公开(公告)号：US5980870A

公开(公告)日：1999-11-09

申请号：US934544

申请日：1997-09-19

Applicant: In Sub Baik ,  Jong Gi Lee ,  In Sik Cho ,  Youn Woo Park

Inventor： In Sub Baik ,  Jong Gi Lee ,  In Sik Cho ,  Youn Woo Park

IPC: A61K8/19 ,  A61K8/26 ,  A61K8/73 ,  A61K8/97 ,  A61Q11/00 ,  A61K9/16

CPC classification number: A61K8/0237 ,  A61K8/19 ,  A61K8/26 ,  A61K8/73 ,  A61K8/97 ,  A61Q11/00

Abstract: A herb medicine extract-containing non-bleeding striped dentifrice composition, consisting essentially of a striped dentifrice component and a base dentifrice component, each component comprising the following ingredients at the substantially same amount: a. an abrasive that has a BET surface area of 10 m.sup.2 /g or less and an average particle diameter of 1 to 30 .mu.m upon measurement by Coulter Counter method, and shows oil absorption (linseed oil, ml/100 g) of 50 or less; b. a binder selected from the group consisting of xanthan gum, carrageenan, sodium carboxymethylcellulose, and the mixtures thereof; c. an alkyl sulfonate of anionic surfactants; and d. a humectant, and said striped dentifrice component containing herb medicine extracts at an amount of 0.001 to 10% by weight, on the basis of dry solid substance. It is non-bleeding by virtue of the substantially same formulation in the two components and the herb medicine extracts allow the dentifrice composition to suppress the formation of plaque.

Abstract translation: 一种草本药物提取物含有非出血性条状洁齿剂组合物，其基本上由条状洁牙剂组分和基础洁齿剂组分组成，每种组分包含基本相同量的以下成分：a。 通过Coulter Counter法测定的BET表面积为10m 2 / g以下，平均粒径为1〜30μm的研磨剂，油吸收（亚麻子油，ml / 100g）为50以下 ; b。 选自黄原胶，角叉菜胶，羧甲基纤维素钠及其混合物的粘合剂; C。 阴离子表面活性剂的烷基磺酸盐; 和d。 湿润剂，所述条状洁齿剂组分含有基于干固体物质的0.001至10重量％的草药提取物。 由于在两个成分中基本相同的制剂是不渗血的，草药提取物允许洁牙剂组合物抑制斑块的形成。

公开(公告)号：US10257605B2

公开(公告)日：2019-04-09

申请号：US15682119

申请日：2017-08-21

Applicant: Jong Gi Lee

Inventor： Jong Gi Lee

IPC: H04R1/10 ,  H04R1/12

Abstract: Disclosed herein is an earphone protection device. The earphone protection device includes a pair of earphone covers and a pair of adjustment cables. An outer first space and an inner second space are formed inside each of the earphone covers. The first space provides a path adapted to guide earphones through accommodation, and also provides a coupling structure so that the earphone covers are assembled together and closed after the earphones have been accommodated inside the earphone covers.

公开(公告)号：US08283430B2

公开(公告)日：2012-10-09

申请号：US12525589

申请日：2008-02-13

Applicant: Kyo-Duck Ahn ,  Jong-Gi Lee ,  Choun-San Kim ,  Young-Shin Kim

Inventor： Kyo-Duck Ahn ,  Jong-Gi Lee ,  Choun-San Kim ,  Young-Shin Kim

IPC: C08F20/10 ,  C08F22/02 ,  C08F20/04 ,  C08F20/06 ,  C08F220/12 ,  C08F218/02

CPC classification number: C08F220/04 ,  C08F220/06 ,  C08F220/10

Abstract: The present invention relates to a composition for manufacturing a carboxylic group-containing polymer and a carboxylic group-containing polymer manufactured by using the same. More particularly, the present invention relates to a composition for manufacturing a carboxylic group-containing polymer comprising an allyl monomer having a long chain of a hydrophilic part containing alkylene oxide and a side chain of a hydrophobic part containing fatty acid ester as a dispersion promoter; a vinyl group-containing unsaturated carboxylic acid; a vinyl group-containing crosslinking agent; and a radical polymerization initiator, and a carboxylic group-containing polymer manufactured by using the same wherein the polymer can be dispersed in water without stirring, its dispersion solution has low viscosity, and its neutralized viscous solution obtained by alkali neutralization has high viscosity and transparency. Therefore, the carboxylic group-containing polymer of the present invention can be effectively used in the fields of a thickener and a dispersion stabilizer for an emulsion, a suspension and the like.

