公开(公告)号：US08048690B2

公开(公告)日：2011-11-01

申请号：US12513316

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  C08K3/017 ,  C08K7/06 ,  C09J7/21 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/263 ,  G01L1/20 ,  G01R31/026 ,  G01R31/2886 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/3511 ,  Y10T428/24331 ,  Y10T428/28 ,  Y10T428/2848

摘要： A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

摘要翻译： 根据本发明的压敏粘合片是在基膜上设置压敏粘合剂层的压敏粘合片，其中基膜含有导电纤维，其中导电路径为 形成在压敏粘合剂层和基膜之间。 利用这种结构，即使在通过切割半导体晶片形成的半导体晶片或半导体芯片被施加的状态下，也可以进行电连续性测试，并且半导体晶片的变形（翘曲）和损坏以及缺陷和划痕的产生 在测试中可以防止背面。

公开(公告)号：US07943235B2

公开(公告)日：2011-05-17

申请号：US11969023

申请日：2008-01-03

申请人： Akiyoshi Yamamoto ,  Toshio Shintani ,  Fumiteru Asai ,  Kouichi Hashimoto

发明人： Akiyoshi Yamamoto ,  Toshio Shintani ,  Fumiteru Asai ,  Kouichi Hashimoto

IPC分类号： B32B7/12 ,  B32B15/04 ,  C08L33/06 ,  C09B67/00

CPC分类号： H01L21/6836 ,  C08G18/672 ,  C08L61/00 ,  C08L2666/16 ,  C09D175/16 ,  C09J7/385 ,  C09J133/02 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/31 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2852 ,  Y10T428/2883 ,  Y10T428/2891

摘要： An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.

摘要翻译： 用于处理半导体衬底的粘合片包括紫外线和/或辐射透射性底膜和通过紫外线和/或辐射进行聚合固化反应的粘合剂层，其中粘合剂层使用多官能丙烯酸酯 低聚物和/或具有双键的单体，并且根据多官能丙烯酸酯低聚物和/或单体的重均分子量测定，共混以达到每平均分子量为225至8000的1双键 。

公开(公告)号：US20100313667A1

公开(公告)日：2010-12-16

申请号：US12513230

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： G01L9/00 ,  H01L21/66

CPC分类号： G01R1/0735 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/205 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/516 ,  B32B2307/518 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  G01R31/2853 ,  H01L21/67132 ,  H01L21/67253

摘要： Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

摘要翻译： 公开了一种用于检查的粘合片，其通过在基膜上布置粘合剂层而获得。 基膜和粘合剂层是导电的，并且在基膜和粘合剂层之间形成导电路径。 因此，可以在将半导体晶片或半导体芯片粘合到粘合片上的同时，进行通过切割半导体晶片获得的半导体晶片或半导体芯片的导电性的检查。 此外，该检查用粘合片能够防止半导体晶片的变形（翘曲）或断裂，或者在检查时在半导体晶片的背面产生裂纹或划痕。

公开(公告)号：US20080057306A1

公开(公告)日：2008-03-06

申请号：US11892216

申请日：2007-08-21

申请人： Takatoshi Sasaki ,  Tomokazu Takahashi ,  Fumiteru Asai ,  Akiyoshi Yamamoto ,  Toshio Shintani

发明人： Takatoshi Sasaki ,  Tomokazu Takahashi ,  Fumiteru Asai ,  Akiyoshi Yamamoto ,  Toshio Shintani

IPC分类号： B32B7/12

CPC分类号： B23K26/18 ,  C09J7/29 ,  Y10T428/2848

摘要： An adhesive sheet for laser processing, comprises a base film and an adhesive layer laminated on the surface of the base film, wherein the base film has a melting protection layer on the back side thereof. According to the adhesive sheet for laser processing of the present invention, the melting of the base film caused by the local concentration of laser beam energy at the places irradiated with the laser beam can be effectively prevented. Accordingly, the back side of the base film can be prevented from locally adhering to the processing table in the dicing apparatus, and subsequent steps, namely, drawing the base film to separate the workpiece from the adhesive layer, and individually recovering these, can be carried out easily and efficiently.

