公开(公告)号：US20150232983A1

公开(公告)日：2015-08-20

申请号：US14607359

申请日：2015-01-28

Applicant: Applied Materials, Inc.

Inventor： Brian WEST ,  Michael S. COX ,  Jeonghoon OH

IPC: C23C14/54 ,  C23C14/50

CPC classification number: C23C14/541 ,  C23C14/50 ,  C23C16/4586 ,  H01J37/3244 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109 ,  H01L23/34

Abstract: Embodiments of the present disclosure provides apparatus and method for stabilizing substrate temperature by flowing a flow of cooling gas to an inlet of cooling channels in a substrate support, receiving the flow of cooling gas from an outlet of the cooling channel using a heat exchanger, and releasing the cooling gas to an immediate environment, such as a cleanroom or a minienvironment.

Abstract translation: 本公开的实施例提供了用于通过将冷却气流流向衬底支撑件中的冷却通道的入口来稳定衬底温度的装置和方法，使用热交换器从冷却通道的出口接收冷却气体流;以及 将冷却气体释放到直接的环境中，例如洁净室或微小环境。

公开(公告)号：US20250073850A1

公开(公告)日：2025-03-06

申请号：US18811633

申请日：2024-08-21

Applicant: Applied Materials, Inc.

Inventor： Haosheng WU ,  Shou-Sung CHANG ,  Priscilla DIEP ,  Hui CHEN ,  Chih Chung CHOU ,  Jeonghoon OH ,  Jianshe TANG ,  Brian J. BROWN

IPC: B24B53/017 ,  H01L21/306

Abstract: A chemical mechanical polishing chamber may include a platen disposed within the chemical mechanical polishing chamber, the platen configured to support a polishing pad. The chamber may also include a slurry delivery arm configured to deliver a slurry to the polishing pad during a chemical mechanical polishing process. The chamber may include an arm may include one or more brackets, mechanically attached to an internal side of the chemical mechanical polishing chamber and positioned over the platen. The chamber may include a plurality of nozzles configured to deliver a gas to the polishing pad, the plurality of nozzles mechanically attached to the one or more brackets of the arm, each of the plurality of nozzles oriented such that an air gap is disposed between adjacent nozzles of the plurality of nozzles such that air may be pulled from the air gap and propelled with the gas towards the polishing pad.

公开(公告)号：US20240391056A1

公开(公告)日：2024-11-28

申请号：US18322928

申请日：2023-05-24

Applicant: Applied Materials, Inc.

Inventor： Nai-Chieh HUANG ,  Jianshe TANG ,  Shih-Haur SHEN ,  Akshay ARAVINDAN ,  Chih-Han YANG ,  Jay GURUSAMY ,  Jeonghoon OH ,  Steven M. ZUNIGA

IPC: B24B53/017

Abstract: Embodiments of the disclosure provided for a pad conditioner with multiple disks for chemical mechanical polishing. The pad conditioner includes a bearing ring connected to a lower portion of a shaft, an outer disk assembly connected to the lower portion of the shaft, the outer disk assembly, an outer disk flexure, a plurality of outer disks disposed on a bottom surface of the outer disk, and an inner disk assembly. Alternatively, the outer disk assembly includes a plurality of outer disk holders, an outer disk connector connecting the plurality of outer disk holders, and a plurality of outer disks disposed on a bottom surface of the outer disk holders. The inner disk assembly includes a flexure connected to the outer disk assembly, the inner disk assembly, and the shaft. The pad conditioner may include a spherical bearing assembly coupled to a lower portion of the shaft.

公开(公告)号：US20220375734A1

公开(公告)日：2022-11-24

申请号：US17327955

申请日：2021-05-24

Applicant: Applied Materials, Inc.

Inventor： Soundarrajan JEMBULINGAM ,  Jian Janson CHEN ,  Jeonghoon OH

IPC: H01J37/34 ,  C23C14/34

Abstract: Methods and apparatus for processing a substrate using improved shield configurations are provided herein. For example, a process kit for use in a physical vapor deposition chamber comprises a shield comprising an inner wall comprising an upper portion having a first wavy fin configuration and a bottom portion having a second wavy fin configuration different from the first wavy fin configuration such that a surface area of the shield is about 1400 in2 to about 1410 in2.

公开(公告)号：US20220097202A1

公开(公告)日：2022-03-31

申请号：US17034541

申请日：2020-09-28

Applicant: Applied Materials, Inc.

