公开(公告)号：US09190343B1

公开(公告)日：2015-11-17

申请号：US14555565

申请日：2014-11-26

Applicant: You Ge ,  Meng Kong Lye ,  Zhijie Wang

Inventor： You Ge ,  Meng Kong Lye ,  Zhijie Wang

IPC: H01L23/34 ,  H01L21/50 ,  H01L23/433 ,  H01L21/56

CPC classification number: H01L23/4334 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L2224/05554 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged semiconductor device having an integrated circuit (IC) die, a flexible tube, and a metal slug. During assembly, a first end of the tube is mounted on a surface of the IC die and a second end of the tube extends away from the die surface. The exposed portions of the surface of the IC die are encased in a molding compound, which also encases the perimeter of the tube. After molding, the tube may be filled with metal to improve conduction of heat away from the die top. If the tube is formed of a soft material like rubber then the tube will not damage the die top during attachment thereto.

Abstract translation: 具有集成电路（IC）裸片，柔性管和金属片的封装半导体器件。 在组装期间，管的第一端安装在IC模具的表面上，并且管的第二端远离模具表面延伸。 IC模具的表面的暴露部分被封装在也包围管的周边的模制化合物中。 在模制之后，管可以用金属填充以改善热量远离模具顶部的传导。 如果管子是由软质材料形成的橡胶，那么管子在附着时不会损坏模具顶部。

公开(公告)号：US20150243623A1

公开(公告)日：2015-08-27

申请号：US14551070

申请日：2014-11-23

Applicant: Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

Inventor： Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

IPC: H01L23/00 ,  H01L23/29 ,  H01L21/56

CPC classification number: H01L24/17 ,  H01L23/3128 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/11 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/85401 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/15173 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: A grid array assembly is formed from an electrical insulating material with embedded solder deposits. A first portion of each of the solder deposits is exposed on a first surface of the insulating material and a second portion of each of the solder deposits is exposed on an opposite surface of the insulating material. A semiconductor die is mounted to the first surface of the insulating material and electrodes of the die are connected to the solder deposits with bond wires. The die, bond wires, and the first surface of the insulating material then are covered with a protective encapsulating material.

Abstract translation: 栅极阵列组件由具有嵌入式焊料沉积物的电绝缘材料形成。 每个焊料沉积物的第一部分暴露在绝缘材料的第一表面上，并且每个焊料沉积物的第二部分暴露在绝缘材料的相对表面上。 将半导体管芯安装在绝缘材料的第一表面上，并且将管芯的电极与焊丝连接到焊料沉积物上。 然后用保护性封装材料覆盖管芯，接合线和绝缘材料的第一表面。

公开(公告)号：US20110174865A1

公开(公告)日：2011-07-21

申请号：US13072930

申请日：2011-03-28

Applicant: Michael T. Deley ,  Zhijie Wang ,  Peter M. Lister ,  Deepak Sood

Inventor： Michael T. Deley ,  Zhijie Wang ,  Peter M. Lister ,  Deepak Sood

IPC: B23K31/12 ,  G06K9/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78901 ,  H01L2224/85121 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  Y10S228/904 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/05556 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract translation: 提供了一种教导用于引线键合操作的眼点的方法。 该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或 （b）与半导体器件相关的预定数据。 教学步骤包括相对于彼此定义每个形状的位置。

公开(公告)号：US07887928B2

公开(公告)日：2011-02-15

申请号：US12129686

申请日：2008-05-30

Applicant: Chao Wang ,  Qing Chun He ,  Zhe Li ,  Zhijie Wang ,  Dehong Ye

Inventor： Chao Wang ,  Qing Chun He ,  Zhe Li ,  Zhijie Wang ,  Dehong Ye

IPC: B32B15/01 ,  C25D5/48

CPC classification number: H01L21/4835 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85001 ,  H01L2224/85011 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01007 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  Y10T428/12014 ,  Y10T428/12493 ,  Y10T428/12646 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A lead frame having a coating of organic compounds on its lead fingers prevents tin and flux from contaminating the lead fingers after die attach. The coating is removed prior to wire bonding. The coating allows for reliable second bonds (bond between wires and lead fingers) to be formed, decreasing the likelihood of non-stick and improving wire peel strength.

Abstract translation: 引线框架在其引线上具有有机化合物的涂层，防止锡和焊剂在芯片附着后污染铅指。 在引线接合之前去除涂层。 该涂层允许形成可靠的第二结合（电​​线和引线指之间的结合），降低不粘的可能性并提高线剥离强度。

公开(公告)号：US20100248426A1

公开(公告)日：2010-09-30

申请号：US12727258

申请日：2010-03-19

Applicant: Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

Inventor： Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

IPC: H01L21/78 ,  H01L21/56 ,  H01L21/306

CPC classification number: H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83099 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.

