Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method
    15.
    发明授权
    Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method 失效
    修复电路连接部分的方法,以及通过该方法修复电路的电路端子的结构和方法

    公开(公告)号:US06818086B2

    公开(公告)日:2004-11-16

    申请号:US10276179

    申请日:2002-11-14

    IPC分类号: B32B3500

    摘要: The present invention is to provide a method for removing adhesive in a short time without requiring any solvent, a repair of which has conventionally been required for a long time, and there is provided a method for repairing a circuit connection part where circuit members having a large number of opposed circuits are connected electrically through an adhesive, wherein mutual joints at a circuit connection part requiring repair are separated, a basic material for transfer is bonded through a transfer adhesive for transfer to at least one circuit member where the adhesive remains and then the adhesive remaining on the circuit member and the transfer adhesive are removed from the circuit member along with the basic material for transfer.

    摘要翻译: 本发明提供一种在短时间内除去粘合剂的方法,而不需要任何长期以往需要修复的任何溶剂,并且提供了一种修复电路连接部分的方法,其中电路部件具有 大量的相对电路通过粘合剂电连接,其中需要修复的电路连接部分处的相互接合被分开,用于转移的基本材料通过转移粘合剂结合以转移到至少一个留下粘合剂的电路构件,然后 残留在电路构件上的粘合剂和转移粘合剂与转移用基材一起从电路构件中除去。

    Circuit connecting method
    16.
    发明授权
    Circuit connecting method 有权
    电路连接方式

    公开(公告)号:US08132319B2

    公开(公告)日:2012-03-13

    申请号:US12740801

    申请日:2008-02-06

    IPC分类号: H05K3/30

    摘要: The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.

    摘要翻译: 本发明提供一种电路连接方法,其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。 电路连接方法包括制备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤,制备柔性布线基板14的步骤,该柔性布线基板14具有形成在基座14a上的电路电极14b,并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分,以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤,使得部分各向异性 用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14b。

    FILMY ADHESIVE FOR CIRCUIT CONNECTION
    17.
    发明申请
    FILMY ADHESIVE FOR CIRCUIT CONNECTION 审中-公开
    电胶连接胶片

    公开(公告)号:US20100140556A1

    公开(公告)日:2010-06-10

    申请号:US12664530

    申请日:2007-06-13

    IPC分类号: H01B1/12

    摘要: A filmy adhesive for circuit connection that is interposed between circuit electrodes opposed to each other and by heating and applying pressure to the circuit electrodes opposed to each other, attains electrical connection between the electrodes along the direction of pressure application, characterized in that the angle of contact of the adhesive after hardening with water is 90° or greater.

    摘要翻译: 用于电路连接的胶粘剂,其插入在彼此相对的电路电极之间并且通过对彼此相对的电路电极进行加热和施加压力而实现沿着压力施加方向的电极之间的电连接,其特征在于, 硬化后的粘合剂与水接触90°以上。

    CIRCUIT CONNECTING METHOD
    18.
    发明申请
    CIRCUIT CONNECTING METHOD 有权
    电路连接方法

    公开(公告)号:US20100263208A1

    公开(公告)日:2010-10-21

    申请号:US12740801

    申请日:2008-02-06

    IPC分类号: H05K3/36

    摘要: The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.

    摘要翻译: 本发明提供一种电路连接方法,其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。 电路连接方法包括制备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤,制备柔性布线基板14的步骤,该柔性布线基板14具有形成在基座14a上的电路电极14b,并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分,以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤,使得部分各向异性 用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14b。