公开(公告)号：US20080233666A1

公开(公告)日：2008-09-25

申请号：US12153719

申请日：2008-05-23

Applicant: Jung Kyu Park ,  Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

Inventor： Jung Kyu Park ,  Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.

Abstract translation: 本发明涉及一种具有用于聚焦并通过封装侧发光的金属反射层的LED封装及其制造方法。 LED封装包括其上形成有电极的基板，设置在基板上的发光二极管芯片以及覆盖LED芯片和基板的密封剂以保护LED芯片。 LED封装还包括围绕密封剂的侧表面的金属反射层，以在密封剂的顶表面上形成透光表面。 本发明使光损失最小化，亮度提高，可以作为PCB类型批量生产，并采用EMC传递模塑，以减少不规则的颜色分布，从而提高光学质量。

公开(公告)号：USRE40112E1

公开(公告)日：2008-02-26

申请号：US10825670

申请日：2004-04-14

Applicant: Won Sun Shin ,  Do Sung Chun ,  Sang Ho Lee ,  Seon Goo Lee ,  Vincent DiCaprio

Inventor： Won Sun Shin ,  Do Sung Chun ,  Sang Ho Lee ,  Seon Goo Lee ,  Vincent DiCaprio

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1094 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed. An embodiment of a semiconductor package includes a semiconductor chip having a first major surface and a second major surface, the semiconductor chip being provided at the second major surface with a plurality of input/output pads; a circuit board including a resin substrate having a first major surface and a second major surface, a first circuit pattern formed at the first major surface and provided with a plurality of ball lands, a second circuit pattern formed at the second major surface and provided with a plurality of bond fingers connected with he ball lands by conductive via holes through the resin substrate, cover coats respectively coating the first and second circuit patterns while allowing the bond fingers and the ball lands to be exposed therethrough, and a central through hole adapted to receive the semiconductor chip therein; electrical conductors that electrically connect the input/output pads of the semiconductor chip with the bond fingers of the circuit board, respectively; a resin encapsulate that covers the semiconductor chip, the electrical conductors, and at least part of the circuit board; and, a plurality of conductive balls fused on the ball lands of the circuit board, respectively.

Abstract translation: 公开了具有能够容易地从包括在其中的半导体芯片放出热的薄结构的半导体封装以及制造这种半导体封装的方法。 半导体封装的实施例包括具有第一主表面和第二主表面的半导体芯片，所述半导体芯片在第二主表面处设置有多个输入/输出焊盘; 包括具有第一主表面和第二主表面的树脂基板的电路板，形成在第一主表面处并设置有多个球接头的第一电路图案，形成在第二主表面处并且设置有第二主表面的第二电路图案 通过导电通孔与树皮基板连接的多个粘结指状物，分别涂覆第一和第二电路图案的盖涂层，同时允许粘合指状物和球状区域暴露于其中;以及中心通孔，其适于 在其中接收半导体芯片; 电导体，其将半导体芯片的输入/输出焊盘电连接到电路板的键合指; 覆盖半导体芯片，电导体和电路板的至少一部分的树脂封装; 以及多个导电球分别熔合在电路板的球面上。

公开(公告)号：US08324646B2

公开(公告)日：2012-12-04

申请号：US12842493

申请日：2010-07-23

Applicant: Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

Inventor： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

Abstract translation: 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

公开(公告)号：US08169128B2

公开(公告)日：2012-05-01

申请号：US11500361

申请日：2006-08-08

Applicant: Seon Goo Lee ,  Chang Ho Song ,  Kyung Taeg Han

Inventor： Seon Goo Lee ,  Chang Ho Song ,  Kyung Taeg Han

IPC: H01J1/02

CPC classification number: H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.