Abstract translation: 本发明涉及用于制造含羧基聚合物的组合物和使用该组合物制造的含羧基聚合物。 更具体地说，本发明涉及一种含有羧基的聚合物的组合物，该组合物包含具有长链的含有烯化氧的亲水部分和含有脂肪酸酯的疏水部分的侧链作为分散促进剂的烯丙基单体， 含乙烯基的不饱和羧酸; 含乙烯基的交联剂; 和自由基聚合引发剂以及通过使用该聚合物制造的含羧基的聚合物，其中聚合物可以在不搅拌的情况下分散在水中，其分散溶液具有低粘度，并且其通过碱中和获得的中和的粘稠溶液具有高粘度和透明度 。 因此，本发明的含羧基的聚合物可以有效地用于乳液，悬浮液等的增稠剂和分散稳定剂领域。

公开(公告)号：US07612450B2

公开(公告)日：2009-11-03

申请号：US11765367

申请日：2007-06-19

Applicant: Jong-Gi Lee ,  Tae-Joo Hwang

Inventor： Jong-Gi Lee ,  Tae-Joo Hwang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44

CPC classification number: H01L23/16 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/83191 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip, and a plurality of conductive balls, e.g., solder balls formed on a joint surface of the semiconductor chip. A dummy board includes openings aligned with the solder balls and is bonded to the joint surface of the semiconductor chip. An adhesive material is interposed between the semiconductor chip and the dummy board to adhere the dummy board to the semiconductor chip. The adhesive material is applied on an adhesion surface of the dummy board adhered to a joint surface of the semiconductor chip. The dummy board is adhered to the joint surface of the semiconductor chip such that the solder balls are aligned with the openings. Cheap underfill materials can be selectively used, and a process time for reflow and curing of the adhesive material can be greatly reduced.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括半导体芯片和多个导电球，例如形成在半导体芯片的接合表面上的焊球。 虚拟板包括与焊球对准的开口并且结合到半导体芯片的接合表面。 在半导体芯片和虚拟基板之间插入粘合材料，以将该虚拟板粘接到半导体芯片。 将粘合材料施加在粘附到半导体芯片的接合表面的伪板的粘合表面上。 将该虚拟板粘接到半导体芯片的接合面，使得焊球与开口对准。 可以选择性地使用廉价的底部填充材料，并且可以大大降低粘合材料的回流和固化的处理时间。

公开(公告)号：US20090026596A1

公开(公告)日：2009-01-29

申请号：US12178532

申请日：2008-07-23

Applicant: Sang-Wook PARK ,  Jong-Gi LEE ,  Kun-Dae YEOM ,  Sung-Ki LEE ,  Ji-Seok HONG

Inventor： Sang-Wook PARK ,  Jong-Gi LEE ,  Kun-Dae YEOM ,  Sung-Ki LEE ,  Ji-Seok HONG

IPC: H01L23/495 ,  H05K7/18

CPC classification number: H01L23/49555 ,  H01L23/49548 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In certain embodiments, a lead frame includes a paddle, a plurality of inner leads, first outer leads, and a second outer lead. The plurality of inner leads can be arranged at a side face of the paddle. The first outer leads can extend from the inner leads along a first direction and can be arranged at a substantially central portion of the side face of the paddle. Furthermore, each of the first outer leads can have a first area. The second outer lead can be arranged at an edge portion of the side face of the paddle and can be supported by the paddle. The second outer lead can have a second area that is larger than the first area.

