公开(公告)号：US06952514B2

公开(公告)日：2005-10-04

申请号：US10683373

申请日：2003-10-10

申请人： Young-Min Lee ,  June-Hyeon Ahn ,  Kyu-Sub Kwak

发明人： Young-Min Lee ,  June-Hyeon Ahn ,  Kyu-Sub Kwak

IPC分类号： G02B6/34 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183

CPC分类号： G02B6/12007 ,  G02B6/29368 ,  G02B6/4224 ,  G02B6/4238 ,  G02B6/4246

摘要： A coupling structure for coupling an optical waveguide and an optical device is provided. The coupling structure enables to precisely align the optical waveguide and the optical device so that an optical-alignment error can be reduced within a range of a few μm. The coupling structure includes a first substrate, at least one optical waveguide formed on the first substrate to transmit an optical signal, optical alignment dummy waveguides symmetrically aligned on the first substrate about the optical waveguide, a second substrate bonded to the first substrate, at least one optical device mounted on a bottom surface of the second substrate and optically connected to the optical waveguide, and optical-alignment patterns formed at the bottom surface of the second substrate corresponding to the optical alignment dummy waveguides, wherein an optical alignment for the optical waveguide and the optical device is achieved by aligning the optical alignment dummy waveguides with the optical-alignment patterns.

摘要翻译： 提供了用于耦合光波导和光学装置的耦合结构。 耦合结构使得能够精确地对准光波导和光学装置，使得可以在几个微米的范围内减少光学对准误差。 耦合结构包括第一衬底，形成在第一衬底上以传输光信号的至少一个光波导，围绕光波导对称地对准在第一衬底上的光学对准虚拟波导，至少结合到第一衬底的第二衬底 安装在所述第二基板的底表面上并光学连接到所述光波导的一个光学装置以及形成在所述第二基板的与所述光学对准虚拟波导对应的所述第二基板的底表面处的光学对准图案，其中所述光波导 并且通过使光学对准虚拟波导与光学对准图案对准来实现光学装置。

公开(公告)号：US08045331B2

公开(公告)日：2011-10-25

申请号：US12188319

申请日：2008-08-08

申请人： Ho-Seong Seo ,  Young-Min Lee ,  Kyu-Sub Kwak

发明人： Ho-Seong Seo ,  Young-Min Lee ,  Kyu-Sub Kwak

IPC分类号： H01L23/52 ,  H01L23/02 ,  H01L21/48

CPC分类号： H05K3/4092 ,  H05K1/11 ,  H05K3/326 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2203/308 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155

摘要： A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.

摘要翻译： 印刷电路板包括芯层，形成在芯层上并具有形成在绝缘层的一部分上的空腔的绝缘层和形成在绝缘层上的电路图案，其中电路图案包括一个或多个外部端子 位于空腔上方。

公开(公告)号：US20110165734A1

公开(公告)日：2011-07-07

申请号：US12985900

申请日：2011-01-06

申请人： Seung-Woo Han ,  Jea-Hyuck Lee ,  Kyu-Sub Kwak ,  Kang-Ho Byun ,  Joon-II Kim ,  Duck-Hwan Kim ,  Kyung-Ho Park ,  Se-Mi Park

发明人： Seung-Woo Han ,  Jea-Hyuck Lee ,  Kyu-Sub Kwak ,  Kang-Ho Byun ,  Joon-II Kim ,  Duck-Hwan Kim ,  Kyung-Ho Park ,  Se-Mi Park

IPC分类号： H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor chip package includes molding a semiconductor chip and a number of passive devices after arranging on a film the semiconductor chip and the passive devices located in a vacant space around the periphery of the semiconductor chip; removing the film, forming an adhesive layer in a film-removed area, and attaching a conductive layer to the adhesive layer; etching a conductive layer to thereby form a conductive circuit pattern; and providing one or more conductive pads, which electrically connect the conductive circuit pattern to the semiconductor chip and to the passive devices.