Abstract translation: 本发明提供了一种包括LED芯片的LED封装。 在LED封装中，折叠的金属片的导热部分具有形成在其上的凹部，以将LED芯片置于其中。 包装体容纳导热部分，并将LED芯片产生的光向上引导。 此外，透明密封剂至少设置在导热部分的凹部上。 引线部分地由封装体容纳以向LED芯片供电。 根据本发明，折叠金属板以形成导热部分，并且在导热部分上形成凹部以将LED芯片置于其中。 这提高了反射效率并简化了整个过程。

公开(公告)号：US07903410B2

公开(公告)日：2011-03-08

申请号：US12010879

申请日：2008-01-30

Applicant: Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Min-Sang Lee ,  Seon-Goo Lee ,  Han-Seo Cho

Inventor： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Min-Sang Lee ,  Seon-Goo Lee ,  Han-Seo Cho

IPC: H05K7/20 ,  H01L23/34 ,  H01L33/00

CPC classification number: H01L23/3121 ,  H01L23/13 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L31/0203 ,  H01L33/64 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

Abstract translation: 公开了一种用于制造封装板的封装板和方法。 一种封装板，其包括第一金属层，堆叠在第一金属层上的隔热层，其间插入有第一绝缘层，形成在所述隔热层中的空腔，形成在所述空腔中的安装层 与第一绝缘层接触，安装在安装层上的第一部件和覆盖散热层和空腔的至少一部分的第二绝缘层可提供改进的散热和更小的厚度。

公开(公告)号：US07875476B2

公开(公告)日：2011-01-25

申请号：US12612268

申请日：2009-11-04

Applicant: Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

Inventor： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

IPC: H01L21/00

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

Abstract translation: LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

公开(公告)号：US20100109040A1

公开(公告)日：2010-05-06

申请号：US12684614

申请日：2010-01-08

Applicant: Seon Goo LEE ,  Kyung Taeg Han ,  Seong Yeon Han

Inventor： Seon Goo LEE ,  Kyung Taeg Han ,  Seong Yeon Han

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

公开(公告)号：US20090155938A1

公开(公告)日：2009-06-18

申请号：US12370194

申请日：2009-02-12

Applicant: Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

Inventor： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

IPC: H01L21/56

CPC classification number: H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

Abstract translation: 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

公开(公告)号：US20090087931A1

公开(公告)日：2009-04-02

申请号：US12204049

申请日：2008-09-04

Applicant: Seon Goo LEE ,  Geun Chang Ryo ,  Dong Yeoul Lee ,  Yong Tae Kim ,  Young Jae Song

Inventor： Seon Goo LEE ,  Geun Chang Ryo ,  Dong Yeoul Lee ,  Yong Tae Kim ,  Young Jae Song

IPC: H01L31/0203

CPC classification number: B29C45/14655 ,  B29C45/1671 ,  B29C45/34 ,  B29L2011/0016 ,  H01L2224/49107 ,  H01L2224/73265

Abstract: Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.

Abstract translation: 提供一种制造LED封装的方法，该方法包括制备模具，其包括上表面和具有外周表面和由外周表面包围的凹表面的下表面，模具具有从 上表面到下表面; 制备其中形成有发光部的基底; 形成在除了形成发光部的区域之外的基板的预定区域中的入口; 将模具定位在发光部分上; 通过将模塑料注入基座的入口来形成模具构件; 并移除模具。

公开(公告)号：US07156538B2

公开(公告)日：2007-01-02

申请号：US10953787

申请日：2004-09-30

Applicant: Kyung Taeg Han ,  Chan Wang Park ,  Seon Goo Lee

Inventor： Kyung Taeg Han ,  Chan Wang Park ,  Seon Goo Lee

IPC: F21V21/00

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: Disclosed herein is an LED package for a backlight unit. The LED package includes a plurality of LEDs, a die bonding part, a wire bonding part and a body. The die bonding part, on which the plurality of LEDs is arranged, allows the first electrodes of the LEDs to be electrically connected to an external circuit. The wire bonding part is spaced apart from the die bonding part by a predetermined distance to be insulated from the die bonding part and allows the second electrodes of the LEDs to be electrically connected to the external circuit so that the LEDs are operated. The body has a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged.

Abstract translation: 这里公开了一种用于背光单元的LED封装。 LED封装包括多个LED，芯片接合部，引线接合部和主体。 多个LED布置在其上的裸片接合部分允许LED的第一电极电连接到外部电路。 引线接合部与芯片接合部隔开预定距离，以与芯片接合部绝缘，并且允许LED的第二电极电连接到外部电路，使得LED被操作。 本体具有用于以透明树脂填充LED上方的空间的模制杯和芯片接合部分和引线接合部分布置在其上的基座。