Abstract translation: 在某些实施例中，引线框架包括桨，多个内引线，第一外引线和第二外导线。 多个内引线可以布置在桨的侧面。 第一外引线可以沿着第一方向从内引线延伸，并且可以布置在桨的侧面的大致中心部分。 此外，每个第一外引线可以具有第一区域。 第二外引线可以布置在桨的侧面的边缘部分处，并且可以由桨支撑。 第二外部引线可以具有大于第一区域的第二区域。

公开(公告)号：US20080315379A1

公开(公告)日：2008-12-25

申请号：US12213325

申请日：2008-06-18

Applicant: Ku-Young Kim ,  Hyung-gil Baek ,  Jong-gi Lee ,  Sang-wook Park ,  Kun-dae Yeom ,  Dong-hun Lee

Inventor： Ku-Young Kim ,  Hyung-gil Baek ,  Jong-gi Lee ,  Sang-wook Park ,  Kun-dae Yeom ,  Dong-hun Lee

IPC: H01L23/495

CPC classification number: H01L23/49558 ,  H01L23/16 ,  H01L23/3107 ,  H01L2225/1029 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00

Abstract: Provided is a semiconductor package and method of manufacturing the same. The semiconductor package may include a semiconductor chip, an encapsulant encapsulating the semiconductor chip, a lead unit, and a partially encapsulated by the encapsulating thermal stress buffer which absorbs thermal stress of the semiconductor chip or the encapsulant.

Abstract translation: 提供一种半导体封装及其制造方法。 半导体封装可以包括半导体芯片，封装半导体芯片的密封剂，引线单元，以及由吸收半导体芯片或密封剂的热应力的封装热应力缓冲部分封装的半导体封装。

公开(公告)号：US20080308913A1

公开(公告)日：2008-12-18

申请号：US12140190

申请日：2008-06-16

Applicant: Sang-Wook PARK ,  Min-Young SON ,  Jong-Gi LEE ,  Kun-Dae YEOM ,  Sung-Ki LEE ,  Ji-Seok HONG

Inventor： Sang-Wook PARK ,  Min-Young SON ,  Jong-Gi LEE ,  Kun-Dae YEOM ,  Sung-Ki LEE ,  Ji-Seok HONG

IPC: H01L23/495

CPC classification number: H01L23/49555 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10757 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked semiconductor package includes a first semiconductor package, a second semiconductor package and a conductive connection member. The first semiconductor package includes a first semiconductor chip, a first lead frame having first outer leads that are electrically connected to the first semiconductor chip, and a first molding member formed on the first semiconductor chip and the first lead frame to expose the first outer leads. The second semiconductor package includes a second semiconductor chip, a second lead frame formed on the first molding member and having second outer leads that may be electrically connected to the second semiconductor chip, and a second molding member formed on the second semiconductor chip and the second lead frame to expose the second outer leads. The conductive connection member may electrically connect the first outer leads and the second outer leads to each other. Further, the conductive connection member may have a crack-blocking groove.

Abstract translation: 叠层半导体封装包括第一半导体封装，第二半导体封装和导电连接构件。 第一半导体封装包括第一半导体芯片，具有与第一半导体芯片电连接的第一外部引线的第一引线框架和形成在第一半导体芯片和第一引线框架上以暴露第一外部引线的第一模制构件 。 第二半导体封装包括第二半导体芯片，形成在第一模制构件上的第二引线框架，并且具有可与第二半导体芯片电连接的第二外部引线，以及形成在第二半导体芯片上的第二模制构件和第二半导体芯片 引线框架露出第二个外引线。 导电连接构件可以将第一外引线和第二外引线彼此电连接。 此外，导电连接构件可以具有防裂槽。

