公开(公告)号：US20160148911A1

公开(公告)日：2016-05-26

申请号：US14903858

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L25/075 ,  H01L33/38 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

Abstract translation: 提供了一种纳米级LED组件及其制造方法。 首先，独立制造的纳米级LED器件可以对准并连接到彼此不同的两个电极，以解决将具有纳米单元的纳米级LED器件耦合到彼此不同的两个电极的限制 站立状态。 此外，由于LED器件和电极设置在同一平面上，所以可以提高LED器件的光提取效率。 此外，可以调整纳米级LED器件的数量。 第二，由于纳米尺度的LED器件不能立即连接到上电极和下电极，而是要被连接到在同一平面上彼此不同的两个电极，所以光提取效率可以非常改善 。 此外，由于在LED器件的表面上形成单独的层以防止LED器件和电极电短路，所以可以使LED电极组件的缺陷最小化。 此外，为了准备LED装置的非常罕见的缺陷的发生，可以将多个LED器件连接到电极以保持纳米级LED电极组件的原始功能。

公开(公告)号：US20150369458A1

公开(公告)日：2015-12-24

申请号：US14308649

申请日：2014-06-18

Applicant: Yasoob Ahmed ,  Steven Sievers

Inventor： Yasoob Ahmed ,  Steven Sievers

IPC: F21V19/00 ,  F21V23/06 ,  F21V23/00

CPC classification number: F21V19/002 ,  F21V23/005 ,  F21V23/06 ,  F21W2111/00 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/181 ,  H05K3/301 ,  H05K3/308 ,  H05K3/3421 ,  H05K2201/0311 ,  H05K2201/10106 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: A holder structure for mounting light indicators on printed circuit boards using surface mount technology at a position elevated above the surface of the board is provided with a body member including a top wall, a bottom wall, opposed sidewalls, a front wall, and a rear wall, all being formed integrally together. Two spaced-apart recesses are formed and aligned vertically in the front wall of the body member terminating in respective first and second interior wall portions. The first interior wall portion has openings formed on diametrically opposed sides of a vertical partition and lying in a horizontal plane parallel to the bottom wall. The second interior wall portion has openings formed on diametrically opposed sides of a transverse partition and lying in a plane which is rotated a predetermined number of degrees from a vertical plane perpendicular to the bottom wall.

Abstract translation: 一种用于在印刷电路板上使用表面贴装技术将光指示器安装在高于板表面的位置的支架结构设置有主体部件，主体部件包括顶壁，底壁，相对的侧壁，前壁和后部 墙壁，整体形成在一起。 形成两个间隔开的凹部并且在主体构件的前壁中垂直排列，终止于相应的第一和第二内壁部分。 第一内壁部分具有形成在垂直隔板的直径相对的侧面上并且位于平行于底壁的水平面中的开口。 第二内壁部分具有形成在横向隔板的直径相对侧上的开口，并且位于从垂直于底壁的垂直平面旋转预定数量的平面中。

公开(公告)号：US20140254094A1

公开(公告)日：2014-09-11

申请号：US14191728

申请日：2014-02-27

Applicant: U. D. ELECTRONIC CORP. ,  DONGGUAN JIAN GUAN PLASTIC ELECTRONIC CO., LTD. ,  U. D. (ZHONG JIANG) ELECTRONIC CORP.

Inventor： Chih-Kai Chang ,  Tao Guo

IPC: H05K13/04 ,  H05K7/14

CPC classification number: H05K3/3421 ,  H01F17/062 ,  H01F27/2828 ,  H01F27/292 ,  H05K1/0233 ,  H05K2201/09181 ,  H05K2201/1003 ,  H05K2201/10651 ,  H05K2203/044 ,  H05K2203/107 ,  Y02P70/613

Abstract: The present invention relates to an assembly structure with filter device and printed circuit board and a welding method for making the same. The welding method is firstly make the metal lines of at least one filter devices be disposed in the metal notches formed on at least one edges of the printed circuit board, and then respectively remove the insulation layers covering the metal lines; therefore, the welding metal lines can be respectively welded with the metal notches after the metal lines and the metal notches are treated with a dip soldering process. Thus, the welding process of the filter device and the printed circuit board can be carried out on the edges of the printed circuit board by simple process procedures; moreover, the fabrication yield of the assembly structure can be effectively increased, and the manufacturing time and cost of the assembly structure can be simultaneously reduced.

