-
公开(公告)号：US09899226B2
公开(公告)日：2018-02-20
申请号：US14658121
申请日：2015-03-13
Inventor： Ho Kyun Ahn , Hae Cheon Kim , Jong Won Lim , Dong Min Kang , Yong Hwan Kwon , Seong Il Kim , Zin Sig Kim , Eun Soo Nam , Byoung Gue Min , Hyung Sup Yoon , Kyung Ho Lee , Jong Min Lee , Kyu Jun Cho
IPC: H01L29/40 , H01L21/28 , H01L29/423 , H01L29/66 , H01L29/778 , H01L29/51 , H01L29/20 , H01L29/45
CPC classification number: H01L21/28264 , H01L29/2003 , H01L29/407 , H01L29/42316 , H01L29/4236 , H01L29/452 , H01L29/51 , H01L29/513 , H01L29/517 , H01L29/518 , H01L29/66462 , H01L29/7786
Abstract: Provided herein is a semiconductor device including a substrate; an active layer formed on top of the substrate; a protective layer formed on top of the active layer and having a first aperture; a source electrode, driving gate electrode and drain electrode formed on top of the protective layer; and a first additional gate electrode formed on top of the first aperture, wherein an electric field is applied to the active layer, protective layer and driving gate electrode due to a voltage applied to each of the source electrode, drain electrode and driving gate electrode, and the first additional gate electrode is configured to attenuate a size of the electric field applied to at least a portion of the active layer, protective layer and driving gate electrode.
-
公开(公告)号：US09224830B2
公开(公告)日：2015-12-29
申请号：US13914713
申请日：2013-06-11
Inventor： Seong-Il Kim , Jong-Won Lim , Dong Min Kang , Sang-Heung Lee , Hyung Sup Yoon , Chull Won Ju , Byoung-Gue Min , Jongmin Lee , Jae Kyoung Mun , Eun Soo Nam
IPC: H01L29/812 , H01L29/66 , H01L29/40 , H01L29/41 , H01L29/423 , H01L29/778 , H01L29/16 , H01L29/20
CPC classification number: H01L29/66477 , H01L29/1608 , H01L29/2003 , H01L29/40 , H01L29/401 , H01L29/402 , H01L29/41 , H01L29/42312 , H01L29/42316 , H01L29/42376 , H01L29/66462 , H01L29/7787 , H01L29/812
Abstract: A field effect transistor is provided. The transistor may include a source electrode and a drain electrode provided spaced apart from each other on a substrate and a ‘+’-shaped gate electrode provided on a portion of the substrate located between the source and drain electrodes.
Abstract translation: 提供场效应晶体管。 晶体管可以包括在基板上彼此间隔开设置的源电极和漏电极，以及设置在位于源极和漏极之间的基板的一部分上的“+”形栅电极。
-
公开(公告)号：US08901608B2
公开(公告)日：2014-12-02
申请号：US13908076
申请日：2013-06-03
Inventor： Jong-Won Lim , Hokyun Ahn , Woojin Chang , Dong Min Kang , Seong-Il Kim , Sang-Heung Lee , Hyung Sup Yoon , Chull Won Ju , Hae Cheon Kim , Jae Kyoung Mun , Eun Soo Nam
IPC: H01L33/00 , H01L29/66 , H01L29/778
CPC classification number: H01L29/778 , H01L29/402 , H01L29/42316 , H01L29/66431
Abstract: A high electron mobility transistor includes a T-type gate electrode disposed on a substrate between source and drain electrodes and insulating layers disposed between the substrate and the T-type gate electrode. The insulating layers include first, second, and third insulating layers. The third insulating layer is disposed between the substrate and a head portion of the T-type gate electrode such that a portion of the third insulating layer is in contact with a foot portion of the T-type gate electrode. The second insulating layer is disposed between the substrate and the head portion of the T-type gate electrode to be in contact with the third insulating layer. The first insulating layer and another portion of the third insulating layer are sequentially stacked between the substrate and the head portion of the T-type gate electrode to be in contact with the second insulating layer.
