公开(公告)号：US07038904B2

公开(公告)日：2006-05-02

申请号：US10968725

申请日：2004-10-18

申请人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

发明人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

IPC分类号： H01G9/04 ,  H01G4/005 ,  H01G4/06

CPC分类号： H01L23/552 ,  H01G4/228 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/09609 ,  H05K2201/10674 ,  H05K2203/0733

摘要： A capacitor formed of parallel wiring lines and a capacitor dielectric film positioned between adjacent wiring lines and in direct contact with each of said wiring lines. A method of producing such a capacitor is also disclosed.

摘要翻译： 由平行布线形成的电容器和位于相邻布线之间并与每个所述布线直接接触的电容器电介质膜。 还公开了一种制造这种电容器的方法。

公开(公告)号：US20050088800A1

公开(公告)日：2005-04-28

申请号：US10968725

申请日：2004-10-18

申请人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

发明人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

IPC分类号： H01G2/06 ,  H01G4/005 ,  H01G4/01 ,  H01G4/228 ,  H01G4/33 ,  H01G13/00 ,  H01L21/822 ,  H01L23/12 ,  H01L23/498 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01L27/04 ,  H05K1/11 ,  H05K1/16

CPC分类号： H01L23/552 ,  H01G4/228 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/09609 ,  H05K2201/10674 ,  H05K2203/0733

摘要： A capacitor formed of parallel wiring lines and a capacitor dielectric film positioned between adjacent wiring lines and in direct contact with each of said wiring lines. A method of producing such a capacitor is also disclosed.

摘要翻译： 由平行布线形成的电容器和位于相邻布线之间并与每个所述布线直接接触的电容器电介质膜。 还公开了一种制造这种电容器的方法。

公开(公告)号：US20070040238A1

公开(公告)日：2007-02-22

申请号：US11463172

申请日：2006-08-08

申请人： Tomoo Yamasaki ,  Yasuyoshi Horikawa

发明人： Tomoo Yamasaki ,  Yasuyoshi Horikawa

IPC分类号： H01L29/00

CPC分类号： H01F17/0033 ,  H01F17/02 ,  H01F27/40 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/00

摘要： A chip coil has a chip format including a rectangle substrate of an insulating resin material and a coil portion having a solenoid structure a part of which is embedded within the substrate and in which adjacent coils are insulated from each other by the substrate. The resin material contains a magnetic filler. The chip coil has a thickness of 50 μm or less.

摘要翻译： 芯片线圈具有包括绝缘树脂材料的矩形基板和线圈部分的线圈部分，该线圈部分具有螺线管结构，其一部分嵌入在基板内，并且相邻线圈彼此被基板绝缘。 树脂材料含有磁性填料。 芯片线圈的厚度为50μm以下。

公开(公告)号：US08708713B2

公开(公告)日：2014-04-29

申请号：US13285139

申请日：2011-10-31

申请人： Yasuyoshi Horikawa

发明人： Yasuyoshi Horikawa

IPC分类号： H01R12/00

摘要： A connecting terminal structure includes a plurality of connecting terminals, each including a connecting part to be in contact with an object to be connected at an end of the connecting terminal and a plate-like fixing part at another end of the connecting terminal, a first face of the plate-like fixing part being configured to be electrically connectable; and electronic components, each including at least two electrode terminals, wherein the two electrode terminals of the electronic components are mounted on faces opposite to the first faces of the fixing parts of the connecting terminals.

公开(公告)号：US20070119616A1

公开(公告)日：2007-05-31

申请号：US11605316

申请日：2006-11-29

申请人： Yasuyoshi Horikawa ,  Tomoo Yamasaki

发明人： Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC分类号： H05K1/00

CPC分类号： H05K1/16 ,  H01L21/485 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/029 ,  H05K1/0292 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4644

摘要： A mounting substrate for mounting a semiconductor chip, having a plurality of passive elements which are connected to the semiconductor chip and are formed to be mutually electrically-independent, and a wiring part including a plurality of via plugs respectively independently connected to the plurality of passive elements and pattern wiring connected to the via plugs, wherein the wiring part is constructed so that a state of connection between the semiconductor chip and the plurality of passive elements can be changed by changing the pattern wiring.

摘要翻译： 一种用于安装半导体芯片的安装基板，具有连接到半导体芯片并被形成为彼此电独立的多个无源元件，以及包括分别独立地连接到多个被动的多个通孔插头的布线部分 元件和图案布线连接到通孔插头，其中布线部分被构造成使得可以通过改变图案布线来改变半导体芯片与多个无源元件之间的连接状态。

公开(公告)号：US07072168B2

公开(公告)日：2006-07-04

申请号：US10889312

申请日：2004-07-13

申请人： Yasuyoshi Horikawa ,  Tomoo Yamasaki ,  Kiyoshi Ooi

发明人： Yasuyoshi Horikawa ,  Tomoo Yamasaki ,  Kiyoshi Ooi

IPC分类号： H01G4/005

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/0425 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/50 ,  H01L2221/68345 ,  H01L2224/05001 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/162 ,  H05K3/205 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09763 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/417 ,  Y10T29/43 ,  H01L2924/00014

摘要： A capacitor device of the present invention includes a substrate, a float electrode formed on the substrate, a valve metal film formed on the float electrode, a dielectric film formed on the valve metal film by applying an anodic oxidation to a part of the valve metal film, and a pair of electrodes provided in areas overlapping with two different parts of the float electrode on the dielectric film respectively.

