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公开(公告)号：US20170244015A1
公开(公告)日：2017-08-24
申请号：US15591112
申请日：2017-05-10
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Hiroto TAMAKI
IPC: H01L33/62 , H01L33/60 , H01L33/28 , H01L33/32 , H01L33/30 , H05K1/18 , H01L33/50 , H05K1/03 , H05K1/11 , H05K1/09 , H05K1/02 , H01L33/64 , H01L33/56
CPC classification number: H01L33/62 , H01L25/167 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/0002 , H01L2924/181 , H05K1/0274 , H05K1/0298 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/282 , H05K2201/0209 , H05K2201/0326 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer, an internal conductive layer, a lower conductive layer, vias, and a covering layer. The upper conductive layer is disposed on an upper surface of the uppermost ceramic layer. The internal conductive layer is interposed between the ceramic layers. The lower conductive layer is disposed on a lower surface of the lowermost ceramic layer. The vias connect the upper conductive layer, the internal conductive layer, and the lower connective layer. The covering layer covers a portion of the upper conductive layer. The upper conductive layer includes a covered region covered with the covering layer and an element mount region. An upper surface of the element mount region is higher than an upper surface of the covered portion.
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公开(公告)号：US20170069801A1
公开(公告)日：2017-03-09
申请号：US15257994
申请日：2016-09-07
Applicant: NICHIA CORPORATION
Inventor： Yuta OKA , Hiroto TAMAKI
CPC classification number: H01L33/486 , H01L33/502 , H01L33/54 , H01L33/60
Abstract: A light emitting device has; a light emitting element, a light reflecting member that is disposed so as to cover the lateral surfaces of the light emitting element and expose a top surface of the light emitting element, a frame that is disposed on the light reflecting member so as to surround an outer periphery of the top surface of the light emitting element, a light transmissive member that is disposed inside the frame, and a sealing member that covers the light reflecting member, the frame and the light transmissive member, and that has a flange covering part of the frame.
Abstract translation: 发光装置具有： 发光元件，被配置为覆盖发光元件的侧面并露出发光元件的顶面的光反射部件，配置在光反射部件上的框架， 发光元件的上表面的外周，设置在框架内的透光构件和覆盖光反射构件，框架和透光构件的密封构件，并且具有凸缘覆盖部分 框架。
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公开(公告)号：US20170054062A1
公开(公告)日：2017-02-23
申请号：US15241076
申请日：2016-08-19
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI
CPC classification number: H01L33/56 , H01L33/48 , H01L33/502 , H01L33/507 , H01L33/62 , H01L2224/16245 , H01L2224/97 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: A method of manufacturing a light emitting device includes: providing on a mounting substrate a soluble member which is soluble in a solvent and which has a lower surface, an upper surface opposite to the lower surface in a height direction, and an outer side surface provided between the lower surface and the upper surface, the lower surface contacting the mounting substrate; providing a light blocking member made of resin to cover the outer side surface of the soluble member so that an inner side wall of the light blocking member contacts the outer side surface of the soluble member; removing the soluble member using the solvent to provide a recess surrounded by the inner side wall of the light blocking member; and mounting a light emitting element in the recess.
Abstract translation: 一种制造发光器件的方法包括：在安装基板上提供可溶于溶剂的可溶性构件，其具有下表面，在高度方向上与下表面相对的上表面和设置在外表面的外侧表面 在下表面和上表面之间，下表面接触安装基板; 提供由树脂制成的遮光构件以覆盖可溶构件的外侧表面，使得遮光构件的内侧壁接触可溶构件的外侧表面; 使用溶剂除去可溶性构件以提供被遮光构件的内侧壁包围的凹部; 以及将发光元件安装在所述凹部中。
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公开(公告)号：US20170040498A1
公开(公告)日：2017-02-09
申请号：US15296519
申请日：2016-10-18
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L33/486 , H01L24/97 , H01L33/50 , H01L33/507 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/16225
Abstract: A light emitting device has a base body equipped with a base material and a pair of connection terminals disposed from a first main face to a second main face that is on the opposite side from the first main face; a plurality of light emitting elements connected to the connection terminals on the first main face; and a light reflecting member that covers the side faces of the light emitting elements, the base material having a protruding component on the second main face, the protruding component being one of a heat releasing terminal, a reinforcement terminal, and an insulating film, and the connection terminals being disposed on the first main face from the second main face on both sides of the protruding component, and being partly exposed from the light reflecting member on both sides of the first main face.
