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公开(公告)号：US20170339781A1
公开(公告)日：2017-11-23
申请号：US15597686
申请日：2017-05-17
Applicant: Nitto Denko Corporation
Inventor： Daisuke YAMAUCHI , Hiroyuki TANABE
CPC classification number: H05K1/0216 , G11B5/4853 , G11B5/486 , H05K1/0224 , H05K1/0245 , H05K1/0281 , H05K1/05 , H05K1/056 , H05K1/09 , H05K1/11 , H05K1/189 , H05K3/4644 , H05K2201/09036
Abstract: A first insulating layer is formed on a support substrate. The first insulating layer includes a first portion and a second portion. The second portion has a thickness smaller than that of the first portion. A ground layer having electric conductivity higher than that of the support substrate is formed on the second portion of the first insulating layer. The ground layer is electrically connected to the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer. A write wiring trace is formed on the second insulating layer to overlap with the first portion and the second portion of the first insulating layer.
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公开(公告)号：US20170171969A1
公开(公告)日：2017-06-15
申请号：US15373573
申请日：2016-12-09
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki TANABE , Naohiro TERADA , Yuu SUGIMOTO , Daisuke YAMAUCHI
CPC classification number: H05K1/05 , G11B5/4826 , G11B5/484 , G11B5/4853 , H05K1/0278 , H05K1/0393 , H05K1/11 , H05K1/18 , H05K3/4007 , H05K3/44 , H05K2201/10227
Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.
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公开(公告)号：US20160270229A1
公开(公告)日：2016-09-15
申请号：US15059850
申请日：2016-03-03
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki TANABE , Yuu SUGIMOTO , Yoshito FUJIMURA
CPC classification number: G11B5/4833 , G11B5/484 , G11B5/4853 , H05K1/056 , H05K1/184
Abstract: A suspension board with circuit Includes a first layer made of a metal supporting board, a second layer having insulating properties and provided at one side in a thickness direction of the first layer, and a third layer provided at one side in the thickness direction of the second layer and made of copper or a copper alloy. The first layer includes a first opening portion passing through in the thickness direction. The first opening portion is provided with a conductor layer that is, when projected in a direction orthogonal to the thickness direction, overlapped with the first layer. The conductor layer includes a first conductor circuit having a first electronic component-connecting terminal for being electrically connected to a first electronic component and made of copper or a copper alloy. The third layer includes a second conductor circuit having a second electronic component-connecting terminal for being electrically connected to a second electronic component.
Abstract translation: 具有电路的悬挂板包括由金属支撑板制成的第一层，具有绝缘性质的第二层，并且设置在第一层的厚度方向的一侧，以及设置在第一层的厚度方向的一侧的第三层 第二层由铜或铜合金制成。 第一层包括在厚度方向上穿过的第一开口部。 第一开口部设置有当与厚度方向正交的方向投影时与第一层重叠的导体层。 导体层包括具有第一电子元件连接端子的第一导体电路，用于电连接到第一电子元件并由铜或铜合金制成。 第三层包括具有电连接到第二电子部件的第二电子部件连接端子的第二导体电路。
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公开(公告)号：US20160239055A1
公开(公告)日：2016-08-18
申请号：US15040199
申请日：2016-02-10
Applicant: NITTO DENKO CORPORATION
Inventor： Naohiro TERADA , Saori KANEZAKI , Hiroyuki TANABE , Yoshito FUJIMURA
CPC classification number: G11B5/4853 , G06F1/184 , G11B5/4826 , G11B5/4873 , H05K1/056 , H05K3/305 , Y02P70/613
Abstract: A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.
Abstract translation: 具有电路的悬挂板包括一对基座。 一个基座的基座导电层具有风扇部分和连续部分。 另一基座的基座导电层至少具有风扇部。 当另一个基座的基座导电层仅具有风扇部分时，基座支撑层设置成在每个基座中在厚度方向上与风扇部分重叠，并且不与连续部分重叠 在一个基座中，并且当另一个基座的基座导电层具有连续部分时，基座支撑层设置成与连续部分重叠或者设置成与风扇部分重叠，并且不会 与每个基座中的连续部分重叠。
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公开(公告)号：US20160111115A1
公开(公告)日：2016-04-21
申请号：US14878319
申请日：2015-10-08
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshito FUJIMURA , Hiroyuki TANABE , Saori KANEZAKI , Naohiro TERADA , Yuu SUGIMOTO
IPC: G11B5/48
CPC classification number: G11B5/4853 , G11B5/4826 , G11B5/484
Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.