Abstract translation: 高电子迁移率晶体管包括设置在源极和漏极之间的衬底上的T型栅电极和设置在衬底和T型栅电极之间的绝缘层。 绝缘层包括第一绝缘层，第二绝缘层和第三绝缘层。 第三绝缘层设置在基板和T型栅电极的头部之间，使得第三绝缘层的一部分与T型栅极的脚部接触。 第二绝缘层设置在基板与T型栅电极的头部之间以与第三绝缘层接触。 所述第一绝缘层和所述第三绝缘层的另一部分依次层叠在所述基板与所述T型栅电极的头部之间，以与所述第二绝缘层接触。
-
公开(公告)号：US09837719B2
公开(公告)日：2017-12-05
申请号：US15229891
申请日：2016-08-05
Inventor： Dong-Young Kim , Dong Min Kang , Seong-Il Kim , Hae Cheon Kim , Jae Won Do , Byoung-Gue Min , Ho Kyun Ahn , Hyung Sup Yoon , Sang-Heung Lee , Jong Min Lee , Jong-Won Lim , Yoo Jin Jang , Hyun Wook Jung , Kyu Jun Cho , Chull Won Ju
CPC classification number: H01Q9/0407 , H01Q1/50 , H01Q9/0442
Abstract: Provided herein is a patch antenna including a multilayered substrate on which a plurality of dielectric layers are laminated; at least one metal pattern layer disposed between the plurality of dielectric layers outside a central area of the multilayered substrate; an antenna patch disposed on an upper surface of the multilayered substrate and within the central area; a ground layer disposed on a lower surface of the multilayered substrate; a plurality of connection via patterns penetrating the plurality of dielectric layers to connect the metal pattern layer and the ground layer, and surrounding the central area; a transmission line comprising a first transmission line unit disposed on the upper surface of the multilayered substrate and located outside the central area, and a second transmission line unit disposed on the upper surface of the multilayered substrate and located within the central area; and an impedance transformer located below the second transmission line unit within the central area of the multilayered substrate.
-
公开(公告)号：US20140167806A1
公开(公告)日：2014-06-19
申请号：US14020931
申请日：2013-09-09
Inventor： Chul Won JU , Hyung Sup Yoon , Jong-Won Lim , Sang-Heung Lee , Seong-il Kim , Dong Min Kang , Eun Soo Nam , Jae Kyoung Mun
IPC: G01R1/04
CPC classification number: G01R1/0466 , G01R1/0458
Abstract: Provided is a semiconductor device testing apparatus including a first socket configured to load a package, on which a semiconductor device to be tested may be mounted, and a second socket coupled to the first socket. The first socket may include an upper part including a hole configured to accommodate the package and a terminal pad provided at both side edges of the hole to hold input and output terminals of the package, and a lower part including a heating room, in which a heater and a temperature sensing part may be provided, the heater being configured to heat the semiconductor device and the temperature sensing part being configured to measure temperature of the semiconductor device. The second socket may include a probe card with a pattern that may be configured to receive test signals from an external power source.
Abstract translation: 提供一种半导体器件测试装置，包括：第一插座，被配置为加载可以安装待测试的半导体器件的封装，以及耦合到第一插座的第二插座。 第一插座可以包括上部，其包括被配置为容纳封装的孔和设置在孔的两个侧边缘处的端子垫，以保持封装的输入和输出端子，以及包括加热室的下部，其中 加热器和温度检测部件，加热器被配置为加热半导体器件，并且温度检测部分被配置为测量半导体器件的温度。 第二插座可以包括具有可被配置为从外部电源接收测试信号的模式的探针卡。
-
Patent Agency Ranking
公开(公告)号：US20130169365A1
公开(公告)日：2013-07-04
申请号：US13670016
申请日：2012-11-06
Inventor： Sang-Heung LEE , Seong-Il Kim , Dong Min Kang , Jong-Won Lim , Hyung Sup Yoon , Chull Won Ju , Jae Kyoung Mun , Eun Soo Nam
IPC: H03G3/00
CPC classification number: H03G1/0082 , H03G1/0088 , H03G3/3084
Abstract: Disclosed is an automatic gain control feedback amplifier that can arbitrarily control a gain even when a difference in input signal is large. The automatic gain control feedback amplifier includes: an amplification circuit unit configured to amplify voltage input from an input terminal and output the amplified voltage to an output terminal; a feedback circuit unit connected between the input terminal and the output terminal and including a feedback resistor unit of which a total resistance value is determined by one or more control signals and a feedback transistor connected to the feedback resistor unit in parallel; and a bias circuit unit configured to supply predetermined bias voltage to the feedback transistor.