Abstract translation: 发光装置具有配置有基材的基体和从第一主面到与第一主面相反的一侧的第二主面配置的一对连接端子， 连接到第一主面上的连接端子的多个发光元件; 以及覆盖发光元件的侧面的光反射部件，所述基材在所述第二主面上具有突出部件，所述突出部件是放热端子，加强端子和绝缘膜之一，以及 所述连接端子从所述突出部件的两侧的所述第二主面设置在所述第一主面上，并且在所述第一主面的两侧部分地从所述光反射部件露出。
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公开(公告)号：US20160093781A1
公开(公告)日：2016-03-31
申请号：US14867222
申请日：2015-09-28
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L24/97 , H01L33/486 , H01L33/505 , H01L33/56 , H01L2224/16225 , H01L2224/48091 , H01L2933/0041 , H01L2924/00014
Abstract: A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.
Abstract translation: 一种制造发光器件的方法包括：制备包括具有通孔的光反射片的透光构件和由包含颜色转换材料的透光树脂构成的颜色转换材料层， 在通孔中准备发光元件，将颜色转换材料层固定到发光元件，用光反射构件覆盖发光元件的侧表面，并且切割光反射元件和发光元件， 反光片。
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Patent Agency Ranking
公开(公告)号：US20150340547A1
公开(公告)日：2015-11-26
申请号：US14716627
申请日：2015-05-19
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI
CPC classification number: H01L33/504 , H01L33/502 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73253 , H01L2924/16195 , H01L2933/0041 , H01L2924/00014
Abstract: A method for manufacturing a light emitting device has: forming a first phosphor layer including a first phosphor that is based on KSF or quantum dots on a light emitting element by a method other than spraying, and forming a second phosphor layer including a second phosphor that is different from the first phosphor on the first phosphor layer by spraying.
Abstract translation: 制造发光器件的方法具有：通过除喷涂之外的方法在发光元件上形成基于KSF或量子点的第一荧光体的第一荧光体层，以及形成包括第二荧光体的第二荧光体层， 与第一荧光体层上的第一荧光体不同。
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公开(公告)号：US20150129923A1
公开(公告)日：2015-05-14
申请号：US14603148
申请日：2015-01-22
Applicant: NICHIA CORPORATION
Inventor： Masato FUJITOMO , Hiroto TAMAKI , Shinji NISHIJIMA , Yuichiro TANDA , Tomohide MIKI
IPC: H01L33/62 , H01L31/0203 , H01L33/52 , H01L31/02
CPC classification number: H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。
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18.发明申请公开(公告)号：US20140191278A1
公开(公告)日：2014-07-10
申请号：US14152712
申请日：2014-01-10
Applicant: NICHIA CORPORATION
Inventor： Shinji NISHIJIMA , Tomohide MIKI , Hiroto TAMAKI
CPC classification number: H05K5/0091 , H01L33/486 , H01L33/52 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01322 , H01L2924/181 , H01L2924/18301 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.
Abstract translation: 一种发光器件包括形成由底表面和侧壁限定的凹部的基体，其上表面露出在凹部中并且其下表面形成外表面的导电构件，设置在凹部中的突出部分， 安装在所述凹部中并电连接到所述导电构件的发光元件，以及设置在所述凹部中以覆盖所述发光元件的密封构件。 基体具有由树脂一体形成的底部部分和侧壁部分，侧壁部分的内表面是限定凹部的侧壁，并且具有弯曲部分，并且突出部分靠近 曲面。 通过这种布置，可以获得光提取效率和可靠性优异的薄型和小型发光装置。
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公开(公告)号：US20130249127A1
公开(公告)日：2013-09-26
申请号：US13893924
申请日：2013-05-14
Applicant: Nichia Corporation
Inventor： Masaki HAYASHI , Hiroto TAMAKI , Masafumi KURAMOTO , Tomohide MIKI , Takayuki SANO , Tomohisa KISHIMOTO
IPC: B29D11/00
CPC classification number: B29C45/02 , B29C45/2806 , B29D11/0074 , B29K2063/00 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/181 , Y10T428/31511 , H01L2924/00012
Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.
Abstract translation: 发光装置在模制部件上包括发光元件。 模制部件通过模制和固化热固性环氧树脂组合物而形成，该热固性环氧树脂组合物包含（A）三嗪衍生的环氧树脂与酸酐的反应产物，（B）具有m.p。的内分离剂。 50-90℃，（C）反射剂，（D）无机填料和（E）固化催化剂。
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公开(公告)号：US20200176652A1
公开(公告)日：2020-06-04
申请号：US16784387
申请日：2020-02-07
Applicant: NICHIA CORPORATION
Inventor： Suguru BEPPU , Yoichi BANDO , Hiroto TAMAKI , Takuya NAKABAYASHI
IPC: H01L33/60 , H01L33/50 , H01L21/3213
Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.
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