Abstract translation: 芯片引线封装半导体器件的组装方法包括以下步骤：安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤，这大大提高了引线接合质量和第二成型质量。 此外，由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题，所以避免了环氧树脂和模具之间的脱层危险。

公开(公告)号：US20090111220A1

公开(公告)日：2009-04-30

申请号：US12129686

申请日：2008-05-30

Applicant: Chao Wang ,  Qing Chun He ,  Zhe Li ,  Zhijie Wang ,  Dehong Ye

Inventor： Chao Wang ,  Qing Chun He ,  Zhe Li ,  Zhijie Wang ,  Dehong Ye

IPC: H01L23/52 ,  H01L23/49 ,  B05D3/02 ,  H01L23/495

CPC classification number: H01L21/4835 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85001 ,  H01L2224/85011 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01007 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  Y10T428/12014 ,  Y10T428/12493 ,  Y10T428/12646 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A lead frame having a coating of organic compounds on its lead fingers prevents tin and flux from contaminating the lead fingers after die attach. The coating is removed prior to wire bonding. The coating allows for reliable second bonds (bond between wires and lead fingers) to be formed, decreasing the likelihood of non-stick and improving wire peel strength.

Abstract translation: 引线框架在其引线上具有有机化合物的涂层，防止锡和焊剂在芯片附着后污染铅指。 在引线接合之前去除涂层。 该涂层允许形成可靠的第二结合（电​​线和引线指之间的结合），降低不粘的可能性并提高线剥离强度。

公开(公告)号：US20090021816A1

公开(公告)日：2009-01-22

申请号：US11853815

申请日：2007-09-12

Applicant: Xin Simon Luo ,  Pei Chuang Chen ,  Leming Wang ,  Zhijie Wang

Inventor： Xin Simon Luo ,  Pei Chuang Chen ,  Leming Wang ,  Zhijie Wang

IPC: G02B26/08

CPC classification number: G02B26/0833 ,  G02B6/4222 ,  G02B6/4225 ,  G02B6/4249

Abstract: An apparatus and method steer a light through a lens into a receiving port via a steering device. The steering device is located between the lens and a light source. A feedback mechanism adjusts the steering device to correct for aberration.

Abstract translation: 一种装置和方法通过转向装置将光通过透镜转向接收端口。 转向装置位于透镜和光源之间。 反馈机构调整转向装置以校正像差。

公开(公告)号：US20150294929A1

公开(公告)日：2015-10-15

申请号：US14552491

申请日：2014-11-25

Applicant: Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

Inventor： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L21/565 ,  H01L21/4839 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15156 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: A semiconductor die package is assembled from a lead frame having lead fingers with a bonding end adjacent a die flag, and an elongate region extending away from the die flag. A semiconductor die is mounted on the die flag and electrodes of the semiconductor die are electrically connected to the bonding ends with bond wires. Each elongate region is bent into an external connector lead with mounting feet. The elongate region of each of the lead fingers protrudes from a housing formed from a mold compound. The mold compound extends from the housing to provide insulated support fingers molded to the external connector leads.

Abstract translation: 半导体管芯封装由具有引线指的引线框架组装，引线框具有邻近管芯标记的结合端，以及远离管芯标记延伸的细长区域。 半导体管芯安装在管芯标记上，半导体管芯的电极通过接合线与接合端电连接。 每个细长区域被弯曲成具有安装脚的外部连接器引线。 每个引线指的细长区域从由模具化合物形成的壳体突出。 模具化合物从壳体延伸，以提供模制到外部连接器引线的绝缘支撑指。

公开(公告)号：US08642395B2

公开(公告)日：2014-02-04

申请号：US12727258

申请日：2010-03-19

Applicant: Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

Inventor： Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

IPC: H01L21/60 ,  H01L21/56 ,  H01L33/62

CPC classification number: H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83099 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.

Abstract translation: 芯片引线封装半导体器件的组装方法包括以下步骤：安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤，这大大提高了引线接合质量和第二成型质量。 此外，由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题，所以避免了环氧树脂和模具之间的脱层危险。

公开(公告)号：US08198737B2

公开(公告)日：2012-06-12

申请号：US12510274

申请日：2009-07-28

Applicant: Changliang Zhang ,  Yingwei Jiang ,  Zhijie Wang ,  Wei Xiao

Inventor： Changliang Zhang ,  Yingwei Jiang ,  Zhijie Wang ,  Wei Xiao

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48489 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00

Abstract: A method of forming a wire bond in a semiconductor device includes forming a first bump of a first composition proximate to a probe mark on a bond pad. A second bump of the first composition is formed adjacent to the first bump such that the first and second bumps are formed away from the probe mark. A wire of a second composition that is harder than the first composition is attached on top of the first and second bumps to form an interconnection.

Abstract translation: 在半导体器件中形成引线接合的方法包括在接合焊盘上形成靠近探针标记的第一组合物的第一凸点。 第一组合物的第二凸起形成为与第一凸起相邻，使得第一和第二凸块形成为远离探针标记。 比第一组合物硬的第二组合物的导线附接在第一和第二凸块的顶部上以形成互连。