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公开(公告)号：US07944026B2
公开(公告)日：2011-05-17
申请号：US11962142
申请日：2007-12-21
IPC分类号： H01L29/40
CPC分类号： H01L23/66 , H01L23/647 , H01L2223/6638 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H01L2924/00
摘要： A semiconductor device is mounted on a package substrate which has a power supply line and a signal line formed of a normal or predetermined resistance material layer on a dielectric layer. A resistance material layer has a high resistance as compared with the normal resistance material layer and is additionally provided on the surface of the normal resistance material layer of the peripheral face of the signal line closest to the power supply line.
摘要翻译： 半导体器件安装在封装衬底上，该封装衬底具有电源线和由介电层上的正常或预定电阻材料层形成的信号线。 电阻材料层与普通电阻材料层相比具有高电阻，并且附加地设置在最靠近电源线的信号线的外围面的正常电阻材料层的表面上。
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公开(公告)号：US20070287289A1
公开(公告)日：2007-12-13
申请号：US11760969
申请日：2007-06-11
申请人： Toshio Haba , Hitoshi Suzuki , Naohito Satou , Haruo Akahoshi , Hiroshi Yoshida , Akira Chinda
发明人： Toshio Haba , Hitoshi Suzuki , Naohito Satou , Haruo Akahoshi , Hiroshi Yoshida , Akira Chinda
IPC分类号： H01L21/44
CPC分类号： H01L21/2885 , C25D3/38 , C25D5/022 , C25D5/34 , H05K3/108 , H05K3/241 , H05K3/4007 , H05K2201/0367 , H05K2203/0392
摘要： [Problem to be Solved] An object of the present invention is to provide a method of forming a conductive pattern having an excellent uniformity of film thickness within the surface of a substrate independently of the density of the pattern. [Solution] The production method of a conductive pattern in accordance with the present invention comprises the step of electroplating for forming a conductive pattern by electroplating on a metal seed layer formed on an insulated substrate using a plating bath containing an accelerator for reducing the deposition overpotential of a plated metal.
摘要翻译： [待解决的问题]本发明的目的在于提供一种形成与图案的密度无关地在基板的表面内具有优异的膜厚均匀性的导电图案的方法。 [解决方案]根据本发明的导电图案的制造方法包括通过使用包含用于降低沉积超电势的促进剂的电镀液通过电镀在形成在绝缘基板上的金属种子层上形成导电图案的电镀步骤 的镀金属。
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13.发明授权Catalyst material and method of manufacturing the same and fuel cell using the same 有权催化剂材料及其制造方法及使用其的燃料电池公开(公告)号：US07226690B2
公开(公告)日：2007-06-05
申请号：US11076954
申请日：2005-03-11
CPC分类号： H01M4/923 , B01J21/18 , B01J23/40 , B01J31/1633 , B01J31/226 , B01J35/0013 , B01J35/006 , B01J37/343 , B01J2531/821 , B01J2531/828 , H01M4/925 , H01M8/04186 , H01M8/1004 , H01M8/1009 , Y02P70/56
摘要： To use a catalyst material, which has a functional group that covalently binds to a catalyst metal particle on the surface of a catalyst carrier, and a catalyst metal particle that covalently binds to the functional group, for a fuel cell.
摘要翻译： 为了使用具有与催化剂载体表面上的催化剂金属颗粒共价结合的官能团的催化剂材料和与燃料电池共价结合的催化剂金属颗粒。
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14.发明授权High dielectric constant composite material and multilayer wiring board using the same 失效高介电常数复合材料及使用其的多层布线板公开(公告)号：US07220481B2
公开(公告)日：2007-05-22
申请号：US10062562
申请日：2002-02-05
申请人： Yuichi Satsu , Akio Takahashi , Tadashi Fujieda , Takumi Ueno , Haruo Akahoshi
发明人： Yuichi Satsu , Akio Takahashi , Tadashi Fujieda , Takumi Ueno , Haruo Akahoshi
CPC分类号： H05K1/162 , H01L23/145 , H01L23/49894 , H01L23/642 , H01L23/66 , H01L2924/0002 , H05K2201/0209 , H05K2201/0215 , H05K2201/0218 , Y10T428/249921 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/26 , Y10T428/269 , Y10T428/2982 , Y10T428/2991 , Y10T428/2998 , Y10T428/31 , H01L2924/00
摘要： A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.
摘要翻译： 通过将含有金属的无机填料的亚微米颗粒作为必要组分进行绝缘处理如化学处理获得的高介电复合材料，进一步进行表面处理以提高其与有机树脂的相容性，然后分散在 有机树脂的介电常数为15以上，在100MHz〜80GHz的频率范围内的介电损耗角正切为0.1以下，因此能够有效地用于多层布线基板和模块基板。
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公开(公告)号：US20060163725A1
公开(公告)日：2006-07-27
申请号：US11205175
申请日：2005-08-17
申请人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
发明人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
CPC分类号： H05K3/241 , H01L21/4846 , H01L23/49838 , H01L2924/0002 , H01L2924/09701 , H05K3/108 , H05K3/382 , H05K3/388 , H01L2924/00
摘要： It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film.
