Feedback amplifier
    3.
    发明授权
    Feedback amplifier 有权
    反馈放大器

    公开(公告)号:US09178474B2

    公开(公告)日:2015-11-03

    申请号:US13950895

    申请日:2013-07-25

    摘要: Provided is a feedback amplifier. The feedback amplifier includes: an amplification circuit unit amplifying a burst packet signal inputted from an input terminal and outputting the amplified voltage to an output terminal; a feedback circuit unit disposed between the input terminal and the output terminal and controlling whether to apply a fixed resistance value to a signal outputted to the output terminal; a packet signal detection unit detecting a peak value of a burst packet signal from the output terminal and controlling whether to apply the fixed resistance value; and a bias circuit unit generating a bias voltage, wherein the feedback circuit unit determines a feedback resistance value to change the fixed resistance value in response to at least one control signal and adjusts a gain by receiving the bias voltage.

    摘要翻译: 提供反馈放大器。 反馈放大器包括:放大电路单元,放大从输入端子输入的突发分组信号,并将放大的电压输出到输出端子; 反馈电路单元,设置在所述输入端子和所述输出端子之间,并且控制是否对输出到所述输出端子的信号施加固定电阻值; 分组信号检测单元,检测来自输出端的突发分组信号的峰值,并控制是否应用固定电阻值; 以及产生偏置电压的偏置电路单元,其中所述反馈电路单元确定反馈电阻值以响应于至少一个控制信号改变所述固定电阻值,并且通过接收所述偏置电压来调整增益。

    SEMICONDUCTOR DEVICE TESTING APPARATUS
    5.
    发明申请
    SEMICONDUCTOR DEVICE TESTING APPARATUS 审中-公开
    半导体器件测试装置

    公开(公告)号:US20140167806A1

    公开(公告)日:2014-06-19

    申请号:US14020931

    申请日:2013-09-09

    IPC分类号: G01R1/04

    CPC分类号: G01R1/0466 G01R1/0458

    摘要: Provided is a semiconductor device testing apparatus including a first socket configured to load a package, on which a semiconductor device to be tested may be mounted, and a second socket coupled to the first socket. The first socket may include an upper part including a hole configured to accommodate the package and a terminal pad provided at both side edges of the hole to hold input and output terminals of the package, and a lower part including a heating room, in which a heater and a temperature sensing part may be provided, the heater being configured to heat the semiconductor device and the temperature sensing part being configured to measure temperature of the semiconductor device. The second socket may include a probe card with a pattern that may be configured to receive test signals from an external power source.

    摘要翻译: 提供一种半导体器件测试装置,包括:第一插座,被配置为加载可以安装待测试的半导体器件的封装,以及耦合到第一插座的第二插座。 第一插座可以包括上部,其包括被配置为容纳封装的孔和设置在孔的两个侧边缘处的端子垫,以保持封装的输入和输出端子,以及包括加热室的下部,其中 加热器和温度检测部件,加热器被配置为加热半导体器件,并且温度检测部分被配置为测量半导体器件的温度。 第二插座可以包括具有可被配置为从外部电源接收测试信号的模式的探针卡。