摘要翻译： 一种用于激光加工的粘合片，包括基膜和层压在基膜表面上的粘合剂层，其中基膜在其背面具有熔融保护层。 根据本发明的激光加工用粘合片，能够有效地防止由激光束照射的部位的激光能量的局部浓度引起的基膜熔化。 因此，可以防止基膜的背面局部粘附在切割装置的处理台上，随后的步骤即拉出基膜以将粘合剂层分离出来，并单独地回收它们，可以是 轻松高效地进行。

公开(公告)号：US06566608B2

公开(公告)日：2003-05-20

申请号：US09837411

申请日：2001-04-18

申请人： Miho Yamaguchi ,  Ichiro Suehiro ,  Fumiteru Asai ,  Yuji Hotta

发明人： Miho Yamaguchi ,  Ichiro Suehiro ,  Fumiteru Asai ,  Yuji Hotta

IPC分类号： H01B700

CPC分类号： H01R43/007 ,  H01R13/2414 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49798 ,  Y10T29/5187

摘要： The present invention provides a production method of an anisotropic conductive film, which method includes the steps of (a) winding an insulated wire around a core member to form one roll of a winding layer, this insulated wire including a metal conductor wire and a coating layer made from an insulating resin, this coating layer being formed on the wire, placing an insulating resin film on the obtained winding layer, and repeating the winding and the placing to give a laminate alternately having the winding layer having a single row of insulated wires and an insulating resin layer made from the insulating resin film, (b) partially or entirely melting at least one of the coating layer and the insulating resin layer to integrate the winding layer and the insulating resin layer, and (c) slicing the laminate along a plane forming an angle with the insulated wire in a desired film thickness.

摘要翻译： 本发明提供各向异性导电膜的制造方法，该方法包括以下步骤：（a）将绝缘线缠绕在芯部件上以形成卷绕层的一卷，该绝缘线包括金属导线和涂层 由绝缘树脂制成的层，该涂层形成在导线上，在获得的缠绕层上放置绝缘树脂膜，并重复缠绕和放置以交替地形成具有单排绝缘电线的绕组层的层压体 和绝缘树脂膜制成的绝缘树脂层，（b）部分或全部熔化涂层和绝缘树脂层中的至少一个以使绕组层和绝缘树脂层结合在一起，并且（c） 与所述绝缘线形成所需膜厚度的平面。

公开(公告)号：US08647956B2

公开(公告)日：2014-02-11

申请号：US13191697

申请日：2011-07-27

申请人： Fumiteru Asai ,  Goji Shiga ,  Naohide Takamoto

发明人： Fumiteru Asai ,  Goji Shiga ,  Naohide Takamoto

IPC分类号： H01L21/00 ,  H01L21/331

摘要： The present invention relates to a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material layer, a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer stacked in this order, and a film for semiconductor back surface stacked on the second pressure-sensitive adhesive layer of the dicing tape, in which a peel strength Y between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is larger than a peel strength X between the second pressure-sensitive adhesive layer and the film for semiconductor back surface, and in which the peel strength X is from 0.01 to 0.2 N/20 mm, and the peel strength Y is from 0.2 to 10 N/20 mm.

公开(公告)号：US08643194B2

公开(公告)日：2014-02-04

申请号：US13088737

申请日：2011-04-18

申请人： Naohide Takamoto ,  Goji Shiga ,  Fumiteru Asai ,  Akiyoshi Yamamoto ,  Tomokazu Takahashi

发明人： Naohide Takamoto ,  Goji Shiga ,  Fumiteru Asai ,  Akiyoshi Yamamoto ,  Tomokazu Takahashi

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/561 ,  H01L23/3164 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2224/16225 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2924/14 ,  Y10T428/2809 ,  H01L2924/00

摘要： The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.