摘要翻译： 本发明的目的是提供一种具有受控形状的高密度布线而不用抗蚀剂膜掩蔽的布线板及其制造方法。 在本发明中，在绝缘基板上具有铜布线的布线基板的制造方法包括以下步骤：在绝缘基板上形成金属籽晶层，金属种子层的粗糙化部分在铜布线或 形成凸起，并且通过电镀在具有粗糙形状的金属种子层的部分上形成铜或铜的合金的电镀膜。 在镀浴中加入抑制电镀反应的物质，在绝缘性基材的表面与电镀膜的一侧之间形成90度以下的角度。
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16.发明申请公开(公告)号：US20050244621A1
公开(公告)日：2005-11-03
申请号：US11117505
申请日：2005-04-29
申请人： Kunio Arai , Haruo Akahoshi
发明人： Kunio Arai , Haruo Akahoshi
CPC分类号： H05K3/4679 , H05K1/0269 , H05K3/0008 , H05K3/0035 , H05K3/0038 , H05K3/06 , H05K3/062 , H05K3/421 , H05K3/427 , H05K3/429 , H05K3/4652 , H05K2201/0112 , H05K2201/09845 , H05K2201/09918 , H05K2203/0315 , H05K2203/0346 , H05K2203/0554 , Y10T428/24917
摘要： The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.
摘要翻译： 本发明提供一种印刷电路板，其中能够使加工质量均匀的印刷电路板的封装密度的提高和生产成本的降低，印刷电路板的处理方法和制造方法 印刷电路板。 提供了一种印刷电路板，其包括导电层和电绝缘层的交替叠层，其中在第一个的前表面上设置有能够吸收激光但不溶于溶解导电层的蚀刻溶液的涂层 的导电层。 在这种情况下，涂层可以设置在后导体层的前表面上。 每个导电体层可以包含Cu作为主要成分，而涂层可以包含CuO作为主要成分。 涂层可以具有不小于0.6μm的厚度。
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17.发明申请公开(公告)号：US20050205297A1
公开(公告)日：2005-09-22
申请号：US11142399
申请日：2005-06-02
申请人： Tokihito Suwa , Haruo Akahoshi , Shingo Kumamoto
发明人： Tokihito Suwa , Haruo Akahoshi , Shingo Kumamoto
CPC分类号： H05K3/44 , H05K1/115 , H05K3/4641 , H05K2201/0338 , H05K2201/068 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09627 , H05K2201/09663
摘要： A multilayer circuit board including a laminate of at least one insulating layer and at least one wiring layer. The wiring layer is formed by a composite member having a first metal layer and a second metal layer formed on one or both sides of the first metal layer. The first metal layer having a smaller coefficient of thermal expansion than the second metal layer. The second metal layer having a higher electric conductivity than the first metal layer. The insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer. A layer-to-layer interconnection portion is provided on the surface of the insulating layer and in the blind via-hole and is formed in the blind via-hole to be in contact with the surface of the second metal layer.
摘要翻译： 包括至少一个绝缘层和至少一个布线层的叠层的多层电路板。 布线层由具有形成在第一金属层的一侧或两侧上的第一金属层和第二金属层的复合构件形成。 第一金属层的热膨胀系数小于第二金属层。 第二金属层的导电率比第一金属层高。 绝缘层具有通过第二金属层的表面设置的底部的盲通孔。 在绝缘层的表面和盲通孔中设置层间互连部，并且形成在盲通孔中，与第二金属层的表面接触。
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18.发明申请Catalyst material and method of manufacturing the same and fuel cell using the same 有权催化剂材料及其制造方法及使用其的燃料电池公开(公告)号：US20050158611A1
公开(公告)日：2005-07-21
申请号：US11076954
申请日：2005-03-11
IPC分类号： B01J31/28 , B01J21/18 , B01J23/40 , B01J31/16 , B01J31/22 , B01J35/00 , B01J37/34 , H01M4/88 , H01M4/90 , H01M4/92 , H01M4/96 , H01M8/04 , H01M8/10 , H01M4/86
CPC分类号： H01M4/923 , B01J21/18 , B01J23/40 , B01J31/1633 , B01J31/226 , B01J35/0013 , B01J35/006 , B01J37/343 , B01J2531/821 , B01J2531/828 , H01M4/925 , H01M8/04186 , H01M8/1004 , H01M8/1009 , Y02P70/56
摘要： To use a catalyst material, which has a functional group that covalently binds to a catalyst metal particle on the surface of a catalyst carrier, and a catalyst metal particle that covalently binds to the functional group, for a fuel cell.
摘要翻译： 为了使用具有与催化剂载体表面上的催化剂金属颗粒共价结合的官能团的催化剂材料和与该官能团共价结合的催化剂金属颗粒，使用燃料电池。
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19.发明申请公开(公告)号：US20050042366A1
公开(公告)日：2005-02-24
申请号：US10959073
申请日：2004-10-07
申请人： Takeyuki Itabashi , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
发明人： Takeyuki Itabashi , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
摘要： A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of an electroless copper plating solution with chosen additives or “admixtures” containing at least on of mandelonitrile and triethyltetramine plus eriochrome block T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline
摘要翻译： 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用含有至少含有扁桃腈和三乙基四胺加色团块T的选择的添加剂或“混合物”的化学镀铜溶液以及至少一种2,2'-联吡啶，1,10-菲咯啉和 2,9-二甲基-1,10-菲咯啉
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公开(公告)号：US20050031926A1
公开(公告)日：2005-02-10
申请号：US10912089
申请日：2004-08-06
IPC分类号： B01J31/28 , B01J21/18 , B01J23/40 , B01J31/16 , B01J31/22 , B01J35/00 , B01J37/34 , H01M4/88 , H01M4/90 , H01M4/92 , H01M4/96 , H01M8/04 , H01M8/10 , H01M4/86
CPC分类号： H01M4/923 , B01J21/18 , B01J23/40 , B01J31/1633 , B01J31/226 , B01J35/0013 , B01J35/006 , B01J37/343 , B01J2531/821 , B01J2531/828 , H01M4/925 , H01M8/04186 , H01M8/1004 , H01M8/1009 , Y02P70/56
摘要： To use a catalyst material, which has a functional group that covalently binds to a catalyst metal particle on the surface of a catalyst carrier, and a catalyst metal particle that covalently binds to the functional group, for a fuel cell.
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