摘要翻译： 半导体芯片封装的制造方法包括在半导体芯片和位于半导体芯片周围的空白空间中的无源器件的膜上配置半导体芯片和多个无源器件之后， 去除膜，在除膜区域中形成粘合剂层，并将导电层附着到粘合剂层上; 蚀刻导电层从而形成导电电路图案; 以及提供将导电电路图案电连接到半导体芯片和无源器件的一个或多个导电焊盘。

公开(公告)号：US20070152315A1

公开(公告)日：2007-07-05

申请号：US11521038

申请日：2006-09-14

申请人： Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

发明人： Kyu-Sub Kwak ,  Kyung-Wan Park ,  Seung-Woo Han

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-die package and a method of fabrication is discloses. The multi-die package includes a package substrate, a first semiconductor die bonded directly on the package substrate and connected electrically with the package substrate, and a second semiconductor die having a groove providing a receiving space, bonded directly on the package substrate so that the first semiconductor die is covered by the groove, and connected electrically with the package substrate.

摘要翻译： 公开了一种多管芯封装及其制造方法。 多管芯封装包括封装基板，直接结合在封装基板上并与封装基板电连接的第一半导体管芯，以及具有提供容纳空间的沟槽的第二半导体管芯，其直接粘合在封装基板上， 第一半导体管芯被沟槽覆盖，并与封装基板电连接。

公开(公告)号：US20070123320A1

公开(公告)日：2007-05-31

申请号：US11432066

申请日：2006-05-11

申请人： Seung-Woo Han ,  Kyu-Sub Kwak ,  Kyung Park

发明人： Seung-Woo Han ,  Kyu-Sub Kwak ,  Kyung Park

IPC分类号： H04M1/00

CPC分类号： H04M1/23 ,  G06F3/0213 ,  G06F3/0362 ,  H04M1/0218 ,  H04M1/233

摘要： A key input device for a portable terminal includes wheel keys capable of rotating in multiple directions and performing a switch function. The key input device including a plurality of keys having at least one wheel keys provided in a main body and rotating in multiple directions, at least one rotating units allowing the wheel keys to rotate in respective directions, and at least one switching units provided under the wheel keys to sense the rotation directions of the wheel keys and to sense a pressure generated by the activation of the rotated wheel keys.

摘要翻译： 用于便携式终端的键输入装置包括能够在多个方向上旋转并执行开关功能的轮键。 所述键输入装置包括多个按键，所述多个按键具有设置在主体中并沿多个方向旋转的至少一个轮键，至少一个允许所述轮键在各个方向上旋转的旋转单元，以及设置在所述主键下方的至少一个切换单元 轮键来感测轮键的旋转方向，并且感测由旋转的轮键的启动而产生的压力。

公开(公告)号：US07208824B2

公开(公告)日：2007-04-24

申请号：US11100151

申请日：2005-04-06

申请人： Young-Min Lee ,  Kyu-Sub Kwak

发明人： Young-Min Lee ,  Kyu-Sub Kwak

IPC分类号： H01L23/02

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/10977 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a land grid array module comprising: a substrate; a plurality of active and passive components mounted on both sides of the substrate; and a molding compound for encapsulating the both sides of the substrate with the active and passive components mounted thereon. The land grid array module mounts the passive and active components on both sides of the substrate, thereby improving the integration of the circuit device. Also, the use of a thin film printed circuit board or a flexible printed circuit board with high rigidity as the substrate reduces the overall thickness of the land grid array module.