公开(公告)号：US08796597B2

公开(公告)日：2014-08-05

申请号：US12272867

申请日：2008-11-18

Applicant: Min-Ill Kim ,  Jong-Gi Lee ,  Kwang-Yong Lee ,  Ki-Kwon Jeong

Inventor： Min-Ill Kim ,  Jong-Gi Lee ,  Kwang-Yong Lee ,  Ki-Kwon Jeong

IPC: B23K1/002 ,  B23K1/00 ,  B23K5/00 ,  B23K20/14 ,  B23K37/04 ,  H05B6/04

CPC classification number: B23K1/0016 ,  B23K1/002 ,  B23K2101/40 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/48091 ,  H01L2224/81191 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract translation: 一种在线封装装置包括第一处理单元，输入存储单元，加热单元和输出存储单元。 第一处理单元执行球连接处理或芯片安装处理。 在第一处理单元中完成处理的处理对象被接收在盒中以便被垂直堆叠，并且每个具有一个或多个处理对象的多个杂志被存储在输入堆叠器中。 加热单元通过感应加热方法对存储在输入堆叠器中的仓库中的处理对象进行回流处理。 回收处理完成的处理对象被接收在仓库中，然后存储在输出堆垛机中。

公开(公告)号：US20130078763A1

公开(公告)日：2013-03-28

申请号：US13618041

申请日：2012-09-14

Applicant: Jong-Gi LEE ,  Kwang-Yong Lee ,  Min-Ho Lee

Inventor： Jong-Gi LEE ,  Kwang-Yong Lee ,  Min-Ho Lee

IPC: H01L21/50

CPC classification number: H01L24/82 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/16225 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24145 ,  H01L2224/244 ,  H01L2224/24998 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

Abstract: A first semiconductor chip having a first projection electrode formed on an upper surface thereof is prepared. A second semiconductor chip having a second projection electrode is mounted on the first semiconductor chip to expose the first projection electrode. An insulating film is formed between the first projection electrode and the second projection electrode. A groove is formed in the insulating film. An interconnection configured to fill an inside of the groove and connected to the first projection electrode and the second projection electrode is formed.

Abstract translation: 制备具有形成在其上表面上的第一突起电极的第一半导体芯片。 具有第二投影电极的第二半导体芯片安装在第一半导体芯片上以暴露第一投影电极。 在第一投影电极和第二投影电极之间形成绝缘膜。 在绝缘膜中形成凹槽。 形成了用于填充凹槽内部并连接到第一突出电极和第二突起电极的互连。

公开(公告)号：US07759795B2

公开(公告)日：2010-07-20

申请号：US11850576

申请日：2007-09-05

Applicant: Young-Lyong Kim ,  Young-Shin Choi ,  Jong-Gi Lee ,  Kun-Dae Yeom ,  Chul-Yong Jang ,  Hyun-Jong Woo

Inventor： Young-Lyong Kim ,  Young-Shin Choi ,  Jong-Gi Lee ,  Kun-Dae Yeom ,  Chul-Yong Jang ,  Hyun-Jong Woo

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H05K3/4084 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/38 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09481 ,  H05K2201/0969 ,  H05K2201/2072 ,  H05K2203/0195 ,  H05K2203/0733 ,  Y10T29/49155 ,  H01L2224/0401

Abstract: Provided is a printed circuit board having a bump interconnection structure that improves reliability between interconnection layers. Also provided is a method of fabricating the printed circuit board and semiconductor package using the printed circuit board. According to one embodiment, the printed circuit board includes a plurality of bumps formed on a resin layer between a first interconnection layer and a second interconnection layer. The second interconnection layer includes insertion holes corresponding to upper portions of the bumps so that the upper portions of the bumps protrude from the second interconnection layer. The upper portion of at least one of the bumps includes a rivet portion having a diameter greater that the diameter of the corresponding insertion hole to reliably interconnect the first and second interconnection layers.

Abstract translation: 提供了具有提高互连层之间的可靠性的凸块互连结构的印刷电路板。 还提供了使用印刷电路板制造印刷电路板和半导体封装的方法。 根据一个实施例，印刷电路板包括形成在第一互连层和第二互连层之间的树脂层上的多个凸点。 第二互连层包括对应于凸起的上部的插入孔，使得凸起的上部从第二互连层突出。 至少一个凸块的上部包括具有大于相应插入孔的直径的直径的铆钉部分，以可靠地互连第一和第二互连层。