Inspection System Using 193nm Laser
    17.
    发明申请

    公开(公告)号:US20170229829A1

    公开(公告)日:2017-08-10

    申请号:US15495162

    申请日:2017-04-24

    Abstract: Laser and inspection systems that generate laser output light at sub-200 nm wavelengths using fundamental light at approximately 1064 nm. A second harmonic generator module generates second harmonic light directed to both an optical parametric (OP) module, which generates down-converted signal (idler light), and to a fifth harmonic generator module, which generates fifth harmonic light. The OP module includes an optical parametric oscillator that is configured to generate the idler signal at approximately 0.5 times the fundamental frequency. The idler light and fifth harmonic light are then mixed by a frequency mixing module to generate the laser output light having an output frequency equal to approximately 5.5 times the fundamental frequency.

    Back-Illuminated Sensor With Boron Layer
    20.
    发明申请
    Back-Illuminated Sensor With Boron Layer 有权
    背光照明传感器与硼层

    公开(公告)号:US20160290932A1

    公开(公告)日:2016-10-06

    申请号:US15182200

    申请日:2016-06-14

    Abstract: An inspection system including an optical system (optics) to direct light from an illumination source to a sample, and to direct light reflected/scattered from the sample to one or more image sensors. At least one image sensor of the system is formed on a semiconductor membrane including an epitaxial layer having opposing surfaces, with circuit elements formed on one surface of the epitaxial layer, and a pure boron layer on the other surface of the epitaxial layer. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor. The image sensor can be included in an electron-bombarded image sensor and/or in an inspection system.

    Abstract translation: 一种检查系统,包括用于将来自照明源的光引导到样品的光学系统(光学器件),以及将从样品反射/散射的光引导到一个或多个图像传感器。 系统的至少一个图像传感器形成在包括具有相对表面的外延层的半导体膜上,形成在外延层的一个表面上的电路元件和在外延层的另一个表面上的纯硼层。 图像传感器可以使用CCD(电荷耦合器件)或CMOS(互补金属氧化物半导体)技术来制造。 图像传感器可以是二维区域传感器或一维阵列传感器。 图像传感器可以包括在电子轰击的图像传感器和/或检查系统中。

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