公开(公告)号：US08646591B2

公开(公告)日：2014-02-11

申请号：US13130322

申请日：2009-11-05

申请人： Thomas Marcelina Louis De Ruijter ,  Nigel David Harrison ,  Martin Lawrence Hughes ,  Mark Robson Humphries ,  Paul Antony Merritt ,  Stefaan Jaak Vanquickenborne ,  Philip Jonathan West

发明人： Thomas Marcelina Louis De Ruijter ,  Nigel David Harrison ,  Martin Lawrence Hughes ,  Mark Robson Humphries ,  Paul Antony Merritt ,  Stefaan Jaak Vanquickenborne ,  Philip Jonathan West

IPC分类号： A61J3/00 ,  A61J3/07

CPC分类号： A61J3/007 ,  A61J3/074 ,  B65G47/1471 ,  G01N21/9508

摘要： The invention relates to an apparatus for handling capsules in a capsule processing equipment. The invention also relates to capsule processing equipment, such as an inspection equipment or a capsule printing equipment that includes such an apparatus.

摘要翻译： 本发明涉及一种在胶囊加工设备中处理胶囊的装置。 本发明还涉及胶囊加工设备，例如包括这种装置的检查设备或胶囊印刷设备。

公开(公告)号：US20110186334A1

公开(公告)日：2011-08-04

申请号：US13030684

申请日：2011-02-18

申请人： Mark Robson Humphries ,  Frank Ferdinandi ,  Rodney Edward Smith

发明人： Mark Robson Humphries ,  Frank Ferdinandi ,  Rodney Edward Smith

IPC分类号： H05K1/00 ,  B23K20/24 ,  B23K31/02 ,  B23K1/20 ,  B82Y40/00

CPC分类号： H05K1/09 ,  B23K1/20 ,  B23K20/24 ,  B23K31/02 ,  B82Y40/00 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H05K1/00

摘要： In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

摘要翻译： 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。

公开(公告)号：US20110183057A1

公开(公告)日：2011-07-28

申请号：US12933371

申请日：2009-03-19

申请人： Stuart Michael Ruan Jones ,  Mark Robson Humphries ,  David Morrison Russell

发明人： Stuart Michael Ruan Jones ,  Mark Robson Humphries ,  David Morrison Russell

IPC分类号： B65D85/73 ,  A47J31/44 ,  B01F3/04

CPC分类号： A47J43/12 ,  A47J31/44 ,  B65D85/73

摘要： A foaming device for a drink including a housing defining an internal volume for housing secondary liquid and a source of foaming gas. A nozzle communicates between the internal volume and an exterior of the housing and a plug seals the nozzle so as to prevent communication between the internal volume and the exterior of the housing. By releasing the plug, the secondary liquid can be released into the drink such that the foaming gas forms bubbles of secondary liquid in the drink and proteins/constituents within one or both of the primary liquid and the secondary liquid denature so as to create a stable foam.

摘要翻译： 一种用于饮料的发泡装置，包括限定用于容纳二次液体的内部容积的壳体和发泡气体源。 喷嘴在内部容积和壳体的外部之间连通，并且塞子密封喷嘴，以防止内部容积与壳体的外部之间的连通。 通过释放塞子，二次液体可以释放到饮料中，使得发泡气体在饮料中形成二次液体的气泡，并在一次或两次初级液体和次级液体变性中形成蛋白质/成分，从而产生稳定的 泡沫。

公开(公告)号：US20100025091A1

公开(公告)日：2010-02-04

申请号：US12526586

申请日：2008-02-18

申请人： Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

发明人： Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

IPC分类号： H05K1/09 ,  H05K1/02 ,  B23K37/00 ,  B05D5/12 ,  C23C16/513

CPC分类号： H05K1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/81024 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2224/83024 ,  H01L2224/83205 ,  H01L2224/83395 ,  H01L2224/83815 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85395 ,  H01L2224/85447 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/00 ,  H05K3/282 ,  H05K3/285 ,  H05K3/288 ,  H05K3/3484 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2203/092 ,  H05K2203/107 ,  H05K2203/1338 ,  H05K2203/1366 ,  H05K2203/1372 ,  H05K2203/1383 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.