摘要翻译： 本发明提供了一种用于半导体背面的切割带一体化膜，包括：在基材上包括基材和压敏粘合剂层的切割带; 以及设置在压敏粘合剂层上的倒装芯片型半导体背表面的膜，其中至少一部分粘合剂层已经通过辐射线照射被预先固化。

公开(公告)号：US08450189B2

公开(公告)日：2013-05-28

申请号：US13192068

申请日：2011-07-27

申请人： Goji Shiga ,  Naohide Takamoto ,  Fumiteru Asai

发明人： Goji Shiga ,  Naohide Takamoto ,  Fumiteru Asai

IPC分类号： H01L21/00

CPC分类号： H01L23/3164 ,  C09J163/00 ,  H01L21/561 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2223/54433 ,  H01L2223/54473 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

摘要： The present invention relates to a film for flip chip type semiconductor back surface to be formed on the back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface having a tensile storage elastic modulus at 25° C. after thermal curing within a range of from 10 GPa to 30 GPa, in which the tensile storage elastic modulus at 25° C. after thermal curing of the film for flip chip type semiconductor back surface falls within a range of from 4 times to 20 times the tensile storage elastic modulus at 25° C. before thermal curing thereof.

摘要翻译： 本发明涉及一种用于倒装芯片型半导体背表面的薄膜，该薄膜形成在与被粘物相连的半导体元件倒装芯片的背面上，该倒装芯片型半导体背表面膜的拉伸储能弹性模量为25 在热固化后在10GPa至30GPa的范围内的热固化温度，其中用于倒装芯片型半导体背表面的膜的热固化后25℃下的拉伸储存弹性模量落在4倍 至25℃下的拉伸储存弹性模量的20倍。

公开(公告)号：US20120028442A1

公开(公告)日：2012-02-02

申请号：US13190664

申请日：2011-07-26

申请人： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

发明人： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC分类号： H01L21/78 ,  C09J7/02 ,  B32B7/06

CPC分类号： C09J5/06 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2205/302 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81911 ,  H01L2224/83104 ,  H01L2924/10253 ,  Y10T428/25 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

摘要： The present invention relates to a thermally releasable sheet-integrated film for semiconductor back surface, which includes: a pressure-sensitive adhesive sheet including a base material layer and a pressure-sensitive adhesive layer, and a film for semiconductor back surface formed on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive sheet is a thermally releasable pressure-sensitive adhesive sheet whose peel force from the film for semiconductor back surface decreases upon heating.

摘要翻译： 本发明涉及一种用于半导体背表面的可热分解的片状集成膜，其包括：包含基材层和压敏粘合剂层的压敏粘合片，以及在压力下形成的半导体背面的膜 粘合片的粘合片的粘合剂层，其中粘合片是其半导体背面的膜的剥离力在加热时降低的可热剥离的压敏粘合片。

公开(公告)号：US20120021174A1

公开(公告)日：2012-01-26

申请号：US13170669

申请日：2011-06-28

申请人： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

发明人： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC分类号： B32B33/00 ,  B32B7/12 ,  B32B7/02

CPC分类号： H01L21/6836 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/5448 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/81007 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8391 ,  H01L2924/00013 ,  H01L2924/14 ,  Y10T428/24355 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, wherein said film has, on one surface thereof where said film does not face the back surface of the semiconductor element when said film is formed on the back surface of the semiconductor element, a surface roughness (Ra) within a range of from 50 nm to 3 μm before curing.

摘要翻译： 本发明涉及一种用于倒装芯片型半导体背表面的薄膜，该薄膜形成在与被粘物相连的半导体元件倒装芯片的背面上，其中所述薄膜在其一个表面上没有所述薄膜不面向背面 当在半导体元件的背面上形成所述膜时，半导体元件的表面，固化前的表面粗糙度（Ra）在50nm〜3μm的范围内。