摘要翻译： 公开了一种地面栅格阵列模块，包括：基板; 安装在基板两侧的多个有源和无源元件; 以及用于将基板的两侧封装在其上的有源和无源部件的模塑料。 地面阵列模块将无源和有源部件安装在基板的两侧，从而改善电路装置的集成。 此外，使用具有高刚性的薄膜印刷电路板或柔性印刷电路板作为基板来降低焊盘栅格阵列模块的总体厚度。

公开(公告)号：US20050147360A1

公开(公告)日：2005-07-07

申请号：US10922440

申请日：2004-08-19

申请人： Kyu-Sub Kwak ,  Young-Min Lee ,  June-Hyeon Ahn

发明人： Kyu-Sub Kwak ,  Young-Min Lee ,  June-Hyeon Ahn

IPC分类号： G02B6/42 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/0683 ,  H01S5/183 ,  G02B6/36

CPC分类号： H01S5/0683 ,  G02B6/4206 ,  H01S5/02284 ,  H01S5/0264 ,  H01S5/183 ,  H01S5/423

摘要： A vertical cavity surface emitting laser (VCSEL) module includes a substrate provided with an etched region formed on a lower surface thereof, a plurality of layers, for photoproduction, laminated on an upper surface of the substrate, and a VCSEL for emitting the light upwards and downwards, wherein the VCSEL module monitors the output of the VCSEL by detecting the light emitted downwards from the VCSEL.

摘要翻译： 垂直腔表面发射激光器（VCSEL）模块包括：衬底，其设置有形成在其下表面上的蚀刻区域，多个层，用于光生产，层压在衬底的上表面上;以及VCSEL，用于向上发射光 并且向下，其中VCSEL模块通过检测从VCSEL向下发射的光来监视VCSEL的输出。

公开(公告)号：US08237255B2

公开(公告)日：2012-08-07

申请号：US12633433

申请日：2009-12-08

申请人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-Sub Kwak ,  Youn-Ho Choi

发明人： Sang-Hyun Kim ,  Shi-Yun Cho ,  Young-Min Lee ,  Kyu-Sub Kwak ,  Youn-Ho Choi

IPC分类号： H01L23/48

CPC分类号： H05K1/188 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/0554

摘要： A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.

摘要翻译： 提供了印刷电路板（PCB），其中至少一个内置集成电路（IC）封装在IC上具有多个导电凸块。 多个导电凸块用于外部电连接。 IC封装通过IC上的连接构件容纳在多层PCB的芯层内。 连接构件形成在导电凸块和芯层之间，其中接触孔与导电凸块接触。 导电凸块通过形成在接触孔中的导体层电连接。

公开(公告)号：US08043892B2

公开(公告)日：2011-10-25

申请号：US12099354

申请日：2008-04-08

申请人： Kyu-Sub Kwak ,  Jae-Hyuck Lee

发明人： Kyu-Sub Kwak ,  Jae-Hyuck Lee

IPC分类号： H01L23/552

CPC分类号： H01L21/561 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor die package includes a substrate, a semiconductor die mounted on the substrates a molding covering the semiconductor die and which is formed on the substrate and a conductive layer laminated on the molding.

摘要翻译： 半导体管芯封装包括：基板，在基板上安装覆盖半导体管芯的模制件，并且形成在基板上的半导体管芯和层压在模制件上的导电层。

公开(公告)号：US20110228490A1

公开(公告)日：2011-09-22

申请号：US13050378

申请日：2011-03-17

申请人： Yu-Su KIM ,  Kyu-Sub Kwak ,  Young-Min LEE ,  Shi-Yun Cho ,  Jea-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

发明人： Yu-Su KIM ,  Kyu-Sub Kwak ,  Young-Min LEE ,  Shi-Yun Cho ,  Jea-Hyuck Lee ,  Se-Ho Park ,  Youn-Ho Choi ,  Seung-Woo Han ,  Ji-Hyun Jung

IPC分类号： H05K1/18

CPC分类号： H05K3/323 ,  H05K1/189 ,  H05K2201/10159

摘要： A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.

摘要翻译： 提供了一种在便携式终端中使用的大容量存储模块安装装置，包括：大容量存储模块，包括多个第一接触焊盘; 以及柔性电路板，包括多个第二接触焊盘，并且在第一和第二接触焊盘以面对面的方式定位之后，通过在加热过程中形成焊盘而电连接到大容量存储器模块。 因此，大容量存储器模块可以有利地安装到便携式终端，并且可以有效地屏蔽电磁场。