TECHNOLOGIES FOR A CONFIGURABLE PROCESSOR MODULE

    公开(公告)号:US20190141845A1

    公开(公告)日:2019-05-09

    申请号:US16220631

    申请日:2018-12-14

    Abstract: A configurable processor module includes a central processing unit (CPU) package mounted to a CPU substrate, which may be mounted to a circuit board substrate. The CPU substrate may include physical resources usable by the CPU package, which may not be included or duplicated on the circuit board substrate. As such, features of the CPU package that are unavailable on the circuit board substrate may be available on the CPU substrate. Additionally, the CPU substrate and physical resources may be selected and designed so as to provide varying levels of functionality across different compute devices that use the same type of CPU package.

    Integrated android and windows device

    公开(公告)号:US10922148B2

    公开(公告)日:2021-02-16

    申请号:US16091206

    申请日:2016-04-26

    Abstract: Techniques for implementing assess to Android applications and native Window application on Android devices and systems. A processor board includes a processor that is configured to run a full version of a Windows operating system and Windows applications. The processor board is configured to be communicatively coupled to the processor board in an Android device, such as a Smartphone or tablet. Upon operations and when the processor board is communicatively coupled to the Android device, a user of the Android device is enabled to selectively run Android applications and Windows applications, with the Windows applications being executed natively on the processor board. The processor board may be implemented in a computing card that is approximately the size of a credit card or smaller, which in turn may be coupled to the Android device via a backpack or similar means. The processor board may also be disposed within the same housing as the Android device.

    Technologies for flexible protocol acceleration

    公开(公告)号:US10884968B2

    公开(公告)日:2021-01-05

    申请号:US16366496

    申请日:2019-03-27

    Abstract: Technologies for flexible I/O protocol acceleration include a computing device having a root complex, a smart endpoint coupled to the root complex, and an offload complex coupled to the smart endpoint. The smart endpoint receives an I/O transaction that originates from the root complex and parses the I/O transaction based on an I/O protocol and identifies an I/O command. The smart endpoint may parse the I/O transaction based on endpoint firmware that may be programmed by the computing device. The smart endpoint accelerates the I/O command and provides a smart context to the offload complex. The smart endpoint may copy the I/O command to memory of the smart endpoint or the offload complex. The smart endpoint may identify protocol data based on the I/O command and copy the protocol data to the memory of the smart endpoint or the offload complex. Other embodiments are described and claimed.

Patent Agency Ranking