摘要翻译： 印刷电路板将要制成局部焊接连接，所述印刷电路板的表面具有包含厚度为1nm至10μm的卤代烃聚合物的组合物的连续或非连续涂层。

公开(公告)号：USD569640S1

公开(公告)日：2008-05-27

申请号：US29281233

申请日：2007-06-19

申请人： Mark Robson

设计人： Mark Robson

公开(公告)号：US06275603B1

公开(公告)日：2001-08-14

申请号：US09051663

申请日：1998-06-24

申请人： Anthony James Cronshaw ,  Christopher James Hodges ,  Mark Robson Humphries ,  David Livingstone ,  Stephen Peter Woodall ,  Bernardus Cornelis Johannes Landman

发明人： Anthony James Cronshaw ,  Christopher James Hodges ,  Mark Robson Humphries ,  David Livingstone ,  Stephen Peter Woodall ,  Bernardus Cornelis Johannes Landman

IPC分类号： G06K900

CPC分类号： G01N21/9027

摘要： This invention provides a method and apparatus (100) for detecting small glass particles (12) in bottles (1) filled with beer (10). The beer (10) is caused to rotate with respect to the bottle (1), and successive images are obtained from the bottle by means of a CCD-camera (40) which is arranged such that its optical axis (41) makes an angle &agr; of about 135° with the axis (13) of the bottle (1), which is illuminated from below. The successive images are subtracted from each other to detect refracted light emanating from glass particles. These measurements are repeated a plurality of times. The invention thus offers an improvement in sensitivity and reliability of a detecting method. An apparatus (100) comprises a carousel (103) with a plurality of cameras dedicated to a single bottle. A system is described to reduce costs by having eight cameras share one image processing unit.

摘要翻译： 本发明提供一种用于检测填充有啤酒（10）的瓶子（1）中的小玻璃颗粒（12）的方法和设备（100）。 使啤酒（10）相对于瓶（1）旋转，并且通过CCD相机（40）从瓶中获得连续的图像，CCD相机（40）被布置成使得其光轴（41）成角度 与瓶子（1）的轴线（13）约135°的α，其从下方被照亮。 将相继的图像相互减去以检测从玻璃颗粒发出的折射光。 这些测量重复多次。 因此，本发明提供了一种检测方法的灵敏度和可靠性的改进。 装置（100）包括具有专用于单个瓶子的多个摄像机的转盘（103）。 描述了通过使八个摄像机共享一个图像处理单元来降低成本的系统。

公开(公告)号：USD645268S1

公开(公告)日：2011-09-20

申请号：US29361108

申请日：2010-05-05

申请人： Mark Robson

设计人： Mark Robson

公开(公告)号：US09055700B2

公开(公告)日：2015-06-09

申请号：US13059602

申请日：2009-08-11

申请人： Mark Robson Humphries ,  Frank Ferdinandi ,  Rodney Edward Smith

发明人： Mark Robson Humphries ,  Frank Ferdinandi ,  Rodney Edward Smith

IPC分类号： H05K1/03 ,  H05K3/28 ,  H01L23/00 ,  H01H13/78 ,  H05K3/22 ,  H05K3/32

CPC分类号： H05K3/282 ,  H01H13/78 ,  H01H2215/004 ,  H01H2229/012 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/06 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45113 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45149 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/4517 ,  H01L2224/45171 ,  H01L2224/45173 ,  H01L2224/45178 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/8502 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85484 ,  H01L2224/85611 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/3011 ,  H05K3/222 ,  H05K3/284 ,  H05K3/328 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/049 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20758

摘要： In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

摘要翻译： 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。

公开(公告)号：US08618420B2

公开(公告)日：2013-12-31

申请号：US13030684

申请日：2011-02-18

申请人： Mark Robson Humphries ,  Frank Ferdinandi ,  Rodney Edward Smith

发明人： Mark Robson Humphries ,  Frank Ferdinandi ,  Rodney Edward Smith

IPC分类号： H05K1/09

CPC分类号： H05K1/09 ,  B23K1/20 ,  B23K20/24 ,  B23K31/02 ,  B82Y40/00 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H05K1/00

摘要： In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

摘要翻译： 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。

公开(公告)号：US08492898B2

公开(公告)日：2013-07-23

申请号：US12526586

申请日：2008-02-18

申请人： Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

发明人： Frank Ferdinandi ,  Rodney Edward Smith ,  Mark Robson Humphries

IPC分类号： H01L23/48 ,  H05K1/00

CPC分类号： H05K1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/81024 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2224/83024 ,  H01L2224/83205 ,  H01L2224/83395 ,  H01L2224/83815 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85395 ,  H01L2224/85447 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/00 ,  H05K3/282 ,  H05K3/285 ,  H05K3/288 ,  H05K3/3484 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2203/092 ,  H05K2203/107 ,  H05K2203/1338 ,  H05K2203/1366 ,  H05K2203/1372 ,  H05K2203/1383 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.

摘要翻译： 印刷电路板将要制成局部焊接连接，所述印刷电路板的表面具有包含厚度为1nm至10μm的卤代烃聚合物的组合物的连续或非连续涂层。