Abstract translation: 具有电路的悬挂板包括金属支撑层，在其一个厚度方向上的绝缘基底层，设置在绝缘基底层上的导电图案，设置在绝缘基底层上以覆盖导电性的绝缘覆盖层 图案，以及用于支撑包括薄基座部分的滑块的基座。 薄基座部分包括基底绝缘层中包括的基座基层，包括在基座基层上的导电图案中的基座导电层，以及包括在绝缘覆盖层中并设置在基座导电 层。 导电图案包括放置成在具有较窄部分的绝缘基底层上延伸的第一线，并且基座导电层的尺寸为较窄部分的尺寸的0.5至3倍。
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Patent Agency Ranking
公开(公告)号：US20150245472A1
公开(公告)日：2015-08-27
申请号：US14619508
申请日：2015-02-11
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki TANABE
CPC classification number: H05K1/0266 , G11B5/484 , G11B5/4853 , G11B2005/0021 , H05K1/0269 , H05K1/056 , H05K3/244 , Y10T29/49128
Abstract: A wired circuit board includes a first insulating layer, a first conductive layer provided over the first insulating film and including a first wire, a second insulating layer provided over the first insulating layer so as to cover the first wire, and a second conductive layer provided over the second insulating layer and including a second wire. The second conductive layer includes a first terminal portion for electrically connecting the first wire to an outside, a second terminal portion for electrically connecting the second wire to an outside, and a connection portion electrically connecting the first terminal portion and the first wire.
Abstract translation: 布线电路板包括：第一绝缘层，设置在第一绝缘膜上并包括第一布线的第一导电层，设置在第一绝缘层上以覆盖第一布线的第二绝缘层;以及第二导电层， 并且包括第二导线。 第二导电层包括用于将第一线电连接到外部的第一端子部分，用于将第二线缆电连接到外部的第二端子部分和将第一端子部分和第一线路电连接的连接部分。
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公开(公告)号：US20130157200A1
公开(公告)日：2013-06-20
申请号：US13763232
申请日：2013-02-08
Applicant: Nitto Denko Corporation
Inventor： Yasushi TAMURA , Ryouji SUEZAKI , Tetsuya OHSAWA , Hiroyuki TANABE , Hitoki KANAGAWA
IPC: G03F7/20
CPC classification number: G03F7/2022 , G03F1/144 , G03F1/70 , G11B5/4846 , H05K1/056 , H05K3/0023 , H05K3/28 , H05K2201/0191 , H05K2203/0505 , H05K2203/0588 , Y10T29/49155 , Y10T29/49156
Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
Abstract translation: 具有电路的悬挂板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的绝缘覆盖层， 以及插入到E块中的插入部。 插入部中的绝缘覆盖层的厚度比除了插入部以外的部分的绝缘覆盖层的厚度大。
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公开(公告)号：US20190394882A1
公开(公告)日：2019-12-26
申请号：US16479071
申请日：2018-01-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE
Abstract: The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.
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公开(公告)号：US20180209058A1
公开(公告)日：2018-07-26
申请号：US15876603
申请日：2018-01-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE
CPC classification number: C25D5/02 , C25D3/48 , C25D5/022 , C25D5/10 , C25D5/36 , C25D5/50 , C25D7/00 , H05K1/05 , H05K1/053 , H05K1/056 , H05K3/188 , H05K3/243 , H05K3/4644 , H05K2203/1476
Abstract: A method for producing a wired circuit board including a stainless steel supporting layer having a stainless steel terminal includes a first step of preparing the stainless steel supporting layer having a passive film formed on the surface thereof and a second step of forming a first gold plating layer on the surface of the stainless steel terminal. In the second step, the stainless steel supporting layer is immersed in a first gold plating solution containing a weak acid and a gold compound without containing a strong acid, and electricity is supplied to the stainless steel supporting layer so that the passive film is removed and the first gold plating layer is formed on the surface of the stainless steel terminal.
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公开(公告)号：US20180007795A1
公开(公告)日：2018-01-04
申请号：US15628059
申请日：2017-06-20
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE , Yoshito FUJIMURA
Abstract: A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.
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