Inventor： Uday PAI ,  Jeonghoon OH ,  Van H. NGUYEN

IPC: B24B37/32

Abstract: Apparatus and methods relating to chemical mechanical polishing (CMP) are described herein. An edge load ring (ELR) is configured to fit inside a retaining ring of a CMP head. The ELR includes an annular body having an inner surface and an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside a retaining ring. The annular body includes a body portion formed from a first material and a bottom projection extending below the body portion. The bottom projection has a bottom surface facing away from the body portion, and the bottom projection is formed form a second material different from the first material. The annular body includes a venting feature formed through the annular body, the venting feature being in fluid communication between the inner and outer surfaces.

公开(公告)号：US20220016739A1

公开(公告)日：2022-01-20

申请号：US17365848

申请日：2021-07-01

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon OH ,  Ashish BHUSHAN ,  Jamie Stuart LEIGHTON ,  John Anthony GARCIA ,  Stephen Thomas CORMIER ,  Nick Joseph JACKSON ,  Manoj BALAKUMAR ,  Nandkishore PATIDAR

IPC: B24B37/015

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing systems (CMP) systems and processes used in the manufacturing of electronic devices. In particular, embodiments herein relate to methods of detecting non-conforming substrate processing events during a polishing process. In one embodiment, a method of processing a substrate on a polishing system includes urging a surface of a silicon carbide substrate against a polishing pad in the presence of a polishing fluid, determining a temperature of the polishing pad using a temperature sensor that is positioned above the platen, monitoring the temperature of the polishing pad, and, if the change in polishing pad temperature reaches a threshold value, initiating a response using a controller of the polishing system.

公开(公告)号：US20200282506A1

公开(公告)日：2020-09-10

申请号：US16882154

申请日：2020-05-22

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Chih Chung CHOU ,  Charles C. GARRETSON ,  Jeonghoon OH ,  King Yi HEUNG

IPC: B24B7/22 ,  B24B13/005 ,  B24B37/07 ,  B24B49/10 ,  H01L21/3105 ,  H01L21/321

Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.

公开(公告)号：US20190105754A1

公开(公告)日：2019-04-11

申请号：US16210859

申请日：2018-12-05

Applicant: Applied Materials, Inc.

Inventor： David Masayuki ISHIKAWA ,  Jeonghoon OH ,  Garrett Ho Yee SIN ,  Charles C. GARRETSON ,  Huanbo ZHANG ,  Chia-Ling PAI ,  Niraj PRASAD ,  Julio David MUZQUIZ

IPC: B24B37/32

Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.

公开(公告)号：US20240253183A1

公开(公告)日：2024-08-01

申请号：US18401306

申请日：2023-12-29

Applicant: Applied Materials, Inc.

Inventor： Priscilla Michelle Diep LAROSA ,  Haosheng WU ,  Jimin ZHANG ,  Taketo SEKINE ,  Chen-Wei CHANG ,  Jianshe TANG ,  Brian J. BROWN ,  Wei LU ,  Ekaterina A. MIKHAYLICHENKO ,  Huanbo ZHANG ,  Jeonghoon OH ,  Eric LAU ,  Andrew NAGENGAST ,  Takashi FUJIKAWA ,  Thomas H. OSTERHELD ,  Steven M. ZUNIGA

IPC: B24B57/02 ,  B24B37/015 ,  B24B53/017

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B53/017

Abstract: A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense fluid, such as a polishing fluid or water, and/or provide a vacuum pressure. The second fluid delivery arm is configured to dispense a fluid or vacuum pressure onto the polishing pad to effect the polishing rate at the edge of the substrate.

公开(公告)号：US20240066664A1

公开(公告)日：2024-02-29

申请号：US18363545

申请日：2023-08-01

Applicant: Applied Materials, Inc.

Inventor： Shou-Sung CHANG ,  Hui CHEN ,  Haosheng WU ,  Jianshe TANG ,  Sidney P. HUEY ,  Jeonghoon OH ,  Chad POLLARD ,  Chih Chung CHOU ,  Sameer A. DESHPANDE

IPC: B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

CPC classification number: B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

Abstract: The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad. The pad surface cleaning system may be used to spray the polishing surface with a high-pressure fluid spray to loosen debris from the polishing surface. The pad surface cleaning system may also be used to remove the loosened debris. Further, the pad surface cleaning system may isolate a conditioning disk from a polishing fluid to protect the conditioning disk from reacting with the polishing fluid.