Method for Producing an Assembly Emitting Electromagnetic Radiation, and Assembly Emitting Electromagnetic Radiation
    11.
    发明申请
    Method for Producing an Assembly Emitting Electromagnetic Radiation, and Assembly Emitting Electromagnetic Radiation 有权
    组装发射电磁辐射和装配发射电磁辐射的方法

    公开(公告)号:US20160043271A1

    公开(公告)日:2016-02-11

    申请号:US14780470

    申请日:2014-03-19

    Abstract: In various exemplary embodiments, a method is provided for producing an assembly emitting electromagnetic radiation. In this case, a component composite structure is provided which has components emitting electromagnetic radiation, which components are coupled to one another physically in the component composite structure. In each case at least one component-individual property is imparted to the components. Depending on the determined properties of the components, a structure mask for covering the components in the component composite structure is formed, wherein the structure mask has structure mask cutouts corresponding to the components, which structure mask cutouts are formed in component-individual fashion depending on the properties of the corresponding components. The structure mask cutouts provide phosphor regions, which are exposed in the structure mask cutouts, on the components. Phosphor layers are formed on the phosphor regions of the components.

    Abstract translation: 在各种示例性实施例中,提供了一种用于产生发射电磁辐射的组件的方法。 在这种情况下,提供了一种组件复合结构,其具有发射电磁辐射的部件,该组件在组件复合结构中物理上彼此耦合。 在每种情况下,赋予组分至少一种组分 - 个体性质。 根据组件的确定性质,形成用于覆盖组件复合结构中的部件的结构掩模,其中结构掩模具有对应于部件的结构掩模切口,其结构掩模切口以组件个别方式形成,取决于 相应组件的属性。 结构掩模切口提供暴露在结构掩模切口中的荧光体区域上的部件。 在这些部件的荧光体区域上形成荧光体层。

    Optoelectronic semiconductor component
    12.
    发明授权
    Optoelectronic semiconductor component 有权
    光电半导体元件

    公开(公告)号:US09159890B2

    公开(公告)日:2015-10-13

    申请号:US14181104

    申请日:2014-02-14

    Abstract: An optoelectronic semiconductor component includes one or more light-emitting diode chips. The light-emitting diode chip has a main radiation side. A diaphragm is arranged downstream of the main radiation side along a main radiation direction of the light-emitting diode chip. The diaphragm is mounted on or in a component housing. The main radiation side has a mean edge length of at least 50 μm. The diaphragm can be switched from light-impervious to light-pervious. The diaphragm comprises precisely one opening region for radiation transmission. The semiconductor component can be used as a flashlight for a mobile image recording device.

    Abstract translation: 光电子半导体部件包括一个或多个发光二极管芯片。 发光二极管芯片具有主辐射侧。 沿着发光二极管芯片的主辐射方向在主辐射侧的下游配置隔膜。 隔膜安装在组件外壳上或组件外壳中。 主辐射侧具有至少50μm的平均边缘长度。 隔膜可以从不透光到透光的切换。 隔膜包括精确的一个用于辐射传输的开口区域。 半导体元件可以用作移动图像记录装置的手电筒。

    Method for Producing a Multifunctional Layer, Electrophoresis Substrate, Converter Plate and Optoelectronic Component
    15.
    发明申请
    Method for Producing a Multifunctional Layer, Electrophoresis Substrate, Converter Plate and Optoelectronic Component 审中-公开
    生产多功能层,电泳基板,转换板和光电元件的方法

    公开(公告)号:US20160273736A1

    公开(公告)日:2016-09-22

    申请号:US15035384

    申请日:2014-11-14

    Abstract: A method for producing a multifunctional layer, a method for producing an electrophoresis substrate, and a method for producing a converter plate and an optoelectronic component are disclosed. In an embodiment the method includes providing an electrophoresis substrate comprising a carrier having a front side and a back side, wherein a first electrically conductive layer and a second electrically conductive layer are located on the front side, electrophoretically depositing a first material onto the first electrically conductive layer, electrophoretically depositing a second material onto the second electrically conductive layer and arranging a filler material between the first material and the second material, wherein the filler material forms a common boundary surface with the first material and the second material.

    Abstract translation: 公开了多功能层的制造方法,电泳基板的制造方法以及转换器板和光电子部件的制造方法。 在一个实施方案中,该方法包括提供包括具有前侧和后侧的载体的电泳基片,其中第一导电层和第二导电层位于前侧,将第一材料电泳沉积到第一电 导电层,将第二材料电泳沉积到第二导电层上并在第一材料和第二材料之间布置填充材料,其中填充材料与第一材料和第二材料形成共同的边界面。

    Method for Producing an Electronic Device and Electronic Device

    公开(公告)号:US20200152822A1

    公开(公告)日:2020-05-14

    申请号:US16087646

    申请日:2017-03-22

    Abstract: A method for producing an electronic device and an electronic device are disclosed. In an embodiment a method for producing an electronic device includes attaching semiconductor chips on a carrier, applying a fluoropolymer to main surfaces of the semiconductor chips facing away from the carrier and a main surface of the carrier facing the semiconductor chip thereby forming an encapsulation layer including a fluoropolymer, structuring the encapsulation layer thereby forming cavities in the encapsulation layer and applying a metal layer in the cavities.

Patent Agency Ranking