Abstract translation: 公开了一种自动增益控制反馈放大器，即使当输入信号的差异大时也可以任意地控制增益。 自动增益控制反馈放大器包括：放大电路单元，被配置为放大从输入端输入的电压，并将放大的电压输出到输出端; 连接在输入端子和输出端子之间的反馈电路单元，包括反馈电阻器单元，其总电阻值由一个或多个控制信号确定，反馈晶体管并联连接到反馈电阻器单元; 以及偏置电路单元，被配置为向所述反馈晶体管提供预定的偏置电压。
-
公开(公告)号：US11955961B2
公开(公告)日：2024-04-09
申请号：US17879047
申请日：2022-08-02
Inventor： Hong Gu Ji , Dong Min Kang , Byoung-Gue Min , Jongmin Lee , Kyu Jun Cho
IPC: H03K3/00 , H03K17/687 , H03K17/693
CPC classification number: H03K17/687
Abstract: Disclosed is a switch circuit for an ultra-high frequency band, which includes a transistor including a first terminal connected to an input stage, a second terminal connected to an output stage, and a gate terminal, an inductor connected to the transistor in parallel, between the input stage and the output stage, a variable gate driver to apply a gate input voltage to the gate terminal and, an input resistor connected between the variable gate driver and the gate terminal. The variable gate driver adjusts the gate input voltage to be in one of a first voltage level for turning on the transistor and a second voltage level for turning off the transistor. The second voltage level varies depending on a capacitance between the first terminal and the second terminal, when the transistor is in a turn-off state.
-
公开(公告)号：US11817826B2
公开(公告)日：2023-11-14
申请号：US17886061
申请日：2022-08-11
Inventor： Woojin Chang , Dong Min Kang , Byoung-Gue Min , Jong Yul Park , Jongmin Lee , Yoo Jin Jang , Kyu Jun Cho , Hong Gu Ji
Abstract: Disclosed is a frequency mixer. The frequency mixer includes a first matching circuit that generates a matched local oscillator (LO) signal based on an LO signal, a non-linear circuit that generates a non-linear LO signal based on the matched LO signal, a second matching circuit that generates a matched radio frequency (RF) signal based on an RF signal, a mixing circuit that generates a mixed signal based on a mixing of the non-linear LO signal and the matched RF signal, a third matching circuit that generates an intermediate frequency (IF) signal based on the mixed signal, wherein the non-linear circuit includes a non-linear transistor, a bias transistor, and an internal matching circuit connected in series.
-
公开(公告)号：US10134854B2
公开(公告)日：2018-11-20
申请号：US15248676
申请日：2016-08-26
Inventor： Ho Kyun Ahn , Dong Min Kang , Yong-Hwan Kwon , Dong-Young Kim , Seong Il Kim , Hae Cheon Kim , Eun Soo Nam , Jae Won Do , Byoung-Gue Min , Hyung Sup Yoon , Sang-Heung Lee , Jong Min Lee , Jong-Won Lim , Hyun Wook Jung , Kyu Jun Cho
IPC: H01L29/40 , H01L29/20 , H01L29/205 , H01L29/778 , H01L29/66
Abstract: A high electron mobility transistor includes a substrate including a first surface and a second surface facing each other and having a via hole passing through the first surface and the second surface, an active layer on the first surface, a cap layer on the active layer and including a gate recess region exposing a portion of the active layer, a source electrode and a drain electrode on one of the cap layer and the active layer, an insulating layer on the source electrode and the drain electrode and having on opening corresponding to the gate recess region to expose the gate recess region, a first field electrode on the insulating layer, a gate electrode electrically connected to the first field electrode on the insulating layer, and a second field electrode on the second surface and contacting the active layer through the via hole.
-
公开(公告)号：US09634112B2
公开(公告)日：2017-04-25
申请号：US14633984
申请日：2015-02-27
Inventor： Hyung Sup Yoon , Byoung-Gue Min , Jong-Won Lim , Hokyun Ahn , Seong-Il Kim , Sang Heung Lee , Dong Min Kang , Chull Won Ju , Jae Kyoung Mun
IPC: H01L29/66 , H01L29/778 , H01L29/40 , H01L29/423 , H01L29/20 , H01L21/02 , H01L21/28 , H01L21/311 , H01L29/201 , H01L29/205 , H01L21/285
CPC classification number: H01L29/66462 , H01L21/02118 , H01L21/0217 , H01L21/02178 , H01L21/0254 , H01L21/28264 , H01L21/28593 , H01L21/31111 , H01L21/31144 , H01L29/2003 , H01L29/201 , H01L29/205 , H01L29/404 , H01L29/42316 , H01L29/42376 , H01L29/778 , H01L29/7786
Abstract: A field effect transistor is provided. The field effect transistor may include a capping layer on a substrate, a source ohmic electrode and a drain ohmic electrode on the capping layer, a first insulating layer and a second insulating layer stacked on the capping layer to cover the source and drain ohmic electrodes, a Γ-shaped gate electrode including a leg portion and a head portion, the leg portion being connected to the substrate between the source ohmic electrode and the drain ohmic electrode, and the head portion extending from the leg portion to cover a top surface of the second insulating layer, a first planarization layer on the second insulating layer to cover the Γ-shaped gate electrode, and a first electrode on the first planarization layer, the first electrode being connected to the source ohmic electrode or the drain ohmic electrode.
-
-
-
-
-
-
-
-
-
Search Results
24
records
(took 0.018 seconds)
