(公告)号：US5915994A

公开(公告)日：1999-06-29

申请号：US999262

申请日：1997-12-29

Applicant: Yoshitaka Sumida

Inventor： Yoshitaka Sumida

IPC: G11B7/26 ,  H01R43/02 ,  H05K1/18 ,  H05K3/34 ,  H01R13/66

CPC classification number: H05K3/3426 ,  H01R12/58 ,  H05K1/18 ,  H01R43/0256 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10659 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A wiring structure comprises a connector and an electromagnetic relay mounted on a printed circuit board. Connector terminals extend respectively to lead terminals of the electromagnetic relay. Through holes formed respectively through distal end portions of the connector terminals and, are aligned respectively with through holes in the printed circuit board in an overlying manner, and each of the lead terminals of the electromagnetic relay is passed through the associated mating pair of aligned through holes, and is fixed thereto by soldering.

Abstract translation: 布线结构包括安装在印刷电路板上的连接器和电磁继电器。 连接器端子分别延伸到电磁继电器的引线端子。 分别通过连接器端子的远端部分形成的通孔，并且分别与印刷电路板中的通孔对齐，电磁继电器的每个引线端子通过相关联的配对对 孔，并通过焊接固定。

公开(公告)号：US5703752A

公开(公告)日：1997-12-30

申请号：US518505

申请日：1995-08-23

Applicant: Suk Ha Woo

Inventor： Suk Ha Woo

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K7/20

CPC classification number: H05K3/4084 ,  H05K1/0204 ,  H01L2924/0002 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/4092 ,  H05K3/44

Abstract: A heat dissipating apparatus for a semiconductor device for use in a motor drive that improves heat dissipation efficiency by transferring heat from the semiconductor device directly to a heat sink, using ground leads or nonconnection leads of element lead pins. In addition, it is possible to connect the semiconductor device to the heat sink without extra fixing members

Abstract translation: 一种用于电机驱动器中的半导体器件的散热装置，其通过使用元件引线引脚的接地引线或非连接引线将热量从半导体器件直接传递到散热器来提高散热效率。 此外，可以在没有额外的固定构件的情况下将半导体器件连接到散热器

公开(公告)号：US5671125A

公开(公告)日：1997-09-23

申请号：US517308

申请日：1995-08-21

Applicant: Ernest Russell ,  Daniel Baudouin ,  James S. Wallace

Inventor： Ernest Russell ,  Daniel Baudouin ,  James S. Wallace

IPC: H01L23/32 ,  H01L23/495 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H05K1/16

CPC classification number: H05K1/181 ,  H01L23/32 ,  H01L23/49555 ,  H01L25/105 ,  H05K3/303 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

Abstract: Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperature a printed circuit board. The flat packages include leads (120, 121) which extend from an edge of the flat package. A semiconductor chip is encapsulated by the flat packages.

Abstract translation: 布置两个扁平封装（110,111）以通过使用位于印刷电路板的安装温度内的引导件（100）来实现镜像覆盖。 扁平封装包括从扁平封装的边缘延伸的引线（120,121）。 半导体芯片由扁平封装封装。

公开(公告)号：US5543659A

公开(公告)日：1996-08-06

申请号：US327479

申请日：1994-10-21

Applicant: Toru Hosen

Inventor： Toru Hosen

IPC: H01L25/07 ,  H01L25/18 ,  H02M7/00 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52

CPC classification number: H05K3/306 ,  H01L25/18 ,  H02M7/003 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K2201/10166 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2203/167 ,  H05K3/308 ,  H05K3/3447

Abstract: A power semiconductor device package of the invention is used for a power conversion equipment. The package is formed of a casing containing a power chip therein, external main circuit terminals for direct-current input and alternating-current output, and pin terminals for connection to an external control circuit. The main circuit terminals and pin terminals are arranged in two rows on the upper surface of the casing. In the invention, at least one of the connecting terminals for a snubber circuit and the support terminals is situated on the upper surface of the casing. The connecting terminals are connected inside the casing to the main circuit terminals for the direct-current input to have the same electric potential. The supporting terminals are arranged adjacent to the pin terminals so that a printed circuit board for the external control circuit can be securely fixed to the casing.

Abstract translation: 本发明的功率半导体器件封装用于电力转换设备。 封装由其中包含功率芯片的壳体形成，用于直流输入和交流输出的外部主电路端子以及用于连接到外部控制电路的引脚端子。 主电路端子和引脚端子在壳体的上表面上排列成两列。 在本发明中，用于缓冲电路的连接端子和支撑端子中的至少一个位于壳体的上表面上。 连接端子在壳体内部连接到用于直流输入的主电路端子以具有相同的电位。 支撑端子布置成与销端子相邻，使得用于外部控制电路的印刷电路板可以牢固地固定到壳体。