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    Carrier for manufacturing substrate and method of manufacturing substrate using the same
    13.
    发明授权
    Carrier for manufacturing substrate and method of manufacturing substrate using the same 失效
    用于制造基板的载体和使用其的制造基板的方法

    公开(公告)号：US08435376B2

    公开(公告)日：2013-05-07

    申请号：US12787300

    申请日：2010-05-25

    Applicant: Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

    Inventor： Jin Ho Kim ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

    IPC: B29C65/02 ,  B29C65/52 ,  B29C63/26 ,  B32B37/26 ,  B32B38/10

    CPC classification number: H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

    Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

    Abstract translation: 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

    CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME
    15.
    发明申请
    CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME 失效
    用于制造基板的承载件及其制造方法

    公开(公告)号：US20110159282A1

    公开(公告)日：2011-06-30

    申请号：US12787300

    申请日：2010-05-25

    Applicant: Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

    Inventor： Jin Ho KIM ,  Jin Yong Ahn ,  Ki Hwan Kim ,  Byung Moon Kim ,  Seok Kyu Lee

    IPC: B32B7/12 ,  B32B38/10 ,  B32B38/00 ,  B32B37/02

    CPC classification number: H05K13/04 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T156/1043 ,  Y10T156/1142 ,  Y10T428/2804

    Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

    Abstract translation: 本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。 载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以 更稳定地进行。

    PACKAGE SUBSTRATE
    17.
    发明申请
    PACKAGE SUBSTRATE 审中-公开
    包装基板

    公开(公告)号：US20100148348A1

    公开(公告)日：2010-06-17

    申请号：US12480291

    申请日：2009-06-08

    Applicant: Jae-Joon LEE ,  Jin-Yong An ,  Ki-Hwan Kim ,  Seok-Kyu Lee

    Inventor： Jae-Joon LEE ,  Jin-Yong An ,  Ki-Hwan Kim ,  Seok-Kyu Lee

    IPC: H01L23/498

    CPC classification number: H01L23/49822 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H01L2924/15174 ,  H05K1/0271 ,  H05K3/3452 ,  H05K3/4682 ,  H05K2201/0191 ,  H05K2201/09972 ,  H05K2203/1572

    Abstract: A package substrate is disclosed. The package substrate as a printed circuit board, in which a semiconductor chip is mounted on one side thereof and the other side thereof is mounted on a main board, can include a substrate part, a first pad, which is formed on one side of the substrate part such that the first pad is electrically connected to the semiconductor chip, and a first solder resist layer, which is formed on one surface of the substrate part such that the first pad is exposed. Here, the first solder resist layer is divided into a pad portion and a dummy portion, the first pad is exposed in the pad portion, and the dummy portion is thinner than the pad portion. The package substrate can contribute to the formation of a structure in which thermal expansion coefficients are symmetrical between the top and bottom, thus preventing the warpage.

    Abstract translation: 公开了封装衬底。 作为印刷电路板的封装基板，其中半导体芯片安装在其一侧并且另一侧安装在主板上，可以包括基板部分，第一焊盘，其形成在主体的一侧上 基板部分，使得第一焊盘电连接到半导体芯片;以及第一阻焊层，其形成在基板部分的一个表面上，使得第一焊盘露出。 这里，第一阻焊层被分成焊盘部分和虚设部分，第一焊盘暴露在焊盘部分中，并且虚设部分比焊盘部分薄。 封装基板有助于形成热膨胀系数在顶部和底部之间对称的结构，从而防止翘曲。

    Printed circuit board with embedded capacitors therein, and process for manufacturing the same
    19.
    发明授权
    Printed circuit board with embedded capacitors therein, and process for manufacturing the same 有权
    具有嵌入式电容器的印刷电路板及其制造方法

    公开(公告)号：US07092237B2

    公开(公告)日：2006-08-15

    申请号：US11117315

    申请日：2005-04-29

    Applicant: Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    Inventor： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    IPC: H01G4/06 ,  H01G4/005

    CPC classification number: H05K1/162 ,  H05K3/0023 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

    Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photo resist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.

    Abstract translation: 这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。 嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。 制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR的铜箔 -4形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和 底部电极形成分立电容。

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