摘要翻译： 本发明的电容器装置包括基板，形成在基板上的浮动电极，形成在浮动电极上的阀金属膜，通过对阀金属的一部分施加阳极氧化而形成在阀金属膜上的电介质膜 膜和一对电极，其分别设置在与电极上的浮动电极的两个不同部分重叠的区域中。

公开(公告)号：US20060040424A1

公开(公告)日：2006-02-23

申请号：US11257263

申请日：2005-10-24

申请人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Akio Rokugawa

发明人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Akio Rokugawa

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/562 ,  H01L24/81 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate body on the base and the electronic component; removing a portion of the base which portion corresponds to the electronic component, thereby exposing the temporary fixing member; and removing the temporary fixing member, thereby enabling the electronic component to make an external connection.

摘要翻译： 一种制造半导体器件基板的方法包括以下步骤：在基座上布置用于临时固定电子部件的临时固定部件; 通过临时固定构件将电子部件临时固定在基座上; 在基座和电子部件上形成基板主体; 移除所述基座的对应于所述电子部件的部分，从而露出所述临时固定部件; 并且移除临时固定构件，从而使得电子部件能够进行外部连接。

公开(公告)号：US08708711B2

公开(公告)日：2014-04-29

申请号：US13433841

申请日：2012-03-29

申请人： Yasuyoshi Horikawa

发明人： Yasuyoshi Horikawa

IPC分类号： H01R12/00

CPC分类号： H01R12/52 ,  H01R12/57 ,  H01R12/714 ,  H01R12/716 ,  H01R13/2442 ,  H05K7/1069

摘要： A connecting terminal structure includes a supporting body; a plurality of first electrode pads provided on a first side of the supporting body; a plurality of second electrode pads provided on a second side of the supporting body; a flexible substrate configured to electrically connect the first electrode pads to the second electrode pads; and a plurality of connecting terminals joined to at least one of the first electrode pads and the second electrode pads.

摘要翻译： 连接端子结构包括支撑体; 设置在所述支撑体的第一侧上的多个第一电极焊盘; 设置在所述支撑体的第二侧上的多个第二电极焊盘; 柔性基板，被配置为将所述第一电极焊盘电连接到所述第二电极焊盘; 以及连接到第一电极焊盘和第二电极焊盘中的至少一个的多个连接端子。

公开(公告)号：US20120021625A1

公开(公告)日：2012-01-26

申请号：US13183975

申请日：2011-07-15

申请人： Yasuyoshi Horikawa ,  Yoshihiro Ihara ,  Kenji Mochizuki ,  Masato Tanaka

发明人： Yasuyoshi Horikawa ,  Yoshihiro Ihara ,  Kenji Mochizuki ,  Masato Tanaka

IPC分类号： H01R12/71 ,  H01R43/16

CPC分类号： H01R12/716 ,  H01R13/2442 ,  H05K3/301 ,  H05K3/3436 ,  H05K7/1069 ,  H05K2201/10325 ,  H05K2201/10393 ,  Y10T29/49147

摘要： A socket detachably connects a connecting item to a substrate via connecting terminals. The socket includes a support member with first and second surfaces to fix the connecting terminals, and penetrating holes formed in the support member. Each connecting terminal includes first and second connecting parts formed on opposite ends thereof. Each connecting terminal is inserted into a corresponding penetrating hole in a state in which the first connecting part is fixed to the first surface and the second connecting part projects from the second surface of the support member.

摘要翻译： 插座通过连接端子可拆卸地连接到基板。 插座包括具有第一和第二表面以固定连接端子的支撑构件和形成在支撑构件中的穿透孔。 每个连接端子包括形成在其相对端上的第一和第二连接部分。 每个连接端子在第一连接部分固定到第一表面并且第二连接部分从支撑部件的第二表面突出的状态下插入到相应的通孔中。

公开(公告)号：US20050277282A1

公开(公告)日：2005-12-15

申请号：US11135350

申请日：2005-05-24

申请人： Yasuyoshi Horikawa ,  Keiichi Takemoto

发明人： Yasuyoshi Horikawa ,  Keiichi Takemoto

IPC分类号： H05K3/40 ,  H01L29/40

CPC分类号： H05K3/4046 ,  H05K2201/0347 ,  H05K2201/10242 ,  H05K2201/10416

摘要： A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserting a conductive parts in the through hole, a step of curing the semi-resin layer or the thermo plastic resin layer in a state that the resin layer is made to flow by applying a thermal press to the substrate and filling a clearance between the through hole and the conductive parts with the resin layer, and a step of forming a wiring pattern, which is connected mutually via the conductive parts, on both surface sides of the substrate.

摘要翻译： 本发明的布线基板的制造方法包括：准备含有半固化树脂层或热塑性树脂层的基板的步骤，形成贯通基板的通孔的工序， 通孔中的导电部分，在通过向基板施加热压力使树脂层流动的状态下固化半树脂层或热塑性树脂层的步骤，并填充通孔之间的间隙 和具有树脂层的导电部件，以及在基板的两个表面侧上形成经由导电部件相互连接的布线图案的步骤。