公开(公告)号：US07072168B2

公开(公告)日：2006-07-04

申请号：US10889312

申请日：2004-07-13

申请人： Yasuyoshi Horikawa ,  Tomoo Yamasaki ,  Kiyoshi Ooi

发明人： Yasuyoshi Horikawa ,  Tomoo Yamasaki ,  Kiyoshi Ooi

IPC分类号： H01G4/005

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/0425 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/50 ,  H01L2221/68345 ,  H01L2224/05001 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/162 ,  H05K3/205 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09763 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/417 ,  Y10T29/43 ,  H01L2924/00014

摘要： A capacitor device of the present invention includes a substrate, a float electrode formed on the substrate, a valve metal film formed on the float electrode, a dielectric film formed on the valve metal film by applying an anodic oxidation to a part of the valve metal film, and a pair of electrodes provided in areas overlapping with two different parts of the float electrode on the dielectric film respectively.

摘要翻译： 本发明的电容器装置包括基板，形成在基板上的浮动电极，形成在浮动电极上的阀金属膜，通过对阀金属的一部分施加阳极氧化而形成在阀金属膜上的电介质膜 膜和一对电极，其分别设置在与电极上的浮动电极的两个不同部分重叠的区域中。

公开(公告)号：US20050130368A1

公开(公告)日：2005-06-16

申请号：US11048556

申请日：2005-02-01

申请人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

发明人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC分类号： H01L23/12 ,  H01G4/224 ,  H01L21/68 ,  H01L23/50 ,  H01L23/64 ,  H05K1/16 ,  H01L51/40 ,  H01L21/44 ,  H01L21/8242

CPC分类号： H01G4/224 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/642 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/0162 ,  H05K2201/09763 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2224/05166

摘要： A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.

摘要翻译： 电容器包括由夹在一对电极之间的电介质膜和由有机聚硅烷膜形成的支撑体形成的电容器部分。 支撑体设置成在其上支撑电容器部分。

公开(公告)号：US06897544B2

公开(公告)日：2005-05-24

申请号：US10692836

申请日：2003-10-24

申请人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

发明人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC分类号： H01L23/12 ,  H01G4/224 ,  H01L21/68 ,  H01L23/50 ,  H01L23/64 ,  H05K1/16 ,  H01L27/108 ,  H01L29/00 ,  H01L29/76 ,  H01L29/94 ,  H01L31/119

CPC分类号： H01G4/224 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/642 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/0162 ,  H05K2201/09763 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2224/05166

摘要： A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.

公开(公告)号：US20050013088A1

公开(公告)日：2005-01-20

申请号：US10889312

申请日：2004-07-13

申请人： Yasuyoshi Horikawa ,  Tomoo Yamasaki ,  Kiyoshi Ooi

发明人： Yasuyoshi Horikawa ,  Tomoo Yamasaki ,  Kiyoshi Ooi

IPC分类号： H01G4/33 ,  H01G9/012 ,  H01G9/02 ,  H01G9/042 ,  H01L21/3205 ,  H01L21/68 ,  H01L21/822 ,  H01L23/498 ,  H01L23/50 ,  H01L23/52 ,  H01L27/04 ,  H05K1/11 ,  H05K1/16 ,  H05K3/20

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/0425 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/50 ,  H01L2221/68345 ,  H01L2224/05001 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/162 ,  H05K3/205 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09763 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/417 ,  Y10T29/43 ,  H01L2924/00014

摘要： A capacitor device of the present invention includes a substrate, a float electrode formed on the substrate, a valve metal film formed on the float electrode, a dielectric film formed on the valve metal film by applying an anodic oxidation to a part of the valve metal film, and a pair of electrodes provided in areas overlapping with two different parts of the float electrode on the dielectric film respectively.

摘要翻译： 本发明的电容器装置包括基板，形成在基板上的浮动电极，形成在浮动电极上的阀金属膜，通过对阀金属的一部分施加阳极氧化而形成在阀金属膜上的电介质膜 膜和一对电极，其分别设置在与电极上的浮动电极的两个不同部分重叠的区域中。

公开(公告)号：US07223652B2

公开(公告)日：2007-05-29

申请号：US11048556

申请日：2005-02-01

申请人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

发明人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC分类号： H01L21/338 ,  H01L51/40 ,  H01L21/8244 ,  H01L21/8242

CPC分类号： H01G4/224 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/642 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/0162 ,  H05K2201/09763 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2224/05166

摘要： A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.