Abstract translation: 本发明涉及一种具有过滤装置和印刷电路板的组装结构及其制造方法。 焊接方法首先使至少一个过滤器装置的金属线路布置在形成在印刷电路板的至少一个边缘上的金属凹口中，然后分别去除覆盖金属线的绝缘层; 因此，在金属线和金属切口用浸焊工艺处理之后，焊接金属线可以分别与金属切口焊接。 因此，可以通过简单的工艺程序在印刷电路板的边缘上进行过滤装置和印刷电路板的焊接工艺; 此外，可以有效地提高组装结构的制造成品率，同时可以减少组装结构的制造时间和成本。

公开(公告)号：US20140146549A1

公开(公告)日：2014-05-29

申请号：US14171552

申请日：2014-02-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Kyong Jun KIM

IPC: F21V23/00

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provided are a light emitting apparatus and a light unit having the same. The light emitting apparatus includes a light emitting device includes a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.

Abstract translation: 提供一种发光装置和具有该发光装置的光单元。 发光装置包括发光装置，其包括发光元件和多个外部引线，以及在发光器件下方的多个电极焊盘。

公开(公告)号：US08633408B2

公开(公告)日：2014-01-21

申请号：US12920305

申请日：2009-02-18

Applicant: Charles Lee ,  Feng Sheng ,  Jenny Zhou

Inventor： Charles Lee ,  Feng Sheng ,  Jenny Zhou

IPC: H01L23/48 ,  H01L33/00 ,  H01R9/00 ,  H05K7/02

CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L33/486 ,  H01L2924/0002 ,  H05K1/182 ,  H05K1/183 ,  H05K3/325 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10651 ,  H01L2924/00

Abstract: A miniature housing, in whose housing body there is located an element emitting or receiving electromagnetic radiation, comprises at least two electrical terminal means projecting laterally beyond the housing body. The passage side of the miniature housing, through which the element emits or receives, is oriented substantially perpendicularly to the mounting plane of the miniature housing. The electrical terminal means of the miniature housing projecting laterally beyond the housing body are connected electrically conductively to conductors, which bring about direct contacting with the emitting or receiving element. The contacting faces of the terminal means are thus arranged substantially perpendicular to the passage side of the miniature housing. As a result of this arrangement the miniature housing may be embedded at least in part in a support, such that the miniature housing is no longer of any significance to the thickness of a lighting device.

Abstract translation: 在其壳体中位于发射或接收电磁辐射的元件的微型外壳包括至少两个横向伸出外壳主体的电气端子装置。 元件发射或接收的微型外壳的通道侧基本上垂直于微型外壳的安装平面定向。 突出于壳体外侧突出的微型壳体的电气端子装置导电地连接导体，导体与发射或接收元件直接接触。 因此，端子装置的接触面大致垂直于微型壳体的通道侧。 作为这种布置的结果，微型壳体可以至少部分地嵌入在支撑件中，使得微型外壳对照明装置的厚度不再具有任何意义。

公开(公告)号：US08627563B2

公开(公告)日：2014-01-14

申请号：US12526032

申请日：2008-02-06

Applicant: Kenneth E. Wing ,  Scott T. Carroll

Inventor： Kenneth E. Wing ,  Scott T. Carroll

IPC: H05K3/30

CPC classification number: H01R13/5219 ,  B29C45/14639 ,  H01R13/53 ,  H01R24/76 ,  H01R2101/00 ,  H05K1/0254 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10651 ,  H05K2203/1316

Abstract: A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.

Abstract translation: 涉及一种低压注塑成型方法，该方法包括高压电路，同时在注射成型材料中结合独特的凹陷式高压连接器接触装置，大大降低了部件尺寸，同时增加了这种类型的电路的能力。 该方法减少了制造时间并保持了清洁的密封接触点，以通过导电橡胶块的方式重复使用。 额外的优点是通过电路板产生空腔; 轴向引线的高压部件可以方便地安装，而无需额外的组装部件，同时完全封装。

公开(公告)号：US08618423B2

公开(公告)日：2013-12-31

申请号：US12056854

申请日：2008-03-27

Applicant: Hirotoshi Ozaki ,  Akiko Morimoto ,  Tetsuya Yamashita

Inventor： Hirotoshi Ozaki ,  Akiko Morimoto ,  Tetsuya Yamashita

IPC: H05K1/00

CPC classification number: H01R12/7082 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/09836 ,  H05K2201/10037 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/082

