中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

21 records (took 0.02 seconds)

    EMBEDDED PACKAGE ON PACKAGE SYSTEMS
    12.
    发明申请
    EMBEDDED PACKAGE ON PACKAGE SYSTEMS 审中-公开
    封装系统上的嵌入式封装

    公开(公告)号：US20140210111A1

    公开(公告)日：2014-07-31

    申请号：US13750169

    申请日：2013-01-25

    Applicant: APPLE INC.

    Inventor： Chih-Ming Chung

    IPC: H01L23/34 ,  H01L21/56

    CPC classification number: H01L23/34 ,  H01L21/56 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/562 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/37001

    Abstract: In some embodiments, a semiconductor device package assembly may include a substrate. The substrate may include a first surface, a second surface substantially opposite of the first surface, and a first set of electrical conductors coupled to the first surface. The first set of electrical conductors may function to electrically connect the substrate. The second surface may include a die electrically coupled to the second surface. In some embodiments, the semiconductor device package may include an electrically insulating material covering at least a portion of the second surface and the die. The electrically insulating material may include a dielectric polymer. The dielectric polymer may function to inhibit deformation of the package during use. The dielectric polymer may include a coefficient of thermal expansion of between about 5 to about 15 ppm/° C. The dielectric polymer may include a modulus of between about 15 to about 25 Gpa.

    Abstract translation: 在一些实施例中，半导体器件封装组件可以包括衬底。 衬底可以包括第一表面，与第一表面基本相反的第二表面，以及耦合到第一表面的第一组电导体。 第一组电导体可以用于电连接衬底。 第二表面可以包括电耦合到第二表面的管芯。 在一些实施例中，半导体器件封装可以包括覆盖第二表面和裸片的至少一部分的电绝缘材料。 电绝缘材料可以包括电介质聚合物。 介电聚合物可用于在使用期间抑制包装的变形。 介电聚合物可以包括约5至约15ppm /℃的热膨胀系数。介电聚合物可以包括约15至约25Gpa的模量。

    THERMALLY ENHANCED PACKAGE-ON-PACKAGE STRUCTURE
    18.
    发明申请
    THERMALLY ENHANCED PACKAGE-ON-PACKAGE STRUCTURE 有权
    热增强包装封装结构

    公开(公告)号：US20160013155A1

    公开(公告)日：2016-01-14

    申请号：US14328127

    申请日：2014-07-10

    Applicant: Apple Inc.

    Inventor： Chih-Ming Chung

    IPC: H01L25/065 ,  H01L21/48 ,  H01L23/552 ,  H01L23/367 ,  H01L25/00

    CPC classification number: H01L25/0657 ,  H01L21/4889 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/552 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06537 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81

    Abstract: In some embodiments, a semiconductor device package may include a semiconductor device package on package assembly. The package on package assembly may include a first package, a second package, and a shield. The first package may include a first surface, a second surface substantially opposite the first surface, a first die, and a first set of electrical conductors coupled to the first surface and configured to electrically connect the package on package assembly. The second package may include a third surface and a fourth surface substantially opposite the third surface, and a second die. The third surface may be coupled to the second surface. The first package may be electrically coupled to the second package. The shield may be applied to the fourth surface of the semiconductor device package assembly. In some embodiments, the shield may transfer, during use, heat from the first die.

    Abstract translation: 在一些实施例中，半导体器件封装可以包括在封装组件上的半导体器件封装。 封装组件上的封装可以包括第一封装，第二封装和屏蔽。 第一封装可以包括第一表面，基本上与第一表面相对的第二表面，第一管芯和耦合到第一表面的第一组电导体，并且被配置为电连接封装组件上的封装。 第二包装可以包括基本上与第三表面相对的第三表面和第四表面，以及第二管芯。 第三表面可以联接到第二表面。 第一封装可以电耦合到第二封装。 屏蔽可以施加到半导体器件封装组件的第四表面。 在一些实施例中，屏蔽件可以在使用期间传递来自第一管芯的热量。

Patent Agency Ranking