摘要翻译： 电容器包括由夹在一对电极之间的电介质膜和由有机聚硅烷膜形成的支撑体形成的电容器部分。 支撑体设置成在其上支撑电容器部分。

公开(公告)号：US07038904B2

公开(公告)日：2006-05-02

申请号：US10968725

申请日：2004-10-18

申请人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

发明人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

IPC分类号： H01G9/04 ,  H01G4/005 ,  H01G4/06

CPC分类号： H01L23/552 ,  H01G4/228 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/09609 ,  H05K2201/10674 ,  H05K2203/0733

摘要： A capacitor formed of parallel wiring lines and a capacitor dielectric film positioned between adjacent wiring lines and in direct contact with each of said wiring lines. A method of producing such a capacitor is also disclosed.

摘要翻译： 由平行布线形成的电容器和位于相邻布线之间并与每个所述布线直接接触的电容器电介质膜。 还公开了一种制造这种电容器的方法。

公开(公告)号：US20050088800A1

公开(公告)日：2005-04-28

申请号：US10968725

申请日：2004-10-18

申请人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

发明人： Kiyoshi Ooi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki ,  Yasuyoshi Horikawa

IPC分类号： H01G2/06 ,  H01G4/005 ,  H01G4/01 ,  H01G4/228 ,  H01G4/33 ,  H01G13/00 ,  H01L21/822 ,  H01L23/12 ,  H01L23/498 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01L27/04 ,  H05K1/11 ,  H05K1/16

CPC分类号： H01L23/552 ,  H01G4/228 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/09609 ,  H05K2201/10674 ,  H05K2203/0733

摘要： A capacitor formed of parallel wiring lines and a capacitor dielectric film positioned between adjacent wiring lines and in direct contact with each of said wiring lines. A method of producing such a capacitor is also disclosed.

摘要翻译： 由平行布线形成的电容器和位于相邻布线之间并与每个所述布线直接接触的电容器电介质膜。 还公开了一种制造这种电容器的方法。

公开(公告)号：US20070040238A1

公开(公告)日：2007-02-22

申请号：US11463172

申请日：2006-08-08

申请人： Tomoo Yamasaki ,  Yasuyoshi Horikawa

发明人： Tomoo Yamasaki ,  Yasuyoshi Horikawa

IPC分类号： H01L29/00

CPC分类号： H01F17/0033 ,  H01F17/02 ,  H01F27/40 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/00

摘要： A chip coil has a chip format including a rectangle substrate of an insulating resin material and a coil portion having a solenoid structure a part of which is embedded within the substrate and in which adjacent coils are insulated from each other by the substrate. The resin material contains a magnetic filler. The chip coil has a thickness of 50 μm or less.

摘要翻译： 芯片线圈具有包括绝缘树脂材料的矩形基板和线圈部分的线圈部分，该线圈部分具有螺线管结构，其一部分嵌入在基板内，并且相邻线圈彼此被基板绝缘。 树脂材料含有磁性填料。 芯片线圈的厚度为50μm以下。

公开(公告)号：US20070119616A1

公开(公告)日：2007-05-31

申请号：US11605316

申请日：2006-11-29

申请人： Yasuyoshi Horikawa ,  Tomoo Yamasaki

发明人： Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC分类号： H05K1/00

CPC分类号： H05K1/16 ,  H01L21/485 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/029 ,  H05K1/0292 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4644

摘要： A mounting substrate for mounting a semiconductor chip, having a plurality of passive elements which are connected to the semiconductor chip and are formed to be mutually electrically-independent, and a wiring part including a plurality of via plugs respectively independently connected to the plurality of passive elements and pattern wiring connected to the via plugs, wherein the wiring part is constructed so that a state of connection between the semiconductor chip and the plurality of passive elements can be changed by changing the pattern wiring.

摘要翻译： 一种用于安装半导体芯片的安装基板，具有连接到半导体芯片并被形成为彼此电独立的多个无源元件，以及包括分别独立地连接到多个被动的多个通孔插头的布线部分 元件和图案布线连接到通孔插头，其中布线部分被构造成使得可以通过改变图案布线来改变半导体芯片与多个无源元件之间的连接状态。

公开(公告)号：US20060040424A1

公开(公告)日：2006-02-23

申请号：US11257263

申请日：2005-10-24

申请人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Akio Rokugawa

发明人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Akio Rokugawa

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/562 ,  H01L24/81 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate body on the base and the electronic component; removing a portion of the base which portion corresponds to the electronic component, thereby exposing the temporary fixing member; and removing the temporary fixing member, thereby enabling the electronic component to make an external connection.

摘要翻译： 一种制造半导体器件基板的方法包括以下步骤：在基座上布置用于临时固定电子部件的临时固定部件; 通过临时固定构件将电子部件临时固定在基座上; 在基座和电子部件上形成基板主体; 移除所述基座的对应于所述电子部件的部分，从而露出所述临时固定部件; 并且移除临时固定构件，从而使得电子部件能够进行外部连接。