Abstract: A lead-attached electrical element and a mounting board to which the lead-attached electrical element is mounted both contribute to a reduction in the size of the mounting board as well as facilitate rework. The lead-attached electrical element is constituted from an electrical element and two leads. Each lead includes a main portion which is bonded to a respective electrode face of the electrical element, and a bent portion which is inclined with respect to the main portion. The mounting board is constituted from a PC (printed circuit) board and the lead-attached electrical element. Two conductive lands are provided on a surface of the PC board. The lead-attached electrical element has been inserted into an aperture in the PC board, and bent portions of the leads attached to the electrical element are bonded to the conductive lands so that the electrical element is suspended in the aperture by the leads.

Abstract translation: 安装有引线的电气元件的引线附接电气元件和安装板都有助于减小安装板的尺寸并且便于返工。 引线连接的电气元件由电气元件和两个引线构成。 每个引线包括结合到电气元件的相应电极面的主要部分和相对于主要部分倾斜的弯曲部分。 安装板由PC（印刷电路板）和带引线的电气元件构成。 在PC板的表面上设置两个导电焊盘。 引线连接的电气元件已经插入到PC板的孔中，并且附接到电气元件的引线的弯曲部分被接合到导电焊盘，使得电气元件通过引线悬挂在孔中。

公开(公告)号：US20130140079A1

公开(公告)日：2013-06-06

申请号：US13817964

申请日：2011-08-23

Applicant: Tatsuya Nakamura

Inventor： Tatsuya Nakamura

IPC: H01G2/10

CPC classification number: H01G2/10 ,  H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651

Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.

Abstract translation: 一种电容器保持器，包括形成为能够安装电容器的尖端的形状的主体部分; 以及引导部，其固定到主体部并且可以被焊接到预定的配合位置。 主体部分具有露出电容器的前端的开口，以及当电容器的前端装配到电容器的前端时与端子表面抵接部分邻接电容器的顶端表面 身体部位。 引线部分相对于参考平面固定在与电容器相对的位置处的主体部分，该基准面是包括抵靠端表面抵接部分的电容器的末端表面的平面。

公开(公告)号：US08277107B2

公开(公告)日：2012-10-02

申请号：US13240871

申请日：2011-09-22

Applicant: Kyong Jun Kim

Inventor： Kyong Jun Kim

IPC: F21V7/04

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provides are a light emitting apparatus and a light unit having the same. The light emitting apparatus comprises a light emitting device comprising a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.

Abstract translation: 提供一种发光装置和具有该发光装置的光单元。 发光装置包括发光装置，其包括发光元件和多个外部引线，以及在发光器件下方的多个电极焊盘。

公开(公告)号：US08159827B2

公开(公告)日：2012-04-17

申请号：US12744295

申请日：2008-12-22

Applicant: Hitoshi Kidokoro

Inventor： Hitoshi Kidokoro

IPC: H05K9/00

CPC classification number: H05K1/18 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10651 ,  Y10T29/4913

Abstract: When U-shape formed electronic components having an axial lead shape are mounted upright on a printed board, two U-shape formed electronic components having an axial lead shape are arranged so as not to be in the same straight line, and a wiring pattern is formed in a state where bent-side lead wires have the same electric potential, and the electronic components are inclined so as to place the bent-side lead wires close to each other, whereby the electronic components that tend to fall in the inclined direction can be mutually supported by the bent-side lead wires. Thus, the electronic components can be prevented from falling without spoiling a heat dissipation performance of the electronic component and the board, and without greatly deteriorating an assembly performance of the board.

Abstract translation: 当具有轴向引线形状的U形形成的电子部件竖直地安装在印刷电路板上时，具有轴向引线形状的两个U形成形的电子部件被布置成不成为相同的直线，并且布线图案 形成在弯曲侧引线具有相同电位的状态下，并且电子部件倾斜以使弯曲侧引线彼此靠近，从而倾斜倾斜方向的电子部件可以 由弯曲侧引线相互支撑。 因此，可以防止电子部件落下而不会破坏电子部件和电路板的散热性能，并且不会极大